DE112022003007T5 - Druckempfindliche Haftmittellage - Google Patents
Druckempfindliche Haftmittellage Download PDFInfo
- Publication number
- DE112022003007T5 DE112022003007T5 DE112022003007.0T DE112022003007T DE112022003007T5 DE 112022003007 T5 DE112022003007 T5 DE 112022003007T5 DE 112022003007 T DE112022003007 T DE 112022003007T DE 112022003007 T5 DE112022003007 T5 DE 112022003007T5
- Authority
- DE
- Germany
- Prior art keywords
- psa
- pressure
- sensitive adhesive
- layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-115928 | 2021-07-13 | ||
| JP2021115928 | 2021-07-13 | ||
| PCT/JP2022/026244 WO2023286621A1 (ja) | 2021-07-13 | 2022-06-30 | 粘着シート |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112022003007T5 true DE112022003007T5 (de) | 2024-04-11 |
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|---|---|---|---|
| DE112022003007.0T Pending DE112022003007T5 (de) | 2021-07-13 | 2022-06-30 | Druckempfindliche Haftmittellage |
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| Country | Link |
|---|---|
| JP (1) | JPWO2023286621A1 (ko) |
| KR (1) | KR20240032988A (ko) |
| CN (1) | CN117751171A (ko) |
| DE (1) | DE112022003007T5 (ko) |
| TW (1) | TW202317727A (ko) |
| WO (1) | WO2023286621A1 (ko) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308116A (ja) | 2000-04-24 | 2001-11-02 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP2001313350A (ja) | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP2007051271A (ja) | 2005-07-21 | 2007-03-01 | Nitto Denko Corp | 粘着剤組成物、両面粘着テープ、接着方法及び携帯用電子機器 |
| JP2018009050A (ja) | 2016-07-11 | 2018-01-18 | 日東電工株式会社 | 粘着シート |
| JP2021115928A (ja) | 2020-01-24 | 2021-08-10 | ナブテスコ株式会社 | 鉄道車両の中継弁の状態判定装置、鉄道車両の常用電磁弁の状態判定装置、鉄道車両の中継弁の状態判定プログラム、鉄道車両の常用電磁弁の状態判定プログラム、及び鉄道車両のブレーキ制御装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4851613B2 (ja) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープ |
| JP6904090B2 (ja) * | 2017-06-19 | 2021-07-14 | 王子ホールディングス株式会社 | 粘着シート |
| WO2020032176A1 (ja) * | 2018-08-08 | 2020-02-13 | リンテック株式会社 | 端子保護用テープ及び電磁波シールド膜付き半導体装置の製造方法 |
| JP7438740B2 (ja) * | 2019-12-13 | 2024-02-27 | 日東電工株式会社 | 半導体プロセスシート |
| DE112021005267T5 (de) * | 2020-12-07 | 2023-07-20 | Nitto Denko Corporation | Haftklebstofflage |
-
2022
- 2022-06-30 KR KR1020247004547A patent/KR20240032988A/ko unknown
- 2022-06-30 WO PCT/JP2022/026244 patent/WO2023286621A1/ja active Application Filing
- 2022-06-30 CN CN202280049378.3A patent/CN117751171A/zh active Pending
- 2022-06-30 JP JP2023535237A patent/JPWO2023286621A1/ja active Pending
- 2022-06-30 DE DE112022003007.0T patent/DE112022003007T5/de active Pending
- 2022-07-13 TW TW111126258A patent/TW202317727A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308116A (ja) | 2000-04-24 | 2001-11-02 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP2001313350A (ja) | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP2007051271A (ja) | 2005-07-21 | 2007-03-01 | Nitto Denko Corp | 粘着剤組成物、両面粘着テープ、接着方法及び携帯用電子機器 |
| JP2018009050A (ja) | 2016-07-11 | 2018-01-18 | 日東電工株式会社 | 粘着シート |
| JP2021115928A (ja) | 2020-01-24 | 2021-08-10 | ナブテスコ株式会社 | 鉄道車両の中継弁の状態判定装置、鉄道車両の常用電磁弁の状態判定装置、鉄道車両の中継弁の状態判定プログラム、鉄道車両の常用電磁弁の状態判定プログラム、及び鉄道車両のブレーキ制御装置 |
Non-Patent Citations (1)
| Title |
|---|
| Hideki Yamamoto, „SP-value fundamentals, application, and calculation method" (4. Auflage), veröffentlicht von Johokiko Co., Ltd., 3. April 2006, Seiten 66-67 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240032988A (ko) | 2024-03-12 |
| WO2023286621A1 (ja) | 2023-01-19 |
| TW202317727A (zh) | 2023-05-01 |
| CN117751171A (zh) | 2024-03-22 |
| JPWO2023286621A1 (ko) | 2023-01-19 |
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