SE9500944D0 - Kylsystem för elektronik - Google Patents

Kylsystem för elektronik

Info

Publication number
SE9500944D0
SE9500944D0 SE9500944A SE9500944A SE9500944D0 SE 9500944 D0 SE9500944 D0 SE 9500944D0 SE 9500944 A SE9500944 A SE 9500944A SE 9500944 A SE9500944 A SE 9500944A SE 9500944 D0 SE9500944 D0 SE 9500944D0
Authority
SE
Sweden
Prior art keywords
pipe conduit
pct
heat
evaporator
condenser
Prior art date
Application number
SE9500944A
Other languages
English (en)
Other versions
SE503322C2 (sv
SE9500944L (sv
Inventor
Aake Maelhammar
Bjoern E Palm
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9500944A priority Critical patent/SE9500944L/sv
Publication of SE9500944D0 publication Critical patent/SE9500944D0/sv
Priority to JP8528326A priority patent/JPH11502300A/ja
Priority to US08/913,444 priority patent/US5966957A/en
Priority to PCT/SE1996/000307 priority patent/WO1996029553A1/en
Priority to AU51294/96A priority patent/AU5129496A/en
Priority to EP96907829A priority patent/EP0815403A1/en
Priority to CA002215501A priority patent/CA2215501A1/en
Publication of SE503322C2 publication Critical patent/SE503322C2/sv
Publication of SE9500944L publication Critical patent/SE9500944L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE9500944A 1995-03-17 1995-03-17 Kylsystem för elektronik SE9500944L (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE9500944A SE9500944L (sv) 1995-03-17 1995-03-17 Kylsystem för elektronik
JP8528326A JPH11502300A (ja) 1995-03-17 1996-03-08 エレクトロニクス用の冷却系統
US08/913,444 US5966957A (en) 1995-03-17 1996-03-08 Cooling system for electronics
PCT/SE1996/000307 WO1996029553A1 (en) 1995-03-17 1996-03-08 Cooling system for electronics
AU51294/96A AU5129496A (en) 1995-03-17 1996-03-08 Cooling system for electronics
EP96907829A EP0815403A1 (en) 1995-03-17 1996-03-08 Cooling system for electronics
CA002215501A CA2215501A1 (en) 1995-03-17 1996-03-08 Cooling system for electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9500944A SE9500944L (sv) 1995-03-17 1995-03-17 Kylsystem för elektronik

Publications (3)

Publication Number Publication Date
SE9500944D0 true SE9500944D0 (sv) 1995-03-17
SE503322C2 SE503322C2 (sv) 1996-05-28
SE9500944L SE9500944L (sv) 1996-05-28

Family

ID=20397573

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9500944A SE9500944L (sv) 1995-03-17 1995-03-17 Kylsystem för elektronik

Country Status (7)

Country Link
US (1) US5966957A (sv)
EP (1) EP0815403A1 (sv)
JP (1) JPH11502300A (sv)
AU (1) AU5129496A (sv)
CA (1) CA2215501A1 (sv)
SE (1) SE9500944L (sv)
WO (1) WO1996029553A1 (sv)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6167721B1 (en) * 1998-07-14 2001-01-02 Borst, Inc. Electrochemical hydrogen pump and uses thereof for heat exchange applications
US6330153B1 (en) 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
US6237353B1 (en) * 1999-07-29 2001-05-29 Carrier Corporation System for removing parasitic losses in a refrigeration unit
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
US6883337B2 (en) * 2000-06-02 2005-04-26 University Of Florida Research Foundation, Inc. Thermal management device
US6598409B2 (en) 2000-06-02 2003-07-29 University Of Florida Thermal management device
US8136580B2 (en) * 2000-06-30 2012-03-20 Alliant Techsystems Inc. Evaporator for a heat transfer system
US7708053B2 (en) * 2000-06-30 2010-05-04 Alliant Techsystems Inc. Heat transfer system
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US8109325B2 (en) * 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US7251889B2 (en) * 2000-06-30 2007-08-07 Swales & Associates, Inc. Manufacture of a heat transfer system
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US7004240B1 (en) * 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
US7549461B2 (en) 2000-06-30 2009-06-23 Alliant Techsystems Inc. Thermal management system
US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
JPWO2002046677A1 (ja) * 2000-12-04 2004-04-08 富士通株式会社 冷却システムおよび吸熱装置
US6397618B1 (en) * 2001-05-30 2002-06-04 International Business Machines Corporation Cooling system with auxiliary thermal buffer unit for cooling an electronics module
US6615912B2 (en) 2001-06-20 2003-09-09 Thermal Corp. Porous vapor valve for improved loop thermosiphon performance
CN100464135C (zh) * 2001-08-14 2009-02-25 环球冷却有限公司 冷凝器和包括该冷凝器的冷却装置
JP2003214750A (ja) * 2002-01-23 2003-07-30 Twinbird Corp サーモサイフォン
US7061763B2 (en) 2002-01-29 2006-06-13 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
US20040190253A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Channeled heat sink and chassis with integrated heat rejector for two-phase cooling
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
US7086247B2 (en) * 2004-08-31 2006-08-08 International Business Machines Corporation Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
US20060130517A1 (en) * 2004-12-22 2006-06-22 Hussmann Corporation Microchannnel evaporator assembly
TWI274839B (en) * 2004-12-31 2007-03-01 Foxconn Tech Co Ltd Pulsating heat conveyance apparatus
US7661464B2 (en) * 2005-12-09 2010-02-16 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
US7352580B2 (en) * 2006-02-14 2008-04-01 Hua-Hsin Tsai CPU cooler
DE102008025951B4 (de) * 2008-05-30 2010-10-28 Airbus Deutschland Gmbh Kühlen einer elektronischen Einrichtung in einem Luftfahrzeug durch eine fallweise einphasige oder zweiphasige Kühlung
US20100065257A1 (en) * 2008-09-12 2010-03-18 National Taipei University Technology Refrigerant cooling system for an electronic apparatus and the method thereof
JP5471119B2 (ja) * 2009-07-24 2014-04-16 富士通株式会社 ループ型ヒートパイプ、電子装置
US8432691B2 (en) * 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
EP2706317B1 (en) * 2011-05-06 2018-06-20 Mitsubishi Electric Corporation Heat exchanger and refrigeration cycle device provided therewith
CN103502763A (zh) * 2011-05-06 2014-01-08 三菱电机株式会社 热交换器及具有该热交换器的制冷循环装置
US9500413B1 (en) 2012-06-14 2016-11-22 Google Inc. Thermosiphon systems with nested tubes
US9869519B2 (en) 2012-07-12 2018-01-16 Google Inc. Thermosiphon systems for electronic devices
EP2703763A1 (en) 2012-09-03 2014-03-05 ABB Technology AG Evaporator with integrated pre-heater for power electronics cooling
JP2014116385A (ja) * 2012-12-07 2014-06-26 Panasonic Corp 冷却装置およびこれを搭載した電気自動車および電子機器
WO2014038179A1 (ja) * 2012-09-05 2014-03-13 パナソニック株式会社 冷却装置、これを搭載した電気自動車、および電子機器
US9463536B2 (en) 2013-12-20 2016-10-11 Google Inc. Manufacturing process for thermosiphon heat exchanger
CN104465560A (zh) * 2014-11-21 2015-03-25 广西智通节能环保科技有限公司 一种电子器件用循环液体冷却系统
WO2019229491A1 (en) * 2018-05-26 2019-12-05 Pratik Sharma Cooling system for electronic devices
JP6625302B1 (ja) 2019-04-22 2019-12-25 三菱電機株式会社 電子機器
US11874022B1 (en) 2020-09-10 2024-01-16 Hamfop Technologies LLC Heat-activated multiphase fluid-operated pump for geothermal temperature control of structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
JPS5929985A (ja) * 1982-08-11 1984-02-17 Hitachi Ltd 定圧型沸騰冷却装置
GB2156505B (en) * 1984-03-07 1989-01-05 Furukawa Electric Co Ltd Heat exchanger
DE3422039A1 (de) * 1984-06-14 1985-12-19 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Siedekuehlung, insbesondere zur kuehlung von stromrichtern der leistungselektronik
US4611654A (en) * 1985-01-23 1986-09-16 Buchsel Christian K E Passive system for heat transfer
JP2534668B2 (ja) * 1986-05-13 1996-09-18 バブコツク日立株式会社 熱交換装置
JP2859927B2 (ja) * 1990-05-16 1999-02-24 株式会社東芝 冷却装置および温度制御装置

Also Published As

Publication number Publication date
JPH11502300A (ja) 1999-02-23
WO1996029553A1 (en) 1996-09-26
EP0815403A1 (en) 1998-01-07
CA2215501A1 (en) 1996-09-26
SE503322C2 (sv) 1996-05-28
US5966957A (en) 1999-10-19
SE9500944L (sv) 1996-05-28
AU5129496A (en) 1996-10-08

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