JPS5241193B2 - - Google Patents
Info
- Publication number
- JPS5241193B2 JPS5241193B2 JP49030488A JP3048874A JPS5241193B2 JP S5241193 B2 JPS5241193 B2 JP S5241193B2 JP 49030488 A JP49030488 A JP 49030488A JP 3048874 A JP3048874 A JP 3048874A JP S5241193 B2 JPS5241193 B2 JP S5241193B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/73—
-
- H10W40/611—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Rectifiers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49030488A JPS5241193B2 (enExample) | 1974-03-16 | 1974-03-16 | |
| US05/559,392 US3989099A (en) | 1974-03-16 | 1975-03-17 | Vapor cooling device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49030488A JPS5241193B2 (enExample) | 1974-03-16 | 1974-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50123278A JPS50123278A (enExample) | 1975-09-27 |
| JPS5241193B2 true JPS5241193B2 (enExample) | 1977-10-17 |
Family
ID=12305208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49030488A Expired JPS5241193B2 (enExample) | 1974-03-16 | 1974-03-16 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3989099A (enExample) |
| JP (1) | JPS5241193B2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856978B2 (ja) * | 1975-11-21 | 1983-12-17 | 株式会社東芝 | ハンドウタイノ レイキヤクソウチ |
| JPS5722446Y2 (enExample) * | 1976-01-19 | 1982-05-15 | ||
| JPS5299075A (en) * | 1976-02-16 | 1977-08-19 | Hitachi Ltd | Vapor cooler |
| JPS5339433A (en) * | 1976-09-24 | 1978-04-11 | Hitachi Ltd | Boiled cooling type rectifier |
| JPS5723897Y2 (enExample) * | 1977-08-30 | 1982-05-24 | ||
| DE3307703A1 (de) * | 1983-03-04 | 1984-09-06 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente |
| US4559580A (en) * | 1983-11-04 | 1985-12-17 | Sundstrand Corporation | Semiconductor package with internal heat exchanger |
| FR2588072B1 (fr) * | 1985-09-30 | 1987-12-11 | Jeumont Schneider | Installation de dissipation pour elements semi-conducteurs de puissance |
| US4759403A (en) * | 1986-04-30 | 1988-07-26 | International Business Machines Corp. | Hydraulic manifold for water cooling of multi-chip electric modules |
| FR2604028B1 (fr) * | 1986-09-16 | 1990-01-26 | Alsthom | Dispositif de refroidissement de semi-conducteurs par vaporisation d'un fluide frigorifique |
| FR2604827B1 (fr) * | 1986-10-06 | 1989-12-29 | Alsthom | Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance |
| JPH0724293B2 (ja) * | 1987-09-30 | 1995-03-15 | 株式会社日立製作所 | 沸騰冷却装置 |
| US4922573A (en) * | 1989-04-14 | 1990-05-08 | Grumman Aerospace Corporation | Compression fitted bushing installation |
| FR2646500B1 (fr) * | 1989-04-27 | 1994-11-25 | Alsthom Gec | Procede de refroidissement de composants electriques, dispositif pour la mise en oeuvre de ce procede et application aux composants embarques dans un vehicule |
| US5057968A (en) * | 1989-10-16 | 1991-10-15 | Lockheed Corporation | Cooling system for electronic modules |
| US5043797A (en) * | 1990-04-03 | 1991-08-27 | General Electric Company | Cooling header connection for a thyristor stack |
| JPH06342990A (ja) * | 1991-02-04 | 1994-12-13 | Internatl Business Mach Corp <Ibm> | 統合冷却システム |
| US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
| JP3634028B2 (ja) * | 1995-09-08 | 2005-03-30 | 住友精密工業株式会社 | 半導体素子冷却装置 |
| FR2746177B1 (fr) * | 1996-03-14 | 2000-04-07 | Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant | |
| JP3964580B2 (ja) * | 1999-09-03 | 2007-08-22 | 富士通株式会社 | 冷却ユニット |
| CN101924485B (zh) * | 2010-09-26 | 2013-06-12 | 荆州市金茂自动化技术有限公司 | 双联水冷超大电流整流组件 |
| US9861012B2 (en) | 2014-10-21 | 2018-01-02 | International Business Machines Corporation | Multifunction coolant manifold structures |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL208738A (enExample) * | 1955-07-06 | |||
| US3476175A (en) * | 1967-11-02 | 1969-11-04 | Bell Telephone Labor Inc | Vapor-phase cooling of electronic components |
| CH498488A (de) * | 1969-04-30 | 1970-10-31 | Bbc Brown Boveri & Cie | Kühleinrichtung insbesondere für Halbleiterelemente und Elektronenröhren |
| US3609991A (en) * | 1969-10-13 | 1971-10-05 | Ibm | Cooling system having thermally induced circulation |
| US3633665A (en) * | 1970-05-11 | 1972-01-11 | Atomic Energy Commission | Heat exchanger using thermal convection tubes |
| US3741292A (en) * | 1971-06-30 | 1973-06-26 | Ibm | Liquid encapsulated air cooled module |
-
1974
- 1974-03-16 JP JP49030488A patent/JPS5241193B2/ja not_active Expired
-
1975
- 1975-03-17 US US05/559,392 patent/US3989099A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50123278A (enExample) | 1975-09-27 |
| US3989099A (en) | 1976-11-02 |