DE1764106A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE1764106A1
DE1764106A1 DE19681764106 DE1764106A DE1764106A1 DE 1764106 A1 DE1764106 A1 DE 1764106A1 DE 19681764106 DE19681764106 DE 19681764106 DE 1764106 A DE1764106 A DE 1764106A DE 1764106 A1 DE1764106 A1 DE 1764106A1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
layer
plate
another
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681764106
Other languages
German (de)
English (en)
Inventor
John Blake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1764106A1 publication Critical patent/DE1764106A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H10D88/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10W10/031—
    • H10W10/30—

Landscapes

  • Element Separation (AREA)
DE19681764106 1967-04-07 1968-04-03 Halbleitervorrichtung Pending DE1764106A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB05974/67A GB1162565A (en) 1967-04-07 1967-04-07 Improvements in and relating to Semiconductor Structures

Publications (1)

Publication Number Publication Date
DE1764106A1 true DE1764106A1 (de) 1971-05-06

Family

ID=10068943

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681764106 Pending DE1764106A1 (de) 1967-04-07 1968-04-03 Halbleitervorrichtung

Country Status (7)

Country Link
BE (1) BE713333A (enExample)
CH (1) CH468080A (enExample)
DE (1) DE1764106A1 (enExample)
FR (1) FR1559209A (enExample)
GB (1) GB1162565A (enExample)
NL (1) NL6804786A (enExample)
SE (1) SE331720B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2658304C2 (de) * 1975-12-24 1984-12-20 Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa Halbleitervorrichtung
US4028149A (en) * 1976-06-30 1977-06-07 Ibm Corporation Process for forming monocrystalline silicon carbide on silicon substrates
GB1548520A (en) 1976-08-27 1979-07-18 Tokyo Shibaura Electric Co Method of manufacturing a semiconductor device
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat
US6143582A (en) 1990-12-31 2000-11-07 Kopin Corporation High density electronic circuit modules
US6627953B1 (en) 1990-12-31 2003-09-30 Kopin Corporation High density electronic circuit modules
US5376561A (en) * 1990-12-31 1994-12-27 Kopin Corporation High density electronic circuit modules

Also Published As

Publication number Publication date
FR1559209A (enExample) 1969-03-07
NL6804786A (enExample) 1968-10-08
BE713333A (enExample) 1968-08-16
CH468080A (de) 1969-01-31
SE331720B (enExample) 1971-01-11
GB1162565A (en) 1969-08-27

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