DE1564416C3 - Verfahren und Vorrichtung zur Massenproduktion von Halbleiterbauelementen - Google Patents

Verfahren und Vorrichtung zur Massenproduktion von Halbleiterbauelementen

Info

Publication number
DE1564416C3
DE1564416C3 DE1564416A DE1564416A DE1564416C3 DE 1564416 C3 DE1564416 C3 DE 1564416C3 DE 1564416 A DE1564416 A DE 1564416A DE 1564416 A DE1564416 A DE 1564416A DE 1564416 C3 DE1564416 C3 DE 1564416C3
Authority
DE
Germany
Prior art keywords
tape
wires
wire
parts
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1564416A
Other languages
German (de)
English (en)
Other versions
DE1564416A1 (de
DE1564416B2 (de
Inventor
William Bethel Curry
Robert Lewis Easton Koch
Joseph Alexander Danbury Miklos
Earl Frederick Shelton Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE1564416A1 publication Critical patent/DE1564416A1/de
Publication of DE1564416B2 publication Critical patent/DE1564416B2/de
Application granted granted Critical
Publication of DE1564416C3 publication Critical patent/DE1564416C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Resistance Welding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE1564416A 1965-07-08 1966-07-06 Verfahren und Vorrichtung zur Massenproduktion von Halbleiterbauelementen Expired DE1564416C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47041065A 1965-07-08 1965-07-08

Publications (3)

Publication Number Publication Date
DE1564416A1 DE1564416A1 (de) 1972-03-30
DE1564416B2 DE1564416B2 (de) 1974-08-29
DE1564416C3 true DE1564416C3 (de) 1975-04-17

Family

ID=23867535

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1564416A Expired DE1564416C3 (de) 1965-07-08 1966-07-06 Verfahren und Vorrichtung zur Massenproduktion von Halbleiterbauelementen

Country Status (5)

Country Link
US (1) US3426423A (https=)
JP (2) JPS557701B1 (https=)
DE (1) DE1564416C3 (https=)
ES (6) ES318263A1 (https=)
GB (4) GB1171468A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497948A (en) * 1967-09-05 1970-03-03 Transistor Automation Corp Method and apparatus for sorting semi-conductor devices
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
JPS559826B2 (https=) * 1971-08-24 1980-03-12
US3793709A (en) * 1972-04-24 1974-02-26 Texas Instruments Inc Process for making a plastic-encapsulated semiconductor device
US4480150A (en) * 1982-07-12 1984-10-30 Motorola Inc. Lead frame and method
US4567642A (en) * 1984-09-28 1986-02-04 The Standard Oil Company Method of making photovoltaic modules
JPH05218276A (ja) * 1991-11-12 1993-08-27 Motorola Inc 割れにくい半導体装置およびその作製方法
EP3174088B1 (en) * 2015-11-26 2020-12-30 Siyang Grande Electronics Co., Ltd. Method of manufacturing a plastic packaged smd diode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2962058A (en) * 1953-07-06 1960-11-29 Texas Instruments Inc Apparatus for forming point contacts for transistors
US3073007A (en) * 1958-09-29 1963-01-15 Sprague Electric Co Method and means for assembling capacitors
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung

Also Published As

Publication number Publication date
ES328793A1 (es) 1967-04-16
GB1171470A (en) 1969-11-19
DE1564416A1 (de) 1972-03-30
GB1171469A (en) 1969-11-19
ES328795A1 (es) 1967-04-16
ES318263A1 (es) 1966-03-16
US3426423A (en) 1969-02-11
ES328814A1 (es) 1967-04-16
ES328792A1 (es) 1967-04-16
JPS557701B1 (https=) 1980-02-27
GB1171468A (en) 1969-11-19
GB1171467A (en) 1969-11-19
ES328794A1 (es) 1967-08-16
JPS557700B1 (https=) 1980-02-27
DE1564416B2 (de) 1974-08-29

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977