DE1807615A1 - Verfahren zur Formung und Befestigung von Befestigungspunkten auf Werkstuecken - Google Patents

Verfahren zur Formung und Befestigung von Befestigungspunkten auf Werkstuecken

Info

Publication number
DE1807615A1
DE1807615A1 DE19681807615 DE1807615A DE1807615A1 DE 1807615 A1 DE1807615 A1 DE 1807615A1 DE 19681807615 DE19681807615 DE 19681807615 DE 1807615 A DE1807615 A DE 1807615A DE 1807615 A1 DE1807615 A1 DE 1807615A1
Authority
DE
Germany
Prior art keywords
workpiece
tool
metal
fastening
connection point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681807615
Other languages
German (de)
English (en)
Inventor
Dominick Jun Anthony Joseph
Slemmons John Whittier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
North American Rockwell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Rockwell Corp filed Critical North American Rockwell Corp
Publication of DE1807615A1 publication Critical patent/DE1807615A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE19681807615 1968-01-15 1968-11-07 Verfahren zur Formung und Befestigung von Befestigungspunkten auf Werkstuecken Pending DE1807615A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69784068A 1968-01-15 1968-01-15

Publications (1)

Publication Number Publication Date
DE1807615A1 true DE1807615A1 (de) 1969-08-07

Family

ID=24802795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681807615 Pending DE1807615A1 (de) 1968-01-15 1968-11-07 Verfahren zur Formung und Befestigung von Befestigungspunkten auf Werkstuecken

Country Status (5)

Country Link
US (1) US3531852A (enExample)
DE (1) DE1807615A1 (enExample)
FR (1) FR1591045A (enExample)
GB (1) GB1250469A (enExample)
NL (1) NL6816524A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996024950A1 (de) * 1995-02-11 1996-08-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur formung von anschlusshöckern auf elektrisch leitenden mikroelektronischen verbindungselementen zum lothöckerfreien tab-bonden

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706126A (en) * 1971-02-23 1972-12-19 Western Electric Co Fusion bonding
US3976240A (en) * 1973-10-09 1976-08-24 E. I. Du Pont De Nemours And Company Apparatus for applying contacts
US3926357A (en) * 1973-10-09 1975-12-16 Du Pont Process for applying contacts
US3908743A (en) * 1974-01-21 1975-09-30 Gould Inc Positive displacement casting system employing shaped electrode for effecting cosmetically perfect bonds
US4139140A (en) * 1976-09-21 1979-02-13 G. Rau Method for producing an electrical contact element
DE2642323A1 (de) * 1976-09-21 1978-03-23 Rau Fa G Kontaktkoerper und herstellungsverfahren hierzu
DE2642339C3 (de) * 1976-09-21 1980-07-24 Fa. G. Rau, 7530 Pforzheim Kontaktkörper und Herstellungsverfahren hierzu
US4319708A (en) * 1977-02-15 1982-03-16 Lomerson Robert B Mechanical bonding of surface conductive layers
US4155499A (en) * 1978-04-12 1979-05-22 Branson Ultrasonics Corporation Method of welding metallic conductors using vibratory energy
FR2523335A1 (fr) * 1982-03-10 1983-09-16 Flonic Sa Procede pour surelever les plages de contact electrique d'une carte a memoire
US4627565A (en) * 1982-03-18 1986-12-09 Lomerson Robert B Mechanical bonding of surface conductive layers
US5134460A (en) * 1986-08-11 1992-07-28 International Business Machines Corporation Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
JPS6345826A (ja) * 1986-08-11 1988-02-26 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン 半導体集積回路装置の接続構造
JPS63119552A (ja) * 1986-11-07 1988-05-24 Sharp Corp Ｌｓｉチツプ
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
US5076486A (en) * 1989-02-28 1991-12-31 Rockwell International Corporation Barrier disk
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
JP2631013B2 (ja) * 1989-04-17 1997-07-16 株式会社新川 バンプ形成方法
JP2662131B2 (ja) * 1991-12-26 1997-10-08 松下電器産業株式会社 ボンディング装置
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
DE19748288A1 (de) * 1997-10-31 1999-05-06 Kloeckner Moeller Gmbh Schaltkontaktstück für Niederspannungs-Schaltgeräte
JP3347295B2 (ja) * 1998-09-09 2002-11-20 松下電器産業株式会社 部品実装ツールとそれによる部品実装方法および装置
US20060003548A1 (en) * 2004-06-30 2006-01-05 Kobrinsky Mauro J Highly compliant plate for wafer bonding
JP2012192413A (ja) * 2011-03-15 2012-10-11 Yazaki Corp 超音波接合方法
US10981245B2 (en) * 2019-09-24 2021-04-20 GM Global Technology Operations LLC Apparatus for ultrasonic welding of polymers and polymeric composites

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703997A (en) * 1950-03-08 1955-03-15 Gen Electric Co Ltd Means for and method of cold pressure welding
US2882588A (en) * 1954-03-10 1959-04-21 Metal Specialty Company Simultaneous pressure welding and pressure forming
US3113376A (en) * 1958-07-22 1963-12-10 Texas Instruments Inc Alloying
NL301740A (enExample) * 1963-01-02 1900-01-01
US3367809A (en) * 1964-05-08 1968-02-06 Branson Instr Sonics
US3319984A (en) * 1964-10-26 1967-05-16 Sonobond Corp Welds
US3330026A (en) * 1964-12-02 1967-07-11 Corning Glass Works Semiconductor terminals and method
US3440118A (en) * 1965-12-17 1969-04-22 Branson Instr Method and apparatus for bonding together a plurality of insulated electrical conductors by sonic energy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996024950A1 (de) * 1995-02-11 1996-08-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur formung von anschlusshöckern auf elektrisch leitenden mikroelektronischen verbindungselementen zum lothöckerfreien tab-bonden

Also Published As

Publication number Publication date
GB1250469A (enExample) 1971-10-20
US3531852A (en) 1970-10-06
NL6816524A (enExample) 1969-07-17
FR1591045A (enExample) 1970-04-20

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