JPS557700B1 - - Google Patents

Info

Publication number
JPS557700B1
JPS557700B1 JP7424875A JP7424875A JPS557700B1 JP S557700 B1 JPS557700 B1 JP S557700B1 JP 7424875 A JP7424875 A JP 7424875A JP 7424875 A JP7424875 A JP 7424875A JP S557700 B1 JPS557700 B1 JP S557700B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7424875A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS557700B1 publication Critical patent/JPS557700B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Resistance Welding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7424875A 1965-07-08 1975-06-18 Pending JPS557700B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47041065A 1965-07-08 1965-07-08

Publications (1)

Publication Number Publication Date
JPS557700B1 true JPS557700B1 (ja) 1980-02-27

Family

ID=23867535

Family Applications (2)

Application Number Title Priority Date Filing Date
JP7424975A Pending JPS557701B1 (ja) 1965-07-08 1975-06-18
JP7424875A Pending JPS557700B1 (ja) 1965-07-08 1975-06-18

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP7424975A Pending JPS557701B1 (ja) 1965-07-08 1975-06-18

Country Status (5)

Country Link
US (1) US3426423A (ja)
JP (2) JPS557701B1 (ja)
DE (1) DE1564416C3 (ja)
ES (6) ES318263A1 (ja)
GB (4) GB1171469A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497948A (en) * 1967-09-05 1970-03-03 Transistor Automation Corp Method and apparatus for sorting semi-conductor devices
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
JPS559826B2 (ja) * 1971-08-24 1980-03-12
US3793709A (en) * 1972-04-24 1974-02-26 Texas Instruments Inc Process for making a plastic-encapsulated semiconductor device
US4480150A (en) * 1982-07-12 1984-10-30 Motorola Inc. Lead frame and method
US4567642A (en) * 1984-09-28 1986-02-04 The Standard Oil Company Method of making photovoltaic modules
JPH05218276A (ja) * 1991-11-12 1993-08-27 Motorola Inc 割れにくい半導体装置およびその作製方法
EP3174088B1 (en) * 2015-11-26 2020-12-30 Siyang Grande Electronics Co., Ltd. Method of manufacturing a plastic packaged smd diode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2962058A (en) * 1953-07-06 1960-11-29 Texas Instruments Inc Apparatus for forming point contacts for transistors
US3073007A (en) * 1958-09-29 1963-01-15 Sprague Electric Co Method and means for assembling capacitors
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung

Also Published As

Publication number Publication date
US3426423A (en) 1969-02-11
JPS557701B1 (ja) 1980-02-27
ES328792A1 (es) 1967-04-16
GB1171470A (en) 1969-11-19
ES328793A1 (es) 1967-04-16
DE1564416C3 (de) 1975-04-17
GB1171467A (en) 1969-11-19
ES328814A1 (es) 1967-04-16
DE1564416B2 (de) 1974-08-29
ES318263A1 (es) 1966-03-16
ES328795A1 (es) 1967-04-16
ES328794A1 (es) 1967-08-16
DE1564416A1 (de) 1972-03-30
GB1171468A (en) 1969-11-19
GB1171469A (en) 1969-11-19

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