SE312860B - - Google Patents

Info

Publication number
SE312860B
SE312860B SE11583/64A SE1158364A SE312860B SE 312860 B SE312860 B SE 312860B SE 11583/64 A SE11583/64 A SE 11583/64A SE 1158364 A SE1158364 A SE 1158364A SE 312860 B SE312860 B SE 312860B
Authority
SE
Sweden
Application number
SE11583/64A
Inventor
N Andersson
G Lilja
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE11583/64A priority Critical patent/SE312860B/xx
Priority to BE669366D priority patent/BE669366A/xx
Priority to US486080A priority patent/US3377523A/en
Priority to FR31632A priority patent/FR1448403A/fr
Priority to NL6512144A priority patent/NL6512144A/xx
Priority to FI652227A priority patent/FI42348C/fi
Priority to CH1326865A priority patent/CH438496A/de
Priority to GB40958/65A priority patent/GB1113455A/en
Publication of SE312860B publication Critical patent/SE312860B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
SE11583/64A 1964-09-28 1964-09-28 SE312860B (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE11583/64A SE312860B (de) 1964-09-28 1964-09-28
BE669366D BE669366A (de) 1964-09-28 1965-09-08
US486080A US3377523A (en) 1964-09-28 1965-09-09 Semiconductor device cooled from one side
FR31632A FR1448403A (fr) 1964-09-28 1965-09-16 Dispositif semi-conducteur, refroidi d'un côté
NL6512144A NL6512144A (de) 1964-09-28 1965-09-17
FI652227A FI42348C (fi) 1964-09-28 1965-09-17 Yksipuolisesti jäähdytetty puolijohdelaite
CH1326865A CH438496A (de) 1964-09-28 1965-09-24 Einseitig gekühlte Halbleiteranordnung
GB40958/65A GB1113455A (en) 1964-09-28 1965-09-27 Improvements in semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE11583/64A SE312860B (de) 1964-09-28 1964-09-28

Publications (1)

Publication Number Publication Date
SE312860B true SE312860B (de) 1969-07-28

Family

ID=20294229

Family Applications (1)

Application Number Title Priority Date Filing Date
SE11583/64A SE312860B (de) 1964-09-28 1964-09-28

Country Status (8)

Country Link
US (1) US3377523A (de)
BE (1) BE669366A (de)
CH (1) CH438496A (de)
FI (1) FI42348C (de)
FR (1) FR1448403A (de)
GB (1) GB1113455A (de)
NL (1) NL6512144A (de)
SE (1) SE312860B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512053A (en) * 1968-01-25 1970-05-12 Asea Ab Semi-conductor device having means pressing a connector into contact with a semi-conductor disc
US3581163A (en) * 1968-04-09 1971-05-25 Gen Electric High-current semiconductor rectifier assemblies
AT310811B (de) * 1969-02-03 1973-10-25 Beteiligungs Ag Haustechnik Halbleiterelement mit Kühleinrichtung
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL203133A (de) * 1954-12-27
US3222579A (en) * 1961-03-13 1965-12-07 Mallory & Co Inc P R Semiconductor rectifier cell unit and method of utilizing the same
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device

Also Published As

Publication number Publication date
US3377523A (en) 1968-04-09
BE669366A (de) 1965-12-31
CH438496A (de) 1967-06-30
FI42348B (de) 1970-03-31
FI42348C (fi) 1970-07-10
GB1113455A (en) 1968-05-15
FR1448403A (fr) 1966-08-05
NL6512144A (de) 1966-03-29

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