ITUB20160027A1 - Procedimento per produrre dispositivi a semiconduttore e corrispondente dispositivo - Google Patents
Procedimento per produrre dispositivi a semiconduttore e corrispondente dispositivoInfo
- Publication number
- ITUB20160027A1 ITUB20160027A1 ITUB2016A000027A ITUB20160027A ITUB20160027A1 IT UB20160027 A1 ITUB20160027 A1 IT UB20160027A1 IT UB2016A000027 A ITUB2016A000027 A IT UB2016A000027A IT UB20160027 A ITUB20160027 A IT UB20160027A IT UB20160027 A1 ITUB20160027 A1 IT UB20160027A1
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- corresponding devices
- producing semiconductor
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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IT201800007967A1 (it) * | 2018-08-08 | 2020-02-08 | St Microelectronics Srl | Metodo di fabbricazione di uno strato di ridistribuzione, strato di ridistribuzione e circuito integrato includente lo strato di ridistribuzione |
IT201800007968A1 (it) * | 2018-08-08 | 2020-02-08 | St Microelectronics Srl | Metodo di fabbricazione di uno strato di ridistribuzione, strato di ridistribuzione e circuito integrato includente lo strato di ridistribuzione |
US11469194B2 (en) | 2018-08-08 | 2022-10-11 | Stmicroelectronics S.R.L. | Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer |
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US10483220B2 (en) | 2019-11-19 |
CN107026139A (zh) | 2017-08-08 |
CN206293434U (zh) | 2017-06-30 |
DE102016118655A1 (de) | 2017-08-03 |
US20170221840A1 (en) | 2017-08-03 |
CN107026139B (zh) | 2021-05-28 |
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