DE1937664C3 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1937664C3
DE1937664C3 DE1937664A DE1937664A DE1937664C3 DE 1937664 C3 DE1937664 C3 DE 1937664C3 DE 1937664 A DE1937664 A DE 1937664A DE 1937664 A DE1937664 A DE 1937664A DE 1937664 C3 DE1937664 C3 DE 1937664C3
Authority
DE
Germany
Prior art keywords
conductors
thermally conductive
semiconductor component
block
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1937664A
Other languages
German (de)
English (en)
Other versions
DE1937664B2 (de
DE1937664A1 (de
Inventor
Arie Baelde
Joannes Joseph Van Hout
Johannes Theodorus Van De Water
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1937664A1 publication Critical patent/DE1937664A1/de
Publication of DE1937664B2 publication Critical patent/DE1937664B2/de
Application granted granted Critical
Publication of DE1937664C3 publication Critical patent/DE1937664C3/de
Expired legal-status Critical Current

Links

Classifications

    • H10W40/778—
    • H10W40/70—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE1937664A 1968-07-30 1969-07-24 Halbleiterbauelement Expired DE1937664C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.

Publications (3)

Publication Number Publication Date
DE1937664A1 DE1937664A1 (de) 1970-02-05
DE1937664B2 DE1937664B2 (de) 1973-11-22
DE1937664C3 true DE1937664C3 (de) 1978-11-30

Family

ID=19804247

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1937664A Expired DE1937664C3 (de) 1968-07-30 1969-07-24 Halbleiterbauelement

Country Status (11)

Country Link
US (1) US3646409A (esLanguage)
AT (1) AT312686B (esLanguage)
BE (1) BE736743A (esLanguage)
CH (1) CH506883A (esLanguage)
DE (1) DE1937664C3 (esLanguage)
DK (1) DK123553B (esLanguage)
ES (1) ES369959A1 (esLanguage)
FR (1) FR2014777A1 (esLanguage)
GB (1) GB1271576A (esLanguage)
NL (1) NL157456B (esLanguage)
SE (1) SE355260B (esLanguage)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (esLanguage) * 1970-10-19 1976-04-16 Ates Componenti Elettron
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3721747A (en) * 1972-03-15 1973-03-20 Coilcraft Inc Dual in-line package
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3801728A (en) * 1972-10-20 1974-04-02 Bell Telephone Labor Inc Microelectronic packages
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
IN148328B (esLanguage) * 1977-04-18 1981-01-17 Rca Corp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS592364B2 (ja) * 1979-04-27 1984-01-18 富士通株式会社 集合抵抗モジユ−ル
US4642419A (en) * 1981-04-06 1987-02-10 International Rectifier Corporation Four-leaded dual in-line package module for semiconductor devices
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5872395A (en) * 1996-09-16 1999-02-16 International Packaging And Assembly Corporation Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages
DE19638438A1 (de) 1996-09-19 1998-04-02 Siemens Ag Durch Feldeffekt steuerbares, vertikales Halbleiterbauelement
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
TWI268732B (en) * 2004-12-16 2006-12-11 Au Optronics Corp Organic light emitting device
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Also Published As

Publication number Publication date
BE736743A (fr) 1970-01-29
NL6810761A (esLanguage) 1970-02-03
SE355260B (esLanguage) 1973-04-09
DE1937664B2 (de) 1973-11-22
FR2014777A1 (esLanguage) 1970-04-17
US3646409A (en) 1972-02-29
DE1937664A1 (de) 1970-02-05
AT312686B (de) 1974-01-10
GB1271576A (en) 1972-04-19
CH506883A (de) 1971-04-30
ES369959A1 (es) 1971-07-16
DK123553B (da) 1972-07-03
NL157456B (nl) 1978-07-17

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee