DE1614834C2 - Verfahren zum Herstellen einer Halb leiteranordnung - Google Patents
Verfahren zum Herstellen einer Halb leiteranordnungInfo
- Publication number
- DE1614834C2 DE1614834C2 DE1967T0034229 DET0034229A DE1614834C2 DE 1614834 C2 DE1614834 C2 DE 1614834C2 DE 1967T0034229 DE1967T0034229 DE 1967T0034229 DE T0034229 A DET0034229 A DE T0034229A DE 1614834 C2 DE1614834 C2 DE 1614834C2
- Authority
- DE
- Germany
- Prior art keywords
- wires
- connecting wires
- cantilevered
- lead wires
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims description 45
- 239000004033 plastic Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 11
- 230000009969 flowable effect Effects 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000001721 transfer moulding Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 235000007487 Calathea allouia Nutrition 0.000 description 1
- 244000278792 Calathea allouia Species 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000013502 plastic waste Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56223966A | 1966-07-01 | 1966-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE1614834B1 DE1614834B1 (de) | 1971-11-11 |
| DE1614834C2 true DE1614834C2 (de) | 1973-12-13 |
Family
ID=24245413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1967T0034229 Expired DE1614834C2 (de) | 1966-07-01 | 1967-06-30 | Verfahren zum Herstellen einer Halb leiteranordnung |
Country Status (5)
| Country | Link |
|---|---|
| BR (1) | BR6790958D0 (enrdf_load_stackoverflow) |
| DE (1) | DE1614834C2 (enrdf_load_stackoverflow) |
| GB (1) | GB1189904A (enrdf_load_stackoverflow) |
| MY (1) | MY7300360A (enrdf_load_stackoverflow) |
| NL (1) | NL6709059A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030833B1 (enrdf_load_stackoverflow) * | 1970-03-07 | 1975-10-04 | ||
| IT8430680V0 (it) * | 1984-03-29 | 1984-03-29 | Otlav Spa | Cerniera per infissi con organi ricoperti in materia plastica atti a resistere ad agenti corrosivi. |
| NL8501394A (nl) * | 1985-05-14 | 1986-12-01 | Arbo Handel Ontwikkeling | Inrichting voor het met kunststof omhullen van elektronische componenten. |
| DE3703465C2 (de) * | 1987-02-05 | 1998-02-19 | Behr Thomson Dehnstoffregler | Verfahren zum Herstellen eines elektrischen Schaltgerätes und elektrisches Schaltgerät |
| JPH04239614A (ja) * | 1991-01-23 | 1992-08-27 | Sumitomo Electric Ind Ltd | 光モジュールの製造方法 |
| US5275765A (en) * | 1991-01-23 | 1994-01-04 | Sumitomo Electric Industries, Ltd. | Method of manufacturing an optical module using a mold die |
| CN110228162B (zh) * | 2019-07-16 | 2024-10-25 | 深圳市美思晟科技有限公司 | 一种线材自动化生产设备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1193608B (de) * | 1961-06-08 | 1965-05-26 | Elektronik M B H | Verfahren und Einrichtung zum Messen, Kontaktieren und Aufsockeln von Halbleiterkoerpern |
| DE1439477A1 (de) * | 1964-11-30 | 1969-02-20 | Siemens Ag | Verfahren zur Serienfertigung von Halbleiterbauelementen |
-
1967
- 1967-06-29 NL NL6709059A patent/NL6709059A/xx unknown
- 1967-06-30 DE DE1967T0034229 patent/DE1614834C2/de not_active Expired
- 1967-06-30 GB GB3032467A patent/GB1189904A/en not_active Expired
- 1967-06-30 BR BR19095867A patent/BR6790958D0/pt unknown
-
1973
- 1973-12-31 MY MY7300360A patent/MY7300360A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6709059A (enrdf_load_stackoverflow) | 1968-01-02 |
| MY7300360A (en) | 1973-12-31 |
| BR6790958D0 (pt) | 1973-07-19 |
| DE1614834B1 (de) | 1971-11-11 |
| GB1189904A (en) | 1970-04-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E77 | Valid patent as to the heymanns-index 1977 | ||
| 8339 | Ceased/non-payment of the annual fee |