SE9500944L - Kylsystem för elektronik - Google Patents
Kylsystem för elektronikInfo
- Publication number
- SE9500944L SE9500944L SE9500944A SE9500944A SE9500944L SE 9500944 L SE9500944 L SE 9500944L SE 9500944 A SE9500944 A SE 9500944A SE 9500944 A SE9500944 A SE 9500944A SE 9500944 L SE9500944 L SE 9500944L
- Authority
- SE
- Sweden
- Prior art keywords
- pipe conduit
- pct
- heat
- evaporator
- condenser
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 239000003507 refrigerant Substances 0.000 abstract 4
- 239000007788 liquid Substances 0.000 abstract 1
- 238000005086 pumping Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9500944A SE503322C2 (sv) | 1995-03-17 | 1995-03-17 | Kylsystem för elektronik |
EP96907829A EP0815403A1 (en) | 1995-03-17 | 1996-03-08 | Cooling system for electronics |
AU51294/96A AU5129496A (en) | 1995-03-17 | 1996-03-08 | Cooling system for electronics |
CA002215501A CA2215501A1 (en) | 1995-03-17 | 1996-03-08 | Cooling system for electronics |
JP8528326A JPH11502300A (ja) | 1995-03-17 | 1996-03-08 | エレクトロニクス用の冷却系統 |
PCT/SE1996/000307 WO1996029553A1 (en) | 1995-03-17 | 1996-03-08 | Cooling system for electronics |
US08/913,444 US5966957A (en) | 1995-03-17 | 1996-03-08 | Cooling system for electronics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9500944A SE503322C2 (sv) | 1995-03-17 | 1995-03-17 | Kylsystem för elektronik |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9500944D0 SE9500944D0 (sv) | 1995-03-17 |
SE9500944L true SE9500944L (sv) | 1996-05-28 |
SE503322C2 SE503322C2 (sv) | 1996-05-28 |
Family
ID=20397573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9500944A SE503322C2 (sv) | 1995-03-17 | 1995-03-17 | Kylsystem för elektronik |
Country Status (7)
Country | Link |
---|---|
US (1) | US5966957A (sv) |
EP (1) | EP0815403A1 (sv) |
JP (1) | JPH11502300A (sv) |
AU (1) | AU5129496A (sv) |
CA (1) | CA2215501A1 (sv) |
SE (1) | SE503322C2 (sv) |
WO (1) | WO1996029553A1 (sv) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6167721B1 (en) * | 1998-07-14 | 2001-01-02 | Borst, Inc. | Electrochemical hydrogen pump and uses thereof for heat exchange applications |
US6330153B1 (en) | 1999-01-14 | 2001-12-11 | Nokia Telecommunications Oy | Method and system for efficiently removing heat generated from an electronic device |
US6237353B1 (en) * | 1999-07-29 | 2001-05-29 | Carrier Corporation | System for removing parasitic losses in a refrigeration unit |
JP3964580B2 (ja) | 1999-09-03 | 2007-08-22 | 富士通株式会社 | 冷却ユニット |
US6883337B2 (en) * | 2000-06-02 | 2005-04-26 | University Of Florida Research Foundation, Inc. | Thermal management device |
US6598409B2 (en) | 2000-06-02 | 2003-07-29 | University Of Florida | Thermal management device |
US7251889B2 (en) * | 2000-06-30 | 2007-08-07 | Swales & Associates, Inc. | Manufacture of a heat transfer system |
US8047268B1 (en) | 2002-10-02 | 2011-11-01 | Alliant Techsystems Inc. | Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems |
US7931072B1 (en) | 2002-10-02 | 2011-04-26 | Alliant Techsystems Inc. | High heat flux evaporator, heat transfer systems |
US8109325B2 (en) * | 2000-06-30 | 2012-02-07 | Alliant Techsystems Inc. | Heat transfer system |
US7708053B2 (en) * | 2000-06-30 | 2010-05-04 | Alliant Techsystems Inc. | Heat transfer system |
US8136580B2 (en) * | 2000-06-30 | 2012-03-20 | Alliant Techsystems Inc. | Evaporator for a heat transfer system |
US7549461B2 (en) | 2000-06-30 | 2009-06-23 | Alliant Techsystems Inc. | Thermal management system |
US7004240B1 (en) * | 2002-06-24 | 2006-02-28 | Swales & Associates, Inc. | Heat transport system |
US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
JPWO2002046677A1 (ja) * | 2000-12-04 | 2004-04-08 | 富士通株式会社 | 冷却システムおよび吸熱装置 |
US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
US6615912B2 (en) | 2001-06-20 | 2003-09-09 | Thermal Corp. | Porous vapor valve for improved loop thermosiphon performance |
WO2003016795A1 (en) * | 2001-08-14 | 2003-02-27 | Global Cooling Bv | Condenser, evaporator, and cooling device |
JP2003214750A (ja) * | 2002-01-23 | 2003-07-30 | Twinbird Corp | サーモサイフォン |
CA2473792C (en) * | 2002-01-29 | 2010-11-30 | Telefonaktiebolaget L M Ericsson (Publ) | A method and system of cooling a cabinet using dynamically controlled ciculating cooling fluid |
US6760221B2 (en) * | 2002-10-23 | 2004-07-06 | International Business Machines Corporation | Evaporator with air cooling backup |
US20040190253A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
US20050039888A1 (en) * | 2003-08-21 | 2005-02-24 | Pfahnl Andreas C. | Two-phase cooling apparatus and method for automatic test equipment |
US7013956B2 (en) * | 2003-09-02 | 2006-03-21 | Thermal Corp. | Heat pipe evaporator with porous valve |
US7508672B2 (en) * | 2003-09-10 | 2009-03-24 | Qnx Cooling Systems Inc. | Cooling system |
US7086247B2 (en) * | 2004-08-31 | 2006-08-08 | International Business Machines Corporation | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack |
US20060130517A1 (en) * | 2004-12-22 | 2006-06-22 | Hussmann Corporation | Microchannnel evaporator assembly |
TWI274839B (en) * | 2004-12-31 | 2007-03-01 | Foxconn Tech Co Ltd | Pulsating heat conveyance apparatus |
US7661464B2 (en) * | 2005-12-09 | 2010-02-16 | Alliant Techsystems Inc. | Evaporator for use in a heat transfer system |
US7352580B2 (en) * | 2006-02-14 | 2008-04-01 | Hua-Hsin Tsai | CPU cooler |
DE102008025951B4 (de) * | 2008-05-30 | 2010-10-28 | Airbus Deutschland Gmbh | Kühlen einer elektronischen Einrichtung in einem Luftfahrzeug durch eine fallweise einphasige oder zweiphasige Kühlung |
US20100065257A1 (en) * | 2008-09-12 | 2010-03-18 | National Taipei University Technology | Refrigerant cooling system for an electronic apparatus and the method thereof |
JP5471119B2 (ja) * | 2009-07-24 | 2014-04-16 | 富士通株式会社 | ループ型ヒートパイプ、電子装置 |
US8432691B2 (en) * | 2010-10-28 | 2013-04-30 | Asetek A/S | Liquid cooling system for an electronic system |
WO2012153361A1 (ja) * | 2011-05-06 | 2012-11-15 | 三菱電機株式会社 | 熱交換器及びそれを備えた冷凍サイクル装置 |
EP2706317B1 (en) * | 2011-05-06 | 2018-06-20 | Mitsubishi Electric Corporation | Heat exchanger and refrigeration cycle device provided therewith |
US9500413B1 (en) | 2012-06-14 | 2016-11-22 | Google Inc. | Thermosiphon systems with nested tubes |
US9869519B2 (en) | 2012-07-12 | 2018-01-16 | Google Inc. | Thermosiphon systems for electronic devices |
EP2703763A1 (en) | 2012-09-03 | 2014-03-05 | ABB Technology AG | Evaporator with integrated pre-heater for power electronics cooling |
US20150181756A1 (en) * | 2012-09-05 | 2015-06-25 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device, electric automobile and electronic device equipped with said cooling device |
JP2014116385A (ja) * | 2012-12-07 | 2014-06-26 | Panasonic Corp | 冷却装置およびこれを搭載した電気自動車および電子機器 |
US9463536B2 (en) | 2013-12-20 | 2016-10-11 | Google Inc. | Manufacturing process for thermosiphon heat exchanger |
CN104465560A (zh) * | 2014-11-21 | 2015-03-25 | 广西智通节能环保科技有限公司 | 一种电子器件用循环液体冷却系统 |
WO2019229491A1 (en) * | 2018-05-26 | 2019-12-05 | Pratik Sharma | Cooling system for electronic devices |
US11716831B2 (en) | 2019-04-22 | 2023-08-01 | Mitsubishi Electric Corporation | Electronic device |
US11874022B1 (en) | 2020-09-10 | 2024-01-16 | Hamfop Technologies LLC | Heat-activated multiphase fluid-operated pump for geothermal temperature control of structures |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609991A (en) * | 1969-10-13 | 1971-10-05 | Ibm | Cooling system having thermally induced circulation |
JPS5929985A (ja) * | 1982-08-11 | 1984-02-17 | Hitachi Ltd | 定圧型沸騰冷却装置 |
GB2156505B (en) * | 1984-03-07 | 1989-01-05 | Furukawa Electric Co Ltd | Heat exchanger |
DE3422039A1 (de) * | 1984-06-14 | 1985-12-19 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | Siedekuehlung, insbesondere zur kuehlung von stromrichtern der leistungselektronik |
US4611654A (en) * | 1985-01-23 | 1986-09-16 | Buchsel Christian K E | Passive system for heat transfer |
JP2534668B2 (ja) * | 1986-05-13 | 1996-09-18 | バブコツク日立株式会社 | 熱交換装置 |
JP2859927B2 (ja) * | 1990-05-16 | 1999-02-24 | 株式会社東芝 | 冷却装置および温度制御装置 |
-
1995
- 1995-03-17 SE SE9500944A patent/SE503322C2/sv not_active IP Right Cessation
-
1996
- 1996-03-08 EP EP96907829A patent/EP0815403A1/en not_active Ceased
- 1996-03-08 US US08/913,444 patent/US5966957A/en not_active Expired - Lifetime
- 1996-03-08 WO PCT/SE1996/000307 patent/WO1996029553A1/en not_active Application Discontinuation
- 1996-03-08 JP JP8528326A patent/JPH11502300A/ja active Pending
- 1996-03-08 CA CA002215501A patent/CA2215501A1/en not_active Abandoned
- 1996-03-08 AU AU51294/96A patent/AU5129496A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU5129496A (en) | 1996-10-08 |
WO1996029553A1 (en) | 1996-09-26 |
SE9500944D0 (sv) | 1995-03-17 |
JPH11502300A (ja) | 1999-02-23 |
CA2215501A1 (en) | 1996-09-26 |
US5966957A (en) | 1999-10-19 |
EP0815403A1 (en) | 1998-01-07 |
SE503322C2 (sv) | 1996-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |
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