DE1533268B1 - Werkstoff fuer elektrische Kontakte auf Palladiumbasis und Verfahren zur Herstellung desselben - Google Patents
Werkstoff fuer elektrische Kontakte auf Palladiumbasis und Verfahren zur Herstellung desselbenInfo
- Publication number
- DE1533268B1 DE1533268B1 DE19661533268 DE1533268A DE1533268B1 DE 1533268 B1 DE1533268 B1 DE 1533268B1 DE 19661533268 DE19661533268 DE 19661533268 DE 1533268 A DE1533268 A DE 1533268A DE 1533268 B1 DE1533268 B1 DE 1533268B1
- Authority
- DE
- Germany
- Prior art keywords
- palladium
- contact
- lead
- organic
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
- H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4896965 | 1965-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1533268B1 true DE1533268B1 (de) | 1970-08-27 |
Family
ID=12818088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19661533268 Withdrawn DE1533268B1 (de) | 1965-08-13 | 1966-08-11 | Werkstoff fuer elektrische Kontakte auf Palladiumbasis und Verfahren zur Herstellung desselben |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3380812A (enExample) |
| DE (1) | DE1533268B1 (enExample) |
| GB (1) | GB1116788A (enExample) |
| SE (1) | SE328646B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3544856A (en) * | 1967-05-19 | 1970-12-01 | Nippon Electric Co | Sandwich-structure-type alloyed semiconductor element |
| US5225711A (en) * | 1988-12-23 | 1993-07-06 | International Business Machines Corporation | Palladium enhanced soldering and bonding of semiconductor device contacts |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2057604A (en) * | 1934-05-23 | 1936-10-13 | Gen Electric | Electrical switch contact |
| US2736830A (en) * | 1951-07-25 | 1956-02-28 | Gen Electric | Current-conveying brushes |
| US2924540A (en) * | 1958-05-23 | 1960-02-09 | Du Pont | Ceramic composition and article |
| NL298179A (enExample) * | 1962-09-20 |
-
1966
- 1966-08-04 GB GB35041/66A patent/GB1116788A/en not_active Expired
- 1966-08-04 US US570372A patent/US3380812A/en not_active Expired - Lifetime
- 1966-08-11 DE DE19661533268 patent/DE1533268B1/de not_active Withdrawn
- 1966-08-12 SE SE10933/66A patent/SE328646B/xx unknown
Non-Patent Citations (1)
| Title |
|---|
| None * |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1116788A (en) | 1968-06-12 |
| SE328646B (enExample) | 1970-09-21 |
| US3380812A (en) | 1968-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EHJ | Ceased/non-payment of the annual fee |