GB1189904A - Process for Encapsulating Electronic Devices in Plastics and Devices so Produced - Google Patents

Process for Encapsulating Electronic Devices in Plastics and Devices so Produced

Info

Publication number
GB1189904A
GB1189904A GB3032467A GB3032467A GB1189904A GB 1189904 A GB1189904 A GB 1189904A GB 3032467 A GB3032467 A GB 3032467A GB 3032467 A GB3032467 A GB 3032467A GB 1189904 A GB1189904 A GB 1189904A
Authority
GB
United Kingdom
Prior art keywords
wafer
lead
wires
devices
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3032467A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1189904A publication Critical patent/GB1189904A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB3032467A 1966-07-01 1967-06-30 Process for Encapsulating Electronic Devices in Plastics and Devices so Produced Expired GB1189904A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56223966A 1966-07-01 1966-07-01

Publications (1)

Publication Number Publication Date
GB1189904A true GB1189904A (en) 1970-04-29

Family

ID=24245413

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3032467A Expired GB1189904A (en) 1966-07-01 1967-06-30 Process for Encapsulating Electronic Devices in Plastics and Devices so Produced

Country Status (5)

Country Link
BR (1) BR6790958D0 (enrdf_load_stackoverflow)
DE (1) DE1614834C2 (enrdf_load_stackoverflow)
GB (1) GB1189904A (enrdf_load_stackoverflow)
MY (1) MY7300360A (enrdf_load_stackoverflow)
NL (1) NL6709059A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030833B1 (enrdf_load_stackoverflow) * 1970-03-07 1975-10-04
EP0158831A3 (en) * 1984-03-29 1986-06-11 OTLAV S.p.A. Hinge device particularly for frames for doors, windows or the like
EP0202701A1 (en) * 1985-05-14 1986-11-26 Boschman Tooling & Systems B.V. Apparatus for encapsulating electronic components with plastics material
EP0496331A3 (en) * 1991-01-23 1993-02-24 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
US5275765A (en) * 1991-01-23 1994-01-04 Sumitomo Electric Industries, Ltd. Method of manufacturing an optical module using a mold die
CN110228162A (zh) * 2019-07-16 2019-09-13 深圳市美思晟科技有限公司 一种线材自动化生产设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703465C2 (de) * 1987-02-05 1998-02-19 Behr Thomson Dehnstoffregler Verfahren zum Herstellen eines elektrischen Schaltgerätes und elektrisches Schaltgerät

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1193608B (de) * 1961-06-08 1965-05-26 Elektronik M B H Verfahren und Einrichtung zum Messen, Kontaktieren und Aufsockeln von Halbleiterkoerpern
DE1439477A1 (de) * 1964-11-30 1969-02-20 Siemens Ag Verfahren zur Serienfertigung von Halbleiterbauelementen

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030833B1 (enrdf_load_stackoverflow) * 1970-03-07 1975-10-04
EP0158831A3 (en) * 1984-03-29 1986-06-11 OTLAV S.p.A. Hinge device particularly for frames for doors, windows or the like
EP0202701A1 (en) * 1985-05-14 1986-11-26 Boschman Tooling & Systems B.V. Apparatus for encapsulating electronic components with plastics material
EP0496331A3 (en) * 1991-01-23 1993-02-24 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
AU638372B2 (en) * 1991-01-23 1993-06-24 Sumitomo Electric Industries, Ltd. Mold die for manufacturing optical module and manufacturing method using the same
US5275765A (en) * 1991-01-23 1994-01-04 Sumitomo Electric Industries, Ltd. Method of manufacturing an optical module using a mold die
CN110228162A (zh) * 2019-07-16 2019-09-13 深圳市美思晟科技有限公司 一种线材自动化生产设备

Also Published As

Publication number Publication date
NL6709059A (enrdf_load_stackoverflow) 1968-01-02
MY7300360A (en) 1973-12-31
BR6790958D0 (pt) 1973-07-19
DE1614834C2 (de) 1973-12-13
DE1614834B1 (de) 1971-11-11

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years