DE112013004960A5 - Optoelektronisches Bauelement mit integrierter Schutzdiode und Verfahren zu seiner Herstellung - Google Patents

Optoelektronisches Bauelement mit integrierter Schutzdiode und Verfahren zu seiner Herstellung Download PDF

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Publication number
DE112013004960A5
DE112013004960A5 DE112013004960.0T DE112013004960T DE112013004960A5 DE 112013004960 A5 DE112013004960 A5 DE 112013004960A5 DE 112013004960 T DE112013004960 T DE 112013004960T DE 112013004960 A5 DE112013004960 A5 DE 112013004960A5
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production
optoelectronic component
protective diode
integrated protective
integrated
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DE112013004960.0T
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DE112013004960B4 (de
Inventor
Jürgen Moosburger
Lutz Höppel
Norwin Von Malm
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
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    • H01L2924/11—Device type
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    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
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DE102021118706A1 (de) 2021-07-20 2023-01-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer halbleiterchip und herstellungsverfahren

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US20150294961A1 (en) 2015-10-15
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