DE1533342B1 - Verfahren zur Herstellung oxydationsbestaendiger Kupferlegierungen - Google Patents
Verfahren zur Herstellung oxydationsbestaendiger KupferlegierungenInfo
- Publication number
- DE1533342B1 DE1533342B1 DE19661533342 DE1533342A DE1533342B1 DE 1533342 B1 DE1533342 B1 DE 1533342B1 DE 19661533342 DE19661533342 DE 19661533342 DE 1533342 A DE1533342 A DE 1533342A DE 1533342 B1 DE1533342 B1 DE 1533342B1
- Authority
- DE
- Germany
- Prior art keywords
- alloy
- ratio
- aluminum
- oxidation
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007254 oxidation reaction Methods 0.000 title claims description 47
- 230000003647 oxidation Effects 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 28
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 17
- 230000008569 process Effects 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 90
- 239000000956 alloy Substances 0.000 claims description 90
- 239000000654 additive Substances 0.000 claims description 28
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052790 beryllium Inorganic materials 0.000 claims description 21
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 21
- 230000000996 additive effect Effects 0.000 claims description 18
- 230000001590 oxidative effect Effects 0.000 claims description 12
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 42
- 238000011282 treatment Methods 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 230000004584 weight gain Effects 0.000 description 8
- 235000019786 weight gain Nutrition 0.000 description 8
- 238000005494 tarnishing Methods 0.000 description 7
- 238000000137 annealing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229910000952 Be alloy Inorganic materials 0.000 description 3
- 229910000676 Si alloy Inorganic materials 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 3
- -1 aluminum-germanium Chemical compound 0.000 description 3
- 239000003518 caustics Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 206010037867 Rash macular Diseases 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001264 Th alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- DGRIPWYWLYDWDO-UHFFFAOYSA-N [Si][In] Chemical compound [Si][In] DGRIPWYWLYDWDO-UHFFFAOYSA-N 0.000 description 1
- YVIMHTIMVIIXBQ-UHFFFAOYSA-N [SnH3][Al] Chemical compound [SnH3][Al] YVIMHTIMVIIXBQ-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 229910002064 alloy oxide Inorganic materials 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- SOWHJXWFLFBSIK-UHFFFAOYSA-N aluminum beryllium Chemical compound [Be].[Al] SOWHJXWFLFBSIK-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052614 beryl Inorganic materials 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- SAZXSKLZZOUTCH-UHFFFAOYSA-N germanium indium Chemical compound [Ge].[In] SAZXSKLZZOUTCH-UHFFFAOYSA-N 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US436746A US3341369A (en) | 1965-03-03 | 1965-03-03 | Copper base alloys and process for preparing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1533342B1 true DE1533342B1 (de) | 1970-12-23 |
Family
ID=23733663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19661533342 Withdrawn DE1533342B1 (de) | 1965-03-03 | 1966-03-03 | Verfahren zur Herstellung oxydationsbestaendiger Kupferlegierungen |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3341369A (enrdf_load_stackoverflow) |
| BE (1) | BE698501A (enrdf_load_stackoverflow) |
| BR (1) | BR6677512D0 (enrdf_load_stackoverflow) |
| CH (1) | CH479707A (enrdf_load_stackoverflow) |
| DE (1) | DE1533342B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1135313A (enrdf_load_stackoverflow) |
| NL (1) | NL6602702A (enrdf_load_stackoverflow) |
| SE (1) | SE314571B (enrdf_load_stackoverflow) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475227A (en) * | 1966-10-04 | 1969-10-28 | Olin Mathieson | Copper base alloys and process for preparing same |
| US4113475A (en) * | 1976-04-09 | 1978-09-12 | Kennecott Copper Corporation | Tarnish resistant copper alloy |
| US4330599A (en) * | 1980-06-09 | 1982-05-18 | Olin Corporation | Composite material |
| US4362262A (en) * | 1980-06-09 | 1982-12-07 | Olin Corporation | Method of forming a composite material |
| US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
| US4461924A (en) * | 1982-01-21 | 1984-07-24 | Olin Corporation | Semiconductor casing |
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
| US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
| US4851615A (en) * | 1982-04-19 | 1989-07-25 | Olin Corporation | Printed circuit board |
| US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same |
| US4500028A (en) * | 1982-06-28 | 1985-02-19 | Olin Corporation | Method of forming a composite material having improved bond strength |
| US4429022A (en) | 1982-06-28 | 1984-01-31 | Olin Corporation | Composite material having improved bond strength |
| US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing |
| US4480262A (en) * | 1982-07-15 | 1984-10-30 | Olin Corporation | Semiconductor casing |
| US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
| US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
| US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages |
| US4500605A (en) * | 1983-02-17 | 1985-02-19 | Olin Corporation | Electrical component forming process |
| GB2152082A (en) * | 1983-12-27 | 1985-07-31 | United Technologies Corp | Enhancement of superalloy resistance to environmental degradation |
| US4577056A (en) * | 1984-04-09 | 1986-03-18 | Olin Corporation | Hermetically sealed metal package |
| US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
| US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages |
| US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
| US4769345A (en) * | 1987-03-12 | 1988-09-06 | Olin Corporation | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
| US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
| US5043222A (en) * | 1988-03-17 | 1991-08-27 | Olin Corporation | Metal sealing glass composite with matched coefficients of thermal expansion |
| US4952531A (en) * | 1988-03-17 | 1990-08-28 | Olin Corporation | Sealing glass for matched sealing of copper and copper alloys |
| US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
| US5047371A (en) * | 1988-09-02 | 1991-09-10 | Olin Corporation | Glass/ceramic sealing system |
| DE69533933T2 (de) * | 1994-02-17 | 2005-12-01 | United Technologies Corp., Hartford | Oxidationsbeständiger Bauteil auf Basis eines Titanlegierung-Substrats |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2057003A (en) * | 1934-10-17 | 1936-10-13 | Bugher Clarence | Concealed roofing nail |
| US2192495A (en) * | 1933-06-17 | 1940-03-05 | Heraeus Vacuumschmelze Ag | Beryllium-copper alloys |
| DE672170C (de) * | 1933-06-18 | 1941-05-06 | Heraeus Vacuumschmelze Akt Ges | Verguetbare Beryllium-Kupfer-Legierungen |
| DE823351C (de) * | 1943-09-08 | 1951-12-03 | Ici Ltd | Elektrischer Widerstandskoerper |
| DE833858C (de) * | 1949-09-02 | 1952-03-13 | Isabellen Huette Heusler Komm | Kupfer-Silizium-Legierung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2075002A (en) * | 1933-08-03 | 1937-03-23 | American Brass Co | Copper-silicon-aluminum alloys |
| US2075003A (en) * | 1936-07-30 | 1937-03-23 | Daniel R Hull | Copper-silicon-aluminum alloy |
| US2237774A (en) * | 1940-07-23 | 1941-04-08 | Chase Brass & Copper Co | Treating silicon copper-base alloys |
| US3259491A (en) * | 1963-05-21 | 1966-07-05 | Olin Mathieson | Copper base alloys and process for preparing same |
-
1965
- 1965-03-03 US US436746A patent/US3341369A/en not_active Expired - Lifetime
-
1966
- 1966-02-24 GB GB8191/66A patent/GB1135313A/en not_active Expired
- 1966-03-02 NL NL6602702A patent/NL6602702A/xx unknown
- 1966-03-03 CH CH302666A patent/CH479707A/de not_active IP Right Cessation
- 1966-03-03 DE DE19661533342 patent/DE1533342B1/de not_active Withdrawn
- 1966-03-03 BR BR177512/66A patent/BR6677512D0/pt unknown
- 1966-03-03 SE SE2821/66A patent/SE314571B/xx unknown
-
1967
- 1967-05-16 BE BE698501D patent/BE698501A/xx unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2192495A (en) * | 1933-06-17 | 1940-03-05 | Heraeus Vacuumschmelze Ag | Beryllium-copper alloys |
| DE672170C (de) * | 1933-06-18 | 1941-05-06 | Heraeus Vacuumschmelze Akt Ges | Verguetbare Beryllium-Kupfer-Legierungen |
| US2057003A (en) * | 1934-10-17 | 1936-10-13 | Bugher Clarence | Concealed roofing nail |
| DE823351C (de) * | 1943-09-08 | 1951-12-03 | Ici Ltd | Elektrischer Widerstandskoerper |
| DE833858C (de) * | 1949-09-02 | 1952-03-13 | Isabellen Huette Heusler Komm | Kupfer-Silizium-Legierung |
Also Published As
| Publication number | Publication date |
|---|---|
| CH479707A (de) | 1969-10-15 |
| NL6602702A (enrdf_load_stackoverflow) | 1966-09-05 |
| GB1135313A (en) | 1968-12-04 |
| US3341369A (en) | 1967-09-12 |
| BE698501A (enrdf_load_stackoverflow) | 1967-11-03 |
| BR6677512D0 (pt) | 1973-05-31 |
| SE314571B (enrdf_load_stackoverflow) | 1969-09-08 |
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