DE202925C - - Google Patents

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Publication number
DE202925C
DE202925C DE1907202925D DE202925DA DE202925C DE 202925 C DE202925 C DE 202925C DE 1907202925 D DE1907202925 D DE 1907202925D DE 202925D A DE202925D A DE 202925DA DE 202925 C DE202925 C DE 202925C
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Prior art keywords
lens
filter
focal length
substrate
thickness
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Expired
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DE1907202925D
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English (en)
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Publication of DE202925C publication Critical patent/DE202925C/de
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Priority to AT37724D priority Critical patent/AT37724B/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Microwave Amplifiers (AREA)
  • Blocking Light For Cameras (AREA)

Description

tiiat bcz
fi'v
Stat..
KAISERLICHES
PATENTAMT
PATENTSCHRIFT
KLASSE 57b. GRUPPE
Firma CARL ZEISS in JENA.
Patentiert im Deutschen Reiche vom 25. Oktober 1907 ab.
Die vorliegende Erfindung betrifft das gelbe Filter, das man bei photographischen Aufnahmen, die auf Schichtträgern mit mehrfarbiger Zwischenschicht, z.B. den Lumieresehen Autochromplatten, gemacht werden, am Objektiv anbringt. Dieses bekannte Filter stellt eine Platte oder Scheibe mit ebenen und einander parallelen Ein- und Austrittsflächen dar. Es besteht oft aus
ίο mehreren, in der Durchtrittsrichtung des Lichts aufeinanderfolgenden Teilen, die dicht zusammengefügt oder zusammengekittet sind. Zu solchen zusammengesetzten gelben Filtern sind z. B. Schichten von verschiedener Färbung vereinigt worden, oder man hat eine oder zwei farblose Scheiben lediglich als Träger oder Schutzdecken für die eigentlichen festen oder flüssigen Filterschichten dienen lassen.
Ohne diese Freiheit in der Verwendung einfacher oder beliebig zusammengesetzter Filter einzuschränken, werden diese Filter hier so umgestaltet, daß sie noch einen zweiten Zweck erfüllen. Bei Aufnahmen auf den erwähnten Schichtträgern mit mehrfarbiger Zwischenschicht muß bekanntlich das Licht durch diese Zwischenschicht gehen, bevor es die lichtempfindliche Schicht trifft. Solchen Schichtträgern gibt man deshalb in der Kamera die gegen die gewöhnliche umgekehrte Läge, in der die lichtempfindliche Schicht sich zuhinterst befindet, also um die Dicke des Schichtträgers aus der gewöhnlichen Bildebene zurückgerückt ist. Bei Auf- ; nahmen auf diesen umgekehrten Schichtträgern hat man entweder ein Filter von beliebiger Dicke vor dem Objektiv anzubringen und den für gewöhnliche Aufnahmen geltenden Abstand zwischen Objektiv und Schichtträger um ein gewisses, der Dicke des Schichtträgers nahekommendes Maß zu verkleinern, oder ein Filter, das etwa doppelt so dick ist wie der Schichtträger, hinter dem Objektiv anzubringen. Im zweiten Fall bedarf es der Verringerung des Abstandes zwischen Objektiv und Schichtträger nicht mehr, da das dicke Filter bewirkt, daß die Bildebene wieder in die lichtempfindliche Schicht fällt. ■ .
Befolgt man die erste dieser beiden Vorschriften, so hat man bei Einstellung des Bildes durch Verschieben des Objektivs gemäß der gewöhnlichen Skala der Entfernun- ■ gen schließlich noch eine zusätzliche Verschiebung vorzunehmen. Bei Einstellung des Bildes mit Hilfe einer Mattscheibe aber muß diese die Dicke des Schichtträgers haben und umgekehrt wie gewöhnlich, d. h. die matte Fläche hinten, gefaßt sein, wenn ihre Vorderfläche wie bei der gewöhnlichen Fassung dieselbe Lage in der Kamera einnimmt wie die Vorderfläche des Schichtträgers. Bei Befolgung der zweiten Vorschrift ist das Objektiv nicht anders zu verschieben, als der gewöhnlichen Skala entspricht, und bei Einstellung des Bildes mittels Mattscheibe bleibt die gewöhnliche Mattscheibe benutzbar. Trotzdem wird das zweite Mittel, Einschaltung des gelben Filters zwischen Objektiv und
Schichtträger, nur selten angewandt, weil das Einbringen des Filters in das Innere der Kamera besonders unbequem, außerdem aber in unliebsamer Weise zeitraubend ist, vor allem bei Einstellung des Bildes mittels Mattscheibe, da die Zwischenzeit zwischen Einstellung und Aufnahme durch Anbringen des Filters hinter dem Objektiv um viel mehr verlängert wird als durch Anbringen vor ihm. Durch die vorliegende Erfindung wird nun dem vor dem Objektiv anzubringenden Filter der Vorzug verliehen, der bisher nur dem hinter dem Objektiv anzubringenden eigen war, nämlich daß die gewöhnlichen Arten . der Einstellung des Bildes anwendbar bleiben. Es wird nach dieser Erfindung eine gelbe Filterscheibe benutzt, die nicht mehr wie bisher die Wirkung einer homogenen planparallelen Platte, sondern vermöge Krümmung einer oder mehrerer, äußerer oder innerer Flächen die einer sphärischen, schwach zerstreuenden Linse besitzt. Indem diese Linse ihre Wirkung mit der des Objektivs vereinigt, wird gewissermaßen dessen Brennweite ein wenig verlängert, wie es der Rückwärtsverlegung der lichtempfindlichen Schicht entspricht.
Der Zuwachs der Objektivbrennweite, den die Filterlinse liefert, muß etwa zwei Drittel der Dicke des Schichtträgers betragen, also ι mm, wenn diese 1,5 mm ist. Wäre die eigene Brennweite des Objektivs 150 mm, so brächte eine negative Brennweite der Filterlinse von 22,5 mm gerade diesen Zuwachs hervor. Dieselbe Filterlinse würde auch noch für Objektive von 145 und von 155 mm Brennweite genügen, ohne daß sich die Lage des Bildes gegen die lichtempfindliche Schicht bereits um so viel verschöbe, als die zufälligen Schwankungen in der Dicke der Schichtträger betragen. Im übrigen erhält die Filterlinse um so größere Brennweite, je größer die Brennweite des Objektivs ist.
Die Verschiebung des Bildes durch den Einfluß der Filterlinse ist nicht unabhängig von der Entfernung des aufzunehmenden Objektes. Doch ist die Schwankung der Verschiebung für die gewöhnlichen Objektentfernungen, die ein hohes Vielfaches der Objektivbrennweite darstellen, wiederum geringer, als die zufälligen Unterschiede in der Dicke der Schichtträger.

Claims (1)

  1. Patent-An SPRU ch:
    Vor dem Objektiv einer photographischen Kamera anzubringendes Gelbfilter für Aufnahmen auf mit ihrer Schicht- ■ seite nach hinten gekehrten Schichtträgern, dadurch gekennzeichnet, daß das Filter eine schwache sphärische Zerstreuungslinse darstellt. ■ .
DE1907202925D 1907-10-24 1907-10-24 Expired DE202925C (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT37724D AT37724B (de) 1907-10-24 1908-07-13 Zum Anbringen vor einem Kameraobjektiv eingerichtetes gelbes Filter für Aufnahmen auf Schichtträgern mit mehrfarbiger Zwischenschicht.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82039269A 1969-04-30 1969-04-30

Publications (1)

Publication Number Publication Date
DE202925C true DE202925C (de) 1900-01-01

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DE1907202925D Expired DE202925C (de) 1907-10-24 1907-10-24
DE2020925A Expired DE2020925C2 (de) 1969-04-30 1970-04-29 Gehäuse zur Aufnahme von HF-Vierpolen

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DE2020925A Expired DE2020925C2 (de) 1969-04-30 1970-04-29 Gehäuse zur Aufnahme von HF-Vierpolen

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US (1) US3651434A (de)
JP (1) JPS4929106B1 (de)
DE (2) DE202925C (de)
FR (1) FR2040474A1 (de)
GB (1) GB1305412A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1204939B (de) * 1964-03-07 1965-11-11 Eltro G M B H & Co Ges Fuer St Verfahren und Vorrichtung zur Herstellung von Spektral-Filtern in gekruemmter, vorzugsweise in sphaerisch gekruemmter Form

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947713B1 (de) * 1970-04-27 1974-12-17
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
US3748544A (en) * 1972-02-14 1973-07-24 Plessey Inc Laminated ceramic high-frequency semiconductor package
US3733525A (en) * 1972-03-20 1973-05-15 Collins Radio Co Rf microwave amplifier and carrier
US3801938A (en) * 1972-05-31 1974-04-02 Trw Inc Package for microwave semiconductor device
JPS5228547B2 (de) * 1972-07-10 1977-07-27
US4396971A (en) * 1972-07-10 1983-08-02 Amdahl Corporation LSI Chip package and method
JPS5758783B2 (de) * 1973-02-22 1982-12-11 Nippon Electric Co
US3936864A (en) * 1973-05-18 1976-02-03 Raytheon Company Microwave transistor package
US3946428A (en) * 1973-09-19 1976-03-23 Nippon Electric Company, Limited Encapsulation package for a semiconductor element
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
US3908185A (en) * 1974-03-06 1975-09-23 Rca Corp High frequency semiconductor device having improved metallized patterns
DE2860865D1 (en) * 1977-10-12 1981-10-29 Secr Defence Brit Improvements in or relating to microwave integrated circuit packages
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
US4276522A (en) * 1979-12-17 1981-06-30 General Dynamics Circulator in a stripline microwave transmission line circuit
US4417392A (en) * 1980-05-15 1983-11-29 Cts Corporation Process of making multi-layer ceramic package
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
FR2497410A1 (fr) * 1980-12-29 1982-07-02 Thomson Brandt Ensemble de circuits comprenant plusieurs elements du type " microbande " d'epaisseurs de dielectrique differentes et son procede de fabrication
DE3201296C2 (de) * 1982-01-18 1986-06-12 Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev Transistoranordnung
DE3409146A1 (de) * 1984-03-13 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches mudul
US4611398A (en) * 1984-10-09 1986-09-16 Gte Products Corporation Integrated circuit package
EP0180906B1 (de) * 1984-11-02 1989-01-18 Siemens Aktiengesellschaft Wellenwiderstandsgetreuer Chipträger für Mikrowellenhalbleiter
US4610032A (en) * 1985-01-16 1986-09-02 At&T Bell Laboratories Sis mixer having thin film wrap around edge contact
US4626805A (en) * 1985-04-26 1986-12-02 Tektronix, Inc. Surface mountable microwave IC package
US5014115A (en) * 1987-11-16 1991-05-07 Motorola, Inc. Coplanar waveguide semiconductor package
US4897601A (en) * 1988-03-02 1990-01-30 Ball Corporation Test fixture for integrated circuit chips
GB2228618B (en) * 1989-02-27 1993-04-14 Philips Electronic Associated Radiation detector
US5105260A (en) 1989-10-31 1992-04-14 Sgs-Thomson Microelectronics, Inc. Rf transistor package with nickel oxide barrier
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
US5126827A (en) * 1991-01-17 1992-06-30 Avantek, Inc. Semiconductor chip header having particular surface metallization
US5283463A (en) * 1992-03-05 1994-02-01 Westinghouse Electric Corp. High power self commutating semiconductor switch
DE69307983T2 (de) * 1992-09-03 1997-05-28 Sgs Thomson Microelectronics Vertikal isolierter, monolithischer Hochleistungsbipolartransistor mit Topkollektor
US5557144A (en) * 1993-01-29 1996-09-17 Anadigics, Inc. Plastic packages for microwave frequency applications
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5986505A (en) * 1997-03-18 1999-11-16 Raytheon Company Circular stripline package incorporating a MMIC low noise amplifier
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
US6542720B1 (en) * 1999-03-01 2003-04-01 Micron Technology, Inc. Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
US6404617B1 (en) * 2000-07-28 2002-06-11 William T. Storey Capacitor with wide foil leads
US6521972B1 (en) * 2000-09-28 2003-02-18 Eic Corporation RF power transistor having low parasitic impedance input feed structure
US6731002B2 (en) * 2001-05-04 2004-05-04 Ixys Corporation High frequency power device with a plastic molded package and direct bonded substrate
US6727585B2 (en) 2001-05-04 2004-04-27 Ixys Corporation Power device with a plastic molded package and direct bonded substrate
US8487407B2 (en) 2011-10-13 2013-07-16 Infineon Technologies Ag Low impedance gate control method and apparatus
US9780010B1 (en) * 2016-03-24 2017-10-03 Qorvo Us, Inc. Hermetic package with improved RF stability and performance

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL253550A (de) * 1959-07-22
NL275288A (de) * 1961-02-28
US3308352A (en) * 1964-06-01 1967-03-07 Tektronix Inc Transmission line mounting structure for semiconductor device
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
US3404214A (en) * 1967-07-17 1968-10-01 Alloys Unltd Inc Flat package for semiconductors
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1204939B (de) * 1964-03-07 1965-11-11 Eltro G M B H & Co Ges Fuer St Verfahren und Vorrichtung zur Herstellung von Spektral-Filtern in gekruemmter, vorzugsweise in sphaerisch gekruemmter Form

Also Published As

Publication number Publication date
DE2020925C2 (de) 1983-05-11
US3651434A (en) 1972-03-21
FR2040474A1 (de) 1971-01-22
GB1305412A (de) 1973-01-31
DE2020925A1 (de) 1970-11-12
JPS4929106B1 (de) 1974-08-01

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