DE112018002939A5 - Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser - Google Patents
Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser Download PDFInfo
- Publication number
- DE112018002939A5 DE112018002939A5 DE112018002939.5T DE112018002939T DE112018002939A5 DE 112018002939 A5 DE112018002939 A5 DE 112018002939A5 DE 112018002939 T DE112018002939 T DE 112018002939T DE 112018002939 A5 DE112018002939 A5 DE 112018002939A5
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor laser
- operating method
- edge emitting
- emitting semiconductor
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/02—MBE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/3013—AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017112610.4A DE102017112610A1 (de) | 2017-06-08 | 2017-06-08 | Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser |
DE102017112610.4 | 2017-06-08 | ||
PCT/EP2018/064739 WO2018224483A1 (de) | 2017-06-08 | 2018-06-05 | Kantenemittierender halbleiterlaser und betriebsverfahren für einen solchen halbleiterlaser |
Publications (3)
Publication Number | Publication Date |
---|---|
DE112018002939A5 true DE112018002939A5 (de) | 2020-02-27 |
DE112018002939B4 DE112018002939B4 (de) | 2022-03-17 |
DE112018002939B9 DE112018002939B9 (de) | 2022-05-12 |
Family
ID=62563138
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017112610.4A Withdrawn DE102017112610A1 (de) | 2017-06-08 | 2017-06-08 | Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser |
DE112018008243.1T Active DE112018008243B4 (de) | 2017-06-08 | 2018-06-05 | Kantenemittierender Halbleiterlaser mit einer Schutzschichtenfolge |
DE112018002939.5T Active DE112018002939B9 (de) | 2017-06-08 | 2018-06-05 | Kantenemittierender Halbleiterlaser mit einer Schutzschichtenfolge |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017112610.4A Withdrawn DE102017112610A1 (de) | 2017-06-08 | 2017-06-08 | Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser |
DE112018008243.1T Active DE112018008243B4 (de) | 2017-06-08 | 2018-06-05 | Kantenemittierender Halbleiterlaser mit einer Schutzschichtenfolge |
Country Status (5)
Country | Link |
---|---|
US (1) | US11043791B2 (de) |
JP (2) | JP7057380B2 (de) |
CN (2) | CN113555768B (de) |
DE (3) | DE102017112610A1 (de) |
WO (1) | WO2018224483A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021187081A1 (de) * | 2020-03-17 | 2021-09-23 | ||
CN115461947A (zh) * | 2020-04-24 | 2022-12-09 | Ams-欧司朗国际有限公司 | 半导体激光器和包括半导体激光器的激光系统 |
TWI810873B (zh) * | 2022-03-29 | 2023-08-01 | 華信光電科技股份有限公司 | 具有高導熱低反射前鏡面之邊射型半導體雷射 |
Family Cites Families (37)
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JPS5939082A (ja) * | 1982-08-26 | 1984-03-03 | Sanyo Electric Co Ltd | 半導体レ−ザ |
JPS61207091A (ja) * | 1985-03-11 | 1986-09-13 | Sharp Corp | 半導体レ−ザ素子 |
JP2526277B2 (ja) * | 1988-10-24 | 1996-08-21 | 三菱電機株式会社 | 半導体レ―ザ |
JPH0715081A (ja) * | 1993-06-23 | 1995-01-17 | Hitachi Ltd | 半導体レーザ及びその製造方法 |
US5665637A (en) * | 1995-11-17 | 1997-09-09 | Lucent Technologies Inc. | Passivated faceted article comprising a semiconductor laser |
US5799028A (en) * | 1996-07-18 | 1998-08-25 | Sdl, Inc. | Passivation and protection of a semiconductor surface |
US6590920B1 (en) * | 1998-10-08 | 2003-07-08 | Adc Telecommunications, Inc. | Semiconductor lasers having single crystal mirror layers grown directly on facet |
JP3814432B2 (ja) * | 1998-12-04 | 2006-08-30 | 三菱化学株式会社 | 化合物半導体発光素子 |
JP2001156383A (ja) * | 1999-09-16 | 2001-06-08 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
JP3641403B2 (ja) * | 1999-12-15 | 2005-04-20 | シャープ株式会社 | 半導体レーザ素子及びその製造方法 |
JP2001223429A (ja) * | 2000-02-09 | 2001-08-17 | Fuji Photo Film Co Ltd | 半導体レーザ装置 |
JP2001267677A (ja) | 2000-03-17 | 2001-09-28 | Mitsubishi Electric Corp | 半導体レーザ装置およびその製造方法 |
JP4832657B2 (ja) * | 2001-04-06 | 2011-12-07 | ローム株式会社 | 半導体レーザおよびその製法 |
KR100453962B1 (ko) * | 2001-12-10 | 2004-10-20 | 엘지전자 주식회사 | 반도체 레이저 소자 및 그의 벽개면에 윈도우층을형성하는 방법 |
JP4236840B2 (ja) * | 2001-12-25 | 2009-03-11 | 富士フイルム株式会社 | 半導体レーザ素子 |
JP2003273466A (ja) * | 2002-03-15 | 2003-09-26 | Toshiba Corp | 半導体レーザ及びその製造方法 |
DE10221952B4 (de) | 2002-05-13 | 2007-07-12 | Forschungsverbund Berlin E.V. | Verfahren zur Passivierung der Spiegelflächen von optischen Halbleiterbauelementen |
JP2004140323A (ja) | 2002-08-20 | 2004-05-13 | Sharp Corp | 半導体レーザ装置およびその製造方法 |
JP4097552B2 (ja) | 2003-03-27 | 2008-06-11 | 三菱電機株式会社 | 半導体レーザ装置 |
US7829912B2 (en) * | 2006-07-31 | 2010-11-09 | Finisar Corporation | Efficient carrier injection in a semiconductor device |
JP2006339311A (ja) * | 2005-05-31 | 2006-12-14 | Fujifilm Holdings Corp | 半導体レーザ |
JP2007201373A (ja) * | 2006-01-30 | 2007-08-09 | Sharp Corp | 半導体レーザ素子 |
JP5162926B2 (ja) | 2007-03-07 | 2013-03-13 | 三菱電機株式会社 | 半導体レーザ装置の製造方法 |
DE102008018928A1 (de) | 2008-04-15 | 2009-10-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
JP2010109144A (ja) | 2008-10-30 | 2010-05-13 | Sanyo Electric Co Ltd | 半導体レーザ素子およびその製造方法 |
DE102009019516A1 (de) | 2009-04-30 | 2010-11-04 | Osram Opto Semiconductors Gmbh | Kantenemittierender Halbleiterlaser |
JP5383313B2 (ja) | 2009-05-20 | 2014-01-08 | パナソニック株式会社 | 窒化物半導体発光装置 |
DE102009054912A1 (de) * | 2009-08-28 | 2011-03-10 | M2K-Laser Gmbh | Hochleistungs-Diodenlaser und Verfahren zum Herstellen eines Hochleistungs-Diodenlasers |
US8369371B1 (en) * | 2010-10-22 | 2013-02-05 | Science Research Laboratory, Inc. | Passivated semiconductor surfaces |
JP2012227239A (ja) * | 2011-04-18 | 2012-11-15 | Sanyo Electric Co Ltd | 半導体レーザ素子 |
CN102570286A (zh) * | 2012-03-21 | 2012-07-11 | 中国工程物理研究院应用电子学研究所 | 具有高度致密钝化层半导体激光器的制备方法 |
DE102012109175B4 (de) | 2012-09-27 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode |
KR20140127034A (ko) | 2013-04-24 | 2014-11-03 | 주식회사 옵토웰 | 에지 에미팅 레이저 다이오드 및 그의 제조방법 |
WO2014191005A1 (en) * | 2013-05-31 | 2014-12-04 | Danmarks Tekniske Universitet | A wavelength tunable photon source with sealed inner volume |
DE102014102360A1 (de) * | 2014-02-24 | 2015-08-27 | Osram Opto Semiconductors Gmbh | Laserdiodenchip |
US10418781B1 (en) * | 2018-07-06 | 2019-09-17 | Ii-Vi Delaware, Inc. | Quantum well passivation structure for laser facets |
JPWO2021187081A1 (de) * | 2020-03-17 | 2021-09-23 |
-
2017
- 2017-06-08 DE DE102017112610.4A patent/DE102017112610A1/de not_active Withdrawn
-
2018
- 2018-06-05 CN CN202110710814.4A patent/CN113555768B/zh active Active
- 2018-06-05 DE DE112018008243.1T patent/DE112018008243B4/de active Active
- 2018-06-05 US US16/612,857 patent/US11043791B2/en active Active
- 2018-06-05 WO PCT/EP2018/064739 patent/WO2018224483A1/de active Application Filing
- 2018-06-05 DE DE112018002939.5T patent/DE112018002939B9/de active Active
- 2018-06-05 CN CN201880038122.6A patent/CN110731036B/zh active Active
- 2018-06-05 JP JP2019566259A patent/JP7057380B2/ja active Active
-
2022
- 2022-04-07 JP JP2022064008A patent/JP7329095B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2022091987A (ja) | 2022-06-21 |
US11043791B2 (en) | 2021-06-22 |
US20200203921A1 (en) | 2020-06-25 |
DE112018002939B4 (de) | 2022-03-17 |
CN110731036B (zh) | 2021-07-20 |
JP2020522891A (ja) | 2020-07-30 |
CN113555768A (zh) | 2021-10-26 |
CN113555768B (zh) | 2024-06-07 |
JP7329095B2 (ja) | 2023-08-17 |
DE112018002939B9 (de) | 2022-05-12 |
WO2018224483A1 (de) | 2018-12-13 |
CN110731036A (zh) | 2020-01-24 |
JP7057380B2 (ja) | 2022-04-19 |
DE112018008243B4 (de) | 2023-11-30 |
DE102017112610A1 (de) | 2018-12-13 |
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Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE |
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