DE1521512B1 - Alkalisches Bad zur stromlosen Kupferabscheidung - Google Patents

Alkalisches Bad zur stromlosen Kupferabscheidung

Info

Publication number
DE1521512B1
DE1521512B1 DE19661521512 DE1521512A DE1521512B1 DE 1521512 B1 DE1521512 B1 DE 1521512B1 DE 19661521512 DE19661521512 DE 19661521512 DE 1521512 A DE1521512 A DE 1521512A DE 1521512 B1 DE1521512 B1 DE 1521512B1
Authority
DE
Germany
Prior art keywords
copper
triamine
complexing agent
radicals
copper ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19661521512
Other languages
German (de)
English (en)
Inventor
Oleh Borys Dutkewych
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE1521512B1 publication Critical patent/DE1521512B1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE19661521512 1965-11-09 1966-11-08 Alkalisches Bad zur stromlosen Kupferabscheidung Withdrawn DE1521512B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US507049A US3383224A (en) 1965-11-09 1965-11-09 Electroless copper deposition

Publications (1)

Publication Number Publication Date
DE1521512B1 true DE1521512B1 (de) 1970-06-04

Family

ID=24017059

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661521512 Withdrawn DE1521512B1 (de) 1965-11-09 1966-11-08 Alkalisches Bad zur stromlosen Kupferabscheidung

Country Status (7)

Country Link
US (1) US3383224A (ar)
BE (1) BE689534A (ar)
CH (1) CH458874A (ar)
DE (1) DE1521512B1 (ar)
FR (1) FR1498966A (ar)
GB (1) GB1097848A (ar)
NL (1) NL148947B (ar)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE731102C (de) * 1941-12-13 1943-02-03 Dr Herbert Brintzinger Verfahren zur Erzeugung metallischer UEberzuege
DE1135261B (de) * 1953-08-27 1962-08-23 Gen Am Transport Verfahren zur chemischen Vernickelung eines Gegenstandes mit katalytischer Oberflaeche
DE1154991B (de) * 1961-01-26 1963-09-26 Riedel & Co Stammloesung fuer die Herstellung und Regenerierung eines waessrigen Bades zur stromlsen Vernickelung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2329512A (en) * 1941-04-11 1943-09-14 Jr Reese F Clifford Drinking glass holder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE731102C (de) * 1941-12-13 1943-02-03 Dr Herbert Brintzinger Verfahren zur Erzeugung metallischer UEberzuege
DE1135261B (de) * 1953-08-27 1962-08-23 Gen Am Transport Verfahren zur chemischen Vernickelung eines Gegenstandes mit katalytischer Oberflaeche
DE1154991B (de) * 1961-01-26 1963-09-26 Riedel & Co Stammloesung fuer die Herstellung und Regenerierung eines waessrigen Bades zur stromlsen Vernickelung

Also Published As

Publication number Publication date
BE689534A (ar) 1967-05-09
NL148947B (nl) 1976-03-15
CH458874A (fr) 1968-06-30
NL6615822A (ar) 1967-05-10
GB1097848A (en) 1968-01-03
FR1498966A (fr) 1967-10-20
US3383224A (en) 1968-05-14

Similar Documents

Publication Publication Date Title
DE69219645T2 (de) Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung
DE1696312C2 (de) Bad zum stromlosen Abscheiden von Kupferüberzügen
DE2355581C3 (de) Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
DE1521440B2 (de) Verfahren zum Stabilisieren von Bädern für die stromlose reduktive Metallabscheidung. Aren: Photocircuits Corp., Glen Cove, N.Y. (V.St.A.)
DE2457829A1 (de) Verfahren und loesungen fuer die stromlose metallauftragung
DE1521446A1 (de) Bad und Verfahren zum Abscheiden von Kupfer
DE1621311C3 (de) Alkalisches Bad zur stromlosen Verkupferung
DE2723910C2 (de) Zusatzgemisch und dessen Verwendung für Bäder zur elektrolytischen Abscheidung von Gold oder Goldlegierungen
CH682823A5 (de) Platierungszusammensetzungen und -verfahren.
DE1496916B1 (de) Cyanidfreies,galvanisches Bad und Verfahren zum Abscheiden galvanischer UEberzuege
DE2319197B2 (de) Waessriges bad und verfahren zur galvanischen abscheidung eines duktilen, festhaftenden zinkueberzugs
DE3400670A1 (de) Waessriges goldsulfit enthaltendes galvanisches bad und verfahren zur galvanischen abscheidung von gold unter verwendung dieses bades
DE1521512B1 (de) Alkalisches Bad zur stromlosen Kupferabscheidung
DE2249037A1 (de) Verfahren zum plattieren von kupfer auf aluminium
DE1521512C (de) Alkalisches Bad zur stromlosen Kupferabscheidung
DE2414650C3 (de) Stromlos arbeitendes wässriges Verkupferungsbad
DE1621352C3 (de) Stabilisiertes alkalisches Kupferbad zur stromlosen Abscheidung von Kupfer
EP1763594B1 (de) Verfahren zur verbesserung der lötbarkeit von nickelüberzügen
DE69011549T2 (de) Elektroplattierung von Gold enthaltenden Legierungen.
DE1817355A1 (de) Bad zum Abscheiden von metallischem Kupfer ohne Stromzufuhr von aussen
DE1521490C3 (ar)
DE2023304C3 (de) Cyanidfreies galvanisches Bad
DE2807564C2 (de) Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung
DE1811607A1 (de) Verfahren zur Galvanisierung von Kunststoffen
CH680449A5 (ar)

Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee