DE202925C - - Google Patents
Info
- Publication number
- DE202925C DE202925C DE1907202925D DE202925DA DE202925C DE 202925 C DE202925 C DE 202925C DE 1907202925 D DE1907202925 D DE 1907202925D DE 202925D A DE202925D A DE 202925DA DE 202925 C DE202925 C DE 202925C
- Authority
- DE
- Germany
- Prior art keywords
- lens
- filter
- focal length
- substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000005337 ground glass Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/64—Impedance arrangements
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Microwave Amplifiers (AREA)
- Blocking Light For Cameras (AREA)
Description
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KAISERLICHES
PATENTAMT
PATENTSCHRIFT
KLASSE 57b. GRUPPE
Firma CARL ZEISS in JENA.
Patentiert im Deutschen Reiche vom 25. Oktober 1907 ab.
Die vorliegende Erfindung betrifft das gelbe Filter, das man bei photographischen
Aufnahmen, die auf Schichtträgern mit mehrfarbiger Zwischenschicht, z.B. den Lumieresehen
Autochromplatten, gemacht werden, am Objektiv anbringt. Dieses bekannte Filter stellt eine Platte oder Scheibe mit
ebenen und einander parallelen Ein- und Austrittsflächen dar. Es besteht oft aus
ίο mehreren, in der Durchtrittsrichtung des
Lichts aufeinanderfolgenden Teilen, die dicht zusammengefügt oder zusammengekittet sind.
Zu solchen zusammengesetzten gelben Filtern sind z. B. Schichten von verschiedener Färbung
vereinigt worden, oder man hat eine oder zwei farblose Scheiben lediglich als Träger
oder Schutzdecken für die eigentlichen festen oder flüssigen Filterschichten dienen lassen.
Ohne diese Freiheit in der Verwendung einfacher oder beliebig zusammengesetzter
Filter einzuschränken, werden diese Filter hier so umgestaltet, daß sie noch einen
zweiten Zweck erfüllen. Bei Aufnahmen auf den erwähnten Schichtträgern mit mehrfarbiger
Zwischenschicht muß bekanntlich das Licht durch diese Zwischenschicht gehen,
bevor es die lichtempfindliche Schicht trifft. Solchen Schichtträgern gibt man deshalb in
der Kamera die gegen die gewöhnliche umgekehrte Läge, in der die lichtempfindliche
Schicht sich zuhinterst befindet, also um die Dicke des Schichtträgers aus der gewöhnlichen
Bildebene zurückgerückt ist. Bei Auf- ; nahmen auf diesen umgekehrten Schichtträgern
hat man entweder ein Filter von beliebiger Dicke vor dem Objektiv anzubringen und den für gewöhnliche Aufnahmen geltenden
Abstand zwischen Objektiv und Schichtträger um ein gewisses, der Dicke des Schichtträgers nahekommendes Maß zu verkleinern,
oder ein Filter, das etwa doppelt so dick ist wie der Schichtträger, hinter dem Objektiv anzubringen. Im zweiten Fall bedarf
es der Verringerung des Abstandes zwischen Objektiv und Schichtträger nicht mehr, da das dicke Filter bewirkt, daß die
Bildebene wieder in die lichtempfindliche Schicht fällt. ■ .
Befolgt man die erste dieser beiden Vorschriften, so hat man bei Einstellung des
Bildes durch Verschieben des Objektivs gemäß der gewöhnlichen Skala der Entfernun- ■
gen schließlich noch eine zusätzliche Verschiebung vorzunehmen. Bei Einstellung des
Bildes mit Hilfe einer Mattscheibe aber muß diese die Dicke des Schichtträgers haben und
umgekehrt wie gewöhnlich, d. h. die matte Fläche hinten, gefaßt sein, wenn ihre Vorderfläche
wie bei der gewöhnlichen Fassung dieselbe Lage in der Kamera einnimmt wie
die Vorderfläche des Schichtträgers. Bei Befolgung der zweiten Vorschrift ist das Objektiv
nicht anders zu verschieben, als der gewöhnlichen Skala entspricht, und bei Einstellung
des Bildes mittels Mattscheibe bleibt die gewöhnliche Mattscheibe benutzbar. Trotzdem
wird das zweite Mittel, Einschaltung des gelben Filters zwischen Objektiv und
Schichtträger, nur selten angewandt, weil das Einbringen des Filters in das Innere der
Kamera besonders unbequem, außerdem aber in unliebsamer Weise zeitraubend ist, vor
allem bei Einstellung des Bildes mittels Mattscheibe, da die Zwischenzeit zwischen Einstellung
und Aufnahme durch Anbringen des Filters hinter dem Objektiv um viel mehr
verlängert wird als durch Anbringen vor ihm. Durch die vorliegende Erfindung wird nun
dem vor dem Objektiv anzubringenden Filter der Vorzug verliehen, der bisher nur dem
hinter dem Objektiv anzubringenden eigen war, nämlich daß die gewöhnlichen Arten
. der Einstellung des Bildes anwendbar bleiben. Es wird nach dieser Erfindung eine gelbe
Filterscheibe benutzt, die nicht mehr wie bisher die Wirkung einer homogenen planparallelen Platte, sondern vermöge Krümmung
einer oder mehrerer, äußerer oder innerer Flächen die einer sphärischen, schwach
zerstreuenden Linse besitzt. Indem diese Linse ihre Wirkung mit der des Objektivs
vereinigt, wird gewissermaßen dessen Brennweite ein wenig verlängert, wie es der Rückwärtsverlegung
der lichtempfindlichen Schicht entspricht.
Der Zuwachs der Objektivbrennweite, den die Filterlinse liefert, muß etwa zwei Drittel
der Dicke des Schichtträgers betragen, also ι mm, wenn diese 1,5 mm ist. Wäre die
eigene Brennweite des Objektivs 150 mm, so brächte eine negative Brennweite der Filterlinse
von 22,5 mm gerade diesen Zuwachs hervor. Dieselbe Filterlinse würde auch noch
für Objektive von 145 und von 155 mm
Brennweite genügen, ohne daß sich die Lage des Bildes gegen die lichtempfindliche Schicht
bereits um so viel verschöbe, als die zufälligen Schwankungen in der Dicke der Schichtträger betragen. Im übrigen erhält
die Filterlinse um so größere Brennweite, je größer die Brennweite des Objektivs ist.
Die Verschiebung des Bildes durch den Einfluß der Filterlinse ist nicht unabhängig
von der Entfernung des aufzunehmenden Objektes. Doch ist die Schwankung der Verschiebung
für die gewöhnlichen Objektentfernungen, die ein hohes Vielfaches der Objektivbrennweite
darstellen, wiederum geringer, als die zufälligen Unterschiede in der Dicke
der Schichtträger.
Claims (1)
- Patent-An SPRU ch:Vor dem Objektiv einer photographischen Kamera anzubringendes Gelbfilter für Aufnahmen auf mit ihrer Schicht- ■ seite nach hinten gekehrten Schichtträgern, dadurch gekennzeichnet, daß das Filter eine schwache sphärische Zerstreuungslinse darstellt. ■ .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT37724D AT37724B (de) | 1907-10-24 | 1908-07-13 | Zum Anbringen vor einem Kameraobjektiv eingerichtetes gelbes Filter für Aufnahmen auf Schichtträgern mit mehrfarbiger Zwischenschicht. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82039269A | 1969-04-30 | 1969-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202925C true DE202925C (de) | 1900-01-01 |
Family
ID=25230635
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1907202925D Expired DE202925C (de) | 1907-10-24 | 1907-10-24 | |
DE2020925A Expired DE2020925C2 (de) | 1969-04-30 | 1970-04-29 | Gehäuse zur Aufnahme von HF-Vierpolen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2020925A Expired DE2020925C2 (de) | 1969-04-30 | 1970-04-29 | Gehäuse zur Aufnahme von HF-Vierpolen |
Country Status (5)
Country | Link |
---|---|
US (1) | US3651434A (de) |
JP (1) | JPS4929106B1 (de) |
DE (2) | DE202925C (de) |
FR (1) | FR2040474A1 (de) |
GB (1) | GB1305412A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1204939B (de) * | 1964-03-07 | 1965-11-11 | Eltro G M B H & Co Ges Fuer St | Verfahren und Vorrichtung zur Herstellung von Spektral-Filtern in gekruemmter, vorzugsweise in sphaerisch gekruemmter Form |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4947713B1 (de) * | 1970-04-27 | 1974-12-17 | ||
DE2203892C3 (de) * | 1971-02-08 | 1982-05-27 | TRW Inc., Los Angeles, Calif. | Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen |
US3767979A (en) * | 1971-03-05 | 1973-10-23 | Communications Transistor Corp | Microwave hermetic transistor package |
GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
DE2250918C2 (de) * | 1971-10-27 | 1982-02-04 | Westinghouse Electric Corp., 15222 Pittsburgh, Pa. | Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung |
US3748544A (en) * | 1972-02-14 | 1973-07-24 | Plessey Inc | Laminated ceramic high-frequency semiconductor package |
US3733525A (en) * | 1972-03-20 | 1973-05-15 | Collins Radio Co | Rf microwave amplifier and carrier |
US3801938A (en) * | 1972-05-31 | 1974-04-02 | Trw Inc | Package for microwave semiconductor device |
JPS5228547B2 (de) * | 1972-07-10 | 1977-07-27 | ||
US4396971A (en) * | 1972-07-10 | 1983-08-02 | Amdahl Corporation | LSI Chip package and method |
JPS5758783B2 (de) * | 1973-02-22 | 1982-12-11 | Nippon Electric Co | |
US3936864A (en) * | 1973-05-18 | 1976-02-03 | Raytheon Company | Microwave transistor package |
US3946428A (en) * | 1973-09-19 | 1976-03-23 | Nippon Electric Company, Limited | Encapsulation package for a semiconductor element |
US3898594A (en) * | 1973-11-02 | 1975-08-05 | Trw Inc | Microwave semiconductor device package |
US3908185A (en) * | 1974-03-06 | 1975-09-23 | Rca Corp | High frequency semiconductor device having improved metallized patterns |
EP0001890B1 (de) * | 1977-10-12 | 1981-07-22 | The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and | Massnahmen zur Verbesserung von Gehäusen für integrierte Mikrowellen-Schaltungsanordnungen |
JPS5834755Y2 (ja) * | 1978-09-18 | 1983-08-04 | 富士通株式会社 | 半導体装置 |
US4276522A (en) * | 1979-12-17 | 1981-06-30 | General Dynamics | Circulator in a stripline microwave transmission line circuit |
US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
US4417392A (en) * | 1980-05-15 | 1983-11-29 | Cts Corporation | Process of making multi-layer ceramic package |
FR2497410A1 (fr) * | 1980-12-29 | 1982-07-02 | Thomson Brandt | Ensemble de circuits comprenant plusieurs elements du type " microbande " d'epaisseurs de dielectrique differentes et son procede de fabrication |
DE3201296C2 (de) * | 1982-01-18 | 1986-06-12 | Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev | Transistoranordnung |
DE3409146A1 (de) * | 1984-03-13 | 1985-09-19 | Siemens AG, 1000 Berlin und 8000 München | Optoelektronisches mudul |
US4611398A (en) * | 1984-10-09 | 1986-09-16 | Gte Products Corporation | Integrated circuit package |
EP0180906B1 (de) * | 1984-11-02 | 1989-01-18 | Siemens Aktiengesellschaft | Wellenwiderstandsgetreuer Chipträger für Mikrowellenhalbleiter |
US4610032A (en) * | 1985-01-16 | 1986-09-02 | At&T Bell Laboratories | Sis mixer having thin film wrap around edge contact |
US4626805A (en) * | 1985-04-26 | 1986-12-02 | Tektronix, Inc. | Surface mountable microwave IC package |
US5014115A (en) * | 1987-11-16 | 1991-05-07 | Motorola, Inc. | Coplanar waveguide semiconductor package |
US4897601A (en) * | 1988-03-02 | 1990-01-30 | Ball Corporation | Test fixture for integrated circuit chips |
GB2228618B (en) * | 1989-02-27 | 1993-04-14 | Philips Electronic Associated | Radiation detector |
US5105260A (en) * | 1989-10-31 | 1992-04-14 | Sgs-Thomson Microelectronics, Inc. | Rf transistor package with nickel oxide barrier |
US5109268A (en) * | 1989-12-29 | 1992-04-28 | Sgs-Thomson Microelectronics, Inc. | Rf transistor package and mounting pad |
US5126827A (en) * | 1991-01-17 | 1992-06-30 | Avantek, Inc. | Semiconductor chip header having particular surface metallization |
US5283463A (en) * | 1992-03-05 | 1994-02-01 | Westinghouse Electric Corp. | High power self commutating semiconductor switch |
EP0590804B1 (de) * | 1992-09-03 | 1997-02-05 | STMicroelectronics, Inc. | Vertikal isolierter, monolithischer Hochleistungsbipolartransistor mit Topkollektor |
US5557144A (en) * | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
US6172412B1 (en) * | 1993-10-08 | 2001-01-09 | Stratedge Corporation | High frequency microelectronics package |
US5465008A (en) * | 1993-10-08 | 1995-11-07 | Stratedge Corporation | Ceramic microelectronics package |
US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
US5986505A (en) * | 1997-03-18 | 1999-11-16 | Raytheon Company | Circular stripline package incorporating a MMIC low noise amplifier |
US6404065B1 (en) * | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
US6542720B1 (en) | 1999-03-01 | 2003-04-01 | Micron Technology, Inc. | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices |
US6404617B1 (en) * | 2000-07-28 | 2002-06-11 | William T. Storey | Capacitor with wide foil leads |
US6521972B1 (en) * | 2000-09-28 | 2003-02-18 | Eic Corporation | RF power transistor having low parasitic impedance input feed structure |
US6727585B2 (en) | 2001-05-04 | 2004-04-27 | Ixys Corporation | Power device with a plastic molded package and direct bonded substrate |
US6731002B2 (en) * | 2001-05-04 | 2004-05-04 | Ixys Corporation | High frequency power device with a plastic molded package and direct bonded substrate |
US8487407B2 (en) | 2011-10-13 | 2013-07-16 | Infineon Technologies Ag | Low impedance gate control method and apparatus |
US9780010B1 (en) * | 2016-03-24 | 2017-10-03 | Qorvo Us, Inc. | Hermetic package with improved RF stability and performance |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL253550A (de) * | 1959-07-22 | |||
NL275288A (de) * | 1961-02-28 | |||
US3308352A (en) * | 1964-06-01 | 1967-03-07 | Tektronix Inc | Transmission line mounting structure for semiconductor device |
US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
US3303439A (en) * | 1965-06-14 | 1967-02-07 | Western Electric Co | Strip transmission line interboard connection |
US3404214A (en) * | 1967-07-17 | 1968-10-01 | Alloys Unltd Inc | Flat package for semiconductors |
US3520054A (en) * | 1967-11-13 | 1970-07-14 | Mitronics Inc | Method of making multilevel metallized ceramic bodies for semiconductor packages |
US3478161A (en) * | 1968-03-13 | 1969-11-11 | Rca Corp | Strip-line power transistor package |
-
1907
- 1907-10-24 DE DE1907202925D patent/DE202925C/de not_active Expired
-
1969
- 1969-04-30 US US820392A patent/US3651434A/en not_active Expired - Lifetime
-
1970
- 1970-04-29 DE DE2020925A patent/DE2020925C2/de not_active Expired
- 1970-04-29 FR FR7015795A patent/FR2040474A1/fr not_active Withdrawn
- 1970-04-29 GB GB2048570A patent/GB1305412A/en not_active Expired
- 1970-04-30 JP JP45037150A patent/JPS4929106B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1204939B (de) * | 1964-03-07 | 1965-11-11 | Eltro G M B H & Co Ges Fuer St | Verfahren und Vorrichtung zur Herstellung von Spektral-Filtern in gekruemmter, vorzugsweise in sphaerisch gekruemmter Form |
Also Published As
Publication number | Publication date |
---|---|
JPS4929106B1 (de) | 1974-08-01 |
DE2020925A1 (de) | 1970-11-12 |
US3651434A (en) | 1972-03-21 |
FR2040474A1 (de) | 1971-01-22 |
GB1305412A (de) | 1973-01-31 |
DE2020925C2 (de) | 1983-05-11 |
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