AT310811B - Halbleiterelement mit Kühleinrichtung - Google Patents

Halbleiterelement mit Kühleinrichtung

Info

Publication number
AT310811B
AT310811B AT107169A AT107169A AT310811B AT 310811 B AT310811 B AT 310811B AT 107169 A AT107169 A AT 107169A AT 107169 A AT107169 A AT 107169A AT 310811 B AT310811 B AT 310811B
Authority
AT
Austria
Prior art keywords
semiconductor element
cooling device
cooling
semiconductor
Prior art date
Application number
AT107169A
Other languages
English (en)
Original Assignee
Beteiligungs Ag Haustechnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beteiligungs Ag Haustechnik filed Critical Beteiligungs Ag Haustechnik
Priority to AT107169A priority Critical patent/AT310811B/de
Priority to DE2003393A priority patent/DE2003393C3/de
Priority to GB488070A priority patent/GB1304282A/en
Application granted granted Critical
Publication of AT310811B publication Critical patent/AT310811B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT107169A 1969-02-03 1969-02-03 Halbleiterelement mit Kühleinrichtung AT310811B (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT107169A AT310811B (de) 1969-02-03 1969-02-03 Halbleiterelement mit Kühleinrichtung
DE2003393A DE2003393C3 (de) 1969-02-03 1970-01-26 Kühlvorrichtung für ein Halbleiterbauelement
GB488070A GB1304282A (de) 1969-02-03 1970-02-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT107169A AT310811B (de) 1969-02-03 1969-02-03 Halbleiterelement mit Kühleinrichtung

Publications (1)

Publication Number Publication Date
AT310811B true AT310811B (de) 1973-10-25

Family

ID=3505970

Family Applications (1)

Application Number Title Priority Date Filing Date
AT107169A AT310811B (de) 1969-02-03 1969-02-03 Halbleiterelement mit Kühleinrichtung

Country Status (3)

Country Link
AT (1) AT310811B (de)
DE (1) DE2003393C3 (de)
GB (1) GB1304282A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
GB9006644D0 (en) * 1990-03-24 1990-05-23 Broadgate Ltd Heat-proof casings for electrical equipment
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
GB2281373B (en) * 1993-08-17 1997-04-09 T & N Technology Ltd Heat shield
US6570362B1 (en) * 2000-08-22 2003-05-27 Motorola, Inc. Portable electronic device with enhanced battery life and cooling
EP2015041A1 (de) * 2007-07-10 2009-01-14 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Vorrichtung und Verfahren zur Messung der Körperkerntemperatur für erhöhte Umgebungstemperaturen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2808494A (en) * 1952-04-22 1957-10-01 Telkes Maria Apparatus for storing and releasing heat
DE1054473B (de) * 1954-05-22 1959-04-09 Volker Aschoff Dr Ing Verfahren zur Kuehlung eines vorzugsweise elektrischen oder/und magnetischen Systems
US2903629A (en) * 1958-10-23 1959-09-08 Advanced Res Associates Inc Encapsulated semiconductor assembly
SE312860B (de) * 1964-09-28 1969-07-28 Asea Ab

Also Published As

Publication number Publication date
DE2003393C3 (de) 1981-04-16
DE2003393A1 (de) 1970-08-27
DE2003393B2 (de) 1974-09-26
GB1304282A (de) 1973-01-24

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
EWE Authorization for restitution
ELJ Ceased due to non-payment of the annual fee