WO2019229491A1 - Cooling system for electronic devices - Google Patents

Cooling system for electronic devices Download PDF

Info

Publication number
WO2019229491A1
WO2019229491A1 PCT/IB2018/053762 IB2018053762W WO2019229491A1 WO 2019229491 A1 WO2019229491 A1 WO 2019229491A1 IB 2018053762 W IB2018053762 W IB 2018053762W WO 2019229491 A1 WO2019229491 A1 WO 2019229491A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
working fluid
condenser
transferred
cooling system
Prior art date
Application number
PCT/IB2018/053762
Other languages
French (fr)
Inventor
Pratik Sharma
Original Assignee
Pratik Sharma
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pratik Sharma filed Critical Pratik Sharma
Priority to PCT/IB2018/053762 priority Critical patent/WO2019229491A1/en
Publication of WO2019229491A1 publication Critical patent/WO2019229491A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • the cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser.
  • the thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid.
  • the vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Here the cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled.

Description

Cooling System For Rack Mounted Electronic Devices
In this invention we provide a cooling system for rack mounted electronic devices. The cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled.

Claims

Claims Following is the claim for this invention: -
1 . In this invention we provide a cooling system for rack mounted electronic devices.
The cooling system includes a thermosiphon system that includes a condenser, an evaporator, a regulator coupled with the evaporator and a conduit between the evaporator and the condenser. The thermosiphon system is thermally coupled to the electronic device mounted on the rack such that heat generated by the device is transferred to the working fluid in the evaporator, vaporising the working fluid. The vaporised working fluid is then transferred to the condenser through the conduit, where it releases the transferred heat and condenses to liquid, available for further reuse by the evaporator to maintain a certain level of the working fluid. Also there is a regulator coupled with the evaporator to maintain a fixed level of the working fluid based on the power supply for the rack mounted electronic device to which the thermosiphon system is thermally coupled. The above novel technique by which we provide a cooling system for rack mounted electronic devices is the claim for this invention.
PCT/IB2018/053762 2018-05-26 2018-05-26 Cooling system for electronic devices WO2019229491A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/IB2018/053762 WO2019229491A1 (en) 2018-05-26 2018-05-26 Cooling system for electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2018/053762 WO2019229491A1 (en) 2018-05-26 2018-05-26 Cooling system for electronic devices

Publications (1)

Publication Number Publication Date
WO2019229491A1 true WO2019229491A1 (en) 2019-12-05

Family

ID=68697882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2018/053762 WO2019229491A1 (en) 2018-05-26 2018-05-26 Cooling system for electronic devices

Country Status (1)

Country Link
WO (1) WO2019229491A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966957A (en) * 1995-03-17 1999-10-19 Telefonaktiebolaget Lm Ericsson Cooling system for electronics
WO2017127059A1 (en) * 2016-01-20 2017-07-27 Hewlett Packard Enterprise Development Lp Directional coolant control

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966957A (en) * 1995-03-17 1999-10-19 Telefonaktiebolaget Lm Ericsson Cooling system for electronics
WO2017127059A1 (en) * 2016-01-20 2017-07-27 Hewlett Packard Enterprise Development Lp Directional coolant control

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