IT201700087174A1 - Dispositivo a semiconduttore e corrispondente metodo di fabbricazione di dispositivi a semiconduttore - Google Patents

Dispositivo a semiconduttore e corrispondente metodo di fabbricazione di dispositivi a semiconduttore

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Publication number
IT201700087174A1
IT201700087174A1 IT102017000087174A IT201700087174A IT201700087174A1 IT 201700087174 A1 IT201700087174 A1 IT 201700087174A1 IT 102017000087174 A IT102017000087174 A IT 102017000087174A IT 201700087174 A IT201700087174 A IT 201700087174A IT 201700087174 A1 IT201700087174 A1 IT 201700087174A1
Authority
IT
Italy
Prior art keywords
semiconductor
device manufacturing
corresponding device
semiconductor devices
devices
Prior art date
Application number
IT102017000087174A
Other languages
English (en)
Inventor
Samuele Sciarrillo
Ivan Venegoni
Paolo Colpani
Francesca Milanesi
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102017000087174A priority Critical patent/IT201700087174A1/it
Priority to US16/048,123 priority patent/US10593625B2/en
Publication of IT201700087174A1 publication Critical patent/IT201700087174A1/it

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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0556—Disposition
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554—External layer
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections

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