DK123553B - Indskapslet halvlederorgan med køleelement. - Google Patents

Indskapslet halvlederorgan med køleelement.

Info

Publication number
DK123553B
DK123553B DK404469AA DK404469A DK123553B DK 123553 B DK123553 B DK 123553B DK 404469A A DK404469A A DK 404469AA DK 404469 A DK404469 A DK 404469A DK 123553 B DK123553 B DK 123553B
Authority
DK
Denmark
Prior art keywords
semiconductor device
cooling element
encapsulated semiconductor
encapsulated
cooling
Prior art date
Application number
DK404469AA
Other languages
English (en)
Inventor
A Baelde
De Water J Van
Hout J Van
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of DK123553B publication Critical patent/DK123553B/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
DK404469AA 1968-07-30 1969-07-25 Indskapslet halvlederorgan med køleelement. DK123553B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6810761.A NL157456B (nl) 1968-07-30 1968-07-30 Halfgeleiderinrichting in een isolerende kunststofomhulling.

Publications (1)

Publication Number Publication Date
DK123553B true DK123553B (da) 1972-07-03

Family

ID=19804247

Family Applications (1)

Application Number Title Priority Date Filing Date
DK404469AA DK123553B (da) 1968-07-30 1969-07-25 Indskapslet halvlederorgan med køleelement.

Country Status (11)

Country Link
US (1) US3646409A (da)
AT (1) AT312686B (da)
BE (1) BE736743A (da)
CH (1) CH506883A (da)
DE (1) DE1937664C3 (da)
DK (1) DK123553B (da)
ES (1) ES369959A1 (da)
FR (1) FR2014777A1 (da)
GB (1) GB1271576A (da)
NL (1) NL157456B (da)
SE (1) SE355260B (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2116353B1 (da) * 1970-10-19 1976-04-16 Ates Componenti Elettron
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3721747A (en) * 1972-03-15 1973-03-20 Coilcraft Inc Dual in-line package
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3801728A (en) * 1972-10-20 1974-04-02 Bell Telephone Labor Inc Microelectronic packages
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
IN148328B (da) * 1977-04-18 1981-01-17 Rca Corp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS592364B2 (ja) * 1979-04-27 1984-01-18 富士通株式会社 集合抵抗モジユ−ル
US4642419A (en) * 1981-04-06 1987-02-10 International Rectifier Corporation Four-leaded dual in-line package module for semiconductor devices
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5872395A (en) * 1996-09-16 1999-02-16 International Packaging And Assembly Corporation Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages
DE19638438A1 (de) 1996-09-19 1998-04-02 Siemens Ag Durch Feldeffekt steuerbares, vertikales Halbleiterbauelement
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
TWI268732B (en) * 2004-12-16 2006-12-11 Au Optronics Corp Organic light emitting device
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Also Published As

Publication number Publication date
ES369959A1 (es) 1971-07-16
US3646409A (en) 1972-02-29
DE1937664C3 (de) 1978-11-30
AT312686B (de) 1974-01-10
FR2014777A1 (da) 1970-04-17
SE355260B (da) 1973-04-09
NL157456B (nl) 1978-07-17
CH506883A (de) 1971-04-30
GB1271576A (en) 1972-04-19
DE1937664A1 (de) 1970-02-05
NL6810761A (da) 1970-02-03
BE736743A (fr) 1970-01-29
DE1937664B2 (de) 1973-11-22

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