DE112018005740A5 - Herstellung optoelektronischer Bauelemente - Google Patents
Herstellung optoelektronischer Bauelemente Download PDFInfo
- Publication number
- DE112018005740A5 DE112018005740A5 DE112018005740.2T DE112018005740T DE112018005740A5 DE 112018005740 A5 DE112018005740 A5 DE 112018005740A5 DE 112018005740 T DE112018005740 T DE 112018005740T DE 112018005740 A5 DE112018005740 A5 DE 112018005740A5
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- optoelectronic components
- optoelectronic
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/48479—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017128457.5A DE102017128457A1 (de) | 2017-11-30 | 2017-11-30 | Herstellung optoelektronischer bauelemente |
DE102017128457.5 | 2017-11-30 | ||
PCT/EP2018/082375 WO2019105862A1 (de) | 2017-11-30 | 2018-11-23 | Herstellung optoelektronischer bauelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112018005740A5 true DE112018005740A5 (de) | 2020-08-13 |
DE112018005740B4 DE112018005740B4 (de) | 2022-12-22 |
Family
ID=64556872
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017128457.5A Withdrawn DE102017128457A1 (de) | 2017-11-30 | 2017-11-30 | Herstellung optoelektronischer bauelemente |
DE112018005740.2T Active DE112018005740B4 (de) | 2017-11-30 | 2018-11-23 | Herstellung optoelektronischer Bauelemente und optoelektronisches Bauelement |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017128457.5A Withdrawn DE102017128457A1 (de) | 2017-11-30 | 2017-11-30 | Herstellung optoelektronischer bauelemente |
Country Status (5)
Country | Link |
---|---|
US (1) | US11784062B2 (de) |
JP (1) | JP7152483B2 (de) |
CN (1) | CN111448673B (de) |
DE (2) | DE102017128457A1 (de) |
WO (1) | WO2019105862A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019218501A1 (de) * | 2019-11-28 | 2021-06-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauteil für ein display und verfahren zur herstellung eines bauteils |
DE102020004863A1 (de) | 2020-08-10 | 2022-02-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauteil und herstellungsverfahren |
DE102021108604A1 (de) * | 2021-04-07 | 2022-10-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Bauelement mit strukturiertem leiterrahmen und gehäusekörper sowie verfahren zur herstellung des bauelements |
DE102021112740A1 (de) | 2021-05-17 | 2022-11-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische baugruppe und verfahren |
DE102021113592A1 (de) | 2021-05-26 | 2022-12-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauteil und paneel |
DE102021119707A1 (de) * | 2021-07-29 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Träger mit eingebetteter elektrischer verbindung, bauelement und verfahren zur herstellung eines trägers |
DE102022119750A1 (de) * | 2022-08-05 | 2024-02-08 | Ams-Osram International Gmbh | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
DE102022121519A1 (de) | 2022-08-25 | 2024-03-07 | Ams-Osram International Gmbh | Strahlung emittierendes halbleiterbauelement und verfahren zur herstellung von strahlung emittierenden halbleiterbauelementen |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3540770B2 (ja) | 2000-06-09 | 2004-07-07 | 三洋電機株式会社 | 光照射装置の製造方法 |
TW506236B (en) | 2000-06-09 | 2002-10-11 | Sanyo Electric Co | Method for manufacturing an illumination device |
US6989295B1 (en) * | 2002-01-09 | 2006-01-24 | Bridge Semiconductor Corporation | Method of making a semiconductor package device that includes an insulative housing with first and second housing portions |
JP3829325B2 (ja) * | 2002-02-07 | 2006-10-04 | 日本電気株式会社 | 半導体素子およびその製造方法並びに半導体装置の製造方法 |
JP2004119631A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Works Ltd | Ledモジュール |
JP4773048B2 (ja) | 2003-09-30 | 2011-09-14 | シチズン電子株式会社 | 発光ダイオード |
JP4768433B2 (ja) * | 2005-12-22 | 2011-09-07 | シャープ株式会社 | 光半導体装置およびそれを備えた電子機器 |
KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
JP5275642B2 (ja) * | 2008-02-12 | 2013-08-28 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
JP2009200321A (ja) * | 2008-02-22 | 2009-09-03 | Toshiba Corp | 発光装置及びその製造方法 |
JP5178393B2 (ja) * | 2008-08-20 | 2013-04-10 | シャープ株式会社 | 光学式測距センサおよび電子機器 |
JP5217800B2 (ja) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
JP2010177329A (ja) | 2009-01-28 | 2010-08-12 | Sharp Corp | 樹脂複合リードフレームとその製造方法、及びその実装体 |
DE102009015963A1 (de) * | 2009-04-02 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
WO2011122665A1 (ja) * | 2010-03-30 | 2011-10-06 | 大日本印刷株式会社 | Led用リードフレームまたは基板、半導体装置、およびled用リードフレームまたは基板の製造方法 |
JP2012124249A (ja) * | 2010-12-07 | 2012-06-28 | Toshiba Corp | Ledパッケージ及びその製造方法 |
JP5287889B2 (ja) | 2011-02-02 | 2013-09-11 | 凸版印刷株式会社 | 半導体発光装置用リードフレーム及び半導体発光装置 |
JP5920333B2 (ja) * | 2011-02-28 | 2016-05-18 | 日亜化学工業株式会社 | 発光装置 |
JP3169827U (ja) * | 2011-06-08 | 2011-08-18 | 日亜化学工業株式会社 | 発光装置 |
JP2013084700A (ja) | 2011-10-07 | 2013-05-09 | Panasonic Corp | セラミック基板と、そのセラミック基板を用いた電子部品モジュール |
JP5978631B2 (ja) | 2012-01-26 | 2016-08-24 | 日亜化学工業株式会社 | 発光装置 |
DE102012215449A1 (de) * | 2012-08-31 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektronisches bauelement, elektronische baugruppe, verfahren zum herstellen eines gehäuses für ein elektronisches bauelement und verfahren zum herstellen einer elektronischen baugruppe |
US9059379B2 (en) * | 2012-10-29 | 2015-06-16 | Advanced Semiconductor Engineering, Inc. | Light-emitting semiconductor packages and related methods |
DE102013224581A1 (de) * | 2013-11-29 | 2015-06-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
DE102014102810A1 (de) | 2014-03-04 | 2015-09-10 | Osram Opto Semiconductors Gmbh | Herstellung optoelektronischer Bauelemente |
JP6126752B2 (ja) * | 2014-08-05 | 2017-05-10 | シチズン電子株式会社 | 半導体装置及びその製造方法 |
JP6455931B2 (ja) * | 2015-06-11 | 2019-01-23 | 大口マテリアル株式会社 | Ledパッケージ及び多列型led用リードフレーム、並びにそれらの製造方法 |
DE102015109953A1 (de) * | 2015-06-22 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Herstellung elektronischer Bauelemente |
DE102015116263A1 (de) * | 2015-09-25 | 2017-03-30 | Osram Opto Semiconductors Gmbh | Herstellung eines elektronischen Bauelements |
JP6537141B2 (ja) | 2015-09-29 | 2019-07-03 | 大口マテリアル株式会社 | Ledパッケージ及び多列型led用リードフレーム、並びにそれらの製造方法 |
JP6278035B2 (ja) * | 2015-11-27 | 2018-02-14 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP6593842B2 (ja) | 2016-03-16 | 2019-10-23 | 大口マテリアル株式会社 | Ledパッケージ並びに多列型led用リードフレーム及びその製造方法 |
DE102016106270A1 (de) * | 2016-04-06 | 2017-10-12 | Osram Opto Semiconductors Gmbh | Herstellung eines halbleiterbauelements |
-
2017
- 2017-11-30 DE DE102017128457.5A patent/DE102017128457A1/de not_active Withdrawn
-
2018
- 2018-11-23 JP JP2020526365A patent/JP7152483B2/ja active Active
- 2018-11-23 DE DE112018005740.2T patent/DE112018005740B4/de active Active
- 2018-11-23 CN CN201880077776.XA patent/CN111448673B/zh active Active
- 2018-11-23 WO PCT/EP2018/082375 patent/WO2019105862A1/de active Application Filing
- 2018-11-23 US US16/765,801 patent/US11784062B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP7152483B2 (ja) | 2022-10-12 |
JP2021504938A (ja) | 2021-02-15 |
DE112018005740B4 (de) | 2022-12-22 |
US11784062B2 (en) | 2023-10-10 |
CN111448673A (zh) | 2020-07-24 |
WO2019105862A1 (de) | 2019-06-06 |
US20200287111A1 (en) | 2020-09-10 |
DE102017128457A1 (de) | 2019-06-06 |
CN111448673B (zh) | 2023-09-19 |
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