DE1188729B - Kuehlvorrichtung fuer Halbleitergleichrichter - Google Patents

Kuehlvorrichtung fuer Halbleitergleichrichter

Info

Publication number
DE1188729B
DE1188729B DEC13317A DEC0013317A DE1188729B DE 1188729 B DE1188729 B DE 1188729B DE C13317 A DEC13317 A DE C13317A DE C0013317 A DEC0013317 A DE C0013317A DE 1188729 B DE1188729 B DE 1188729B
Authority
DE
Germany
Prior art keywords
boiling
electrodes
cooling device
cooling
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEC13317A
Other languages
German (de)
English (en)
Inventor
Charles Beurtheret
Ernest Rostas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of DE1188729B publication Critical patent/DE1188729B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DEC13317A 1955-07-06 1956-07-05 Kuehlvorrichtung fuer Halbleitergleichrichter Pending DE1188729B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1188729X 1955-07-06

Publications (1)

Publication Number Publication Date
DE1188729B true DE1188729B (de) 1965-03-11

Family

ID=9665441

Family Applications (1)

Application Number Title Priority Date Filing Date
DEC13317A Pending DE1188729B (de) 1955-07-06 1956-07-05 Kuehlvorrichtung fuer Halbleitergleichrichter

Country Status (5)

Country Link
BE (1) BE549283A (cs)
DE (1) DE1188729B (cs)
FR (1) FR1137395A (cs)
GB (1) GB791491A (cs)
NL (2) NL208738A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040869A1 (de) * 1980-10-30 1982-06-16 Robert Bosch Gmbh, 7000 Stuttgart Scheinwerfer fuer fahrzeuge, insbesondere kraftfahrzeug-scheinwerfer

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (de) * 1959-06-23 1961-05-10 Licentia Gmbh Kuehlkoerper fuer Halbleitergleichrichter
DE1277446B (de) * 1966-08-26 1968-09-12 Siemens Ag Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3834454A (en) * 1971-02-13 1974-09-10 Bbc Brown Boveri & Cie Cooling arrangement for thyristor discs
DE2341097A1 (de) * 1973-08-14 1975-02-27 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren
JPS5512740B2 (cs) * 1974-03-15 1980-04-03
JPS5241193B2 (cs) * 1974-03-16 1977-10-17
DE2417031A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891425C (de) * 1938-09-28 1953-09-28 Aeg Einrichtung zum Betrieb von Trockengleichrichtern
US2703855A (en) * 1952-07-29 1955-03-08 Licentia Gmbh Unsymmetrical conductor arrangement
DE1026434B (de) * 1954-08-03 1958-03-20 Siemens Ag p-n-Flaechengleichrichter oder -transistor fuer Starkstrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891425C (de) * 1938-09-28 1953-09-28 Aeg Einrichtung zum Betrieb von Trockengleichrichtern
US2703855A (en) * 1952-07-29 1955-03-08 Licentia Gmbh Unsymmetrical conductor arrangement
DE1026434B (de) * 1954-08-03 1958-03-20 Siemens Ag p-n-Flaechengleichrichter oder -transistor fuer Starkstrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040869A1 (de) * 1980-10-30 1982-06-16 Robert Bosch Gmbh, 7000 Stuttgart Scheinwerfer fuer fahrzeuge, insbesondere kraftfahrzeug-scheinwerfer

Also Published As

Publication number Publication date
BE549283A (cs)
NL208738A (cs)
NL96632C (cs)
FR1137395A (fr) 1957-05-28
GB791491A (en) 1958-03-05

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