DE102020006903A1 - Keramik-elektronikvorrichtung und herstellungsverfahren dafür - Google Patents

Keramik-elektronikvorrichtung und herstellungsverfahren dafür Download PDF

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Publication number
DE102020006903A1
DE102020006903A1 DE102020006903.7A DE102020006903A DE102020006903A1 DE 102020006903 A1 DE102020006903 A1 DE 102020006903A1 DE 102020006903 A DE102020006903 A DE 102020006903A DE 102020006903 A1 DE102020006903 A1 DE 102020006903A1
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DE
Germany
Prior art keywords
water repellent
thickness
face
multilayer chip
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020006903.7A
Other languages
German (de)
English (en)
Inventor
Kiyoshiro Yatagawa
Haruna UBUKATA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Publication of DE102020006903A1 publication Critical patent/DE102020006903A1/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE102020006903.7A 2019-11-19 2020-11-10 Keramik-elektronikvorrichtung und herstellungsverfahren dafür Pending DE102020006903A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019208881A JP7481064B2 (ja) 2019-11-19 2019-11-19 セラミック電子部品およびその製造方法
JP2019-208881 2019-11-19

Publications (1)

Publication Number Publication Date
DE102020006903A1 true DE102020006903A1 (de) 2021-05-20

Family

ID=75683504

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020006903.7A Pending DE102020006903A1 (de) 2019-11-19 2020-11-10 Keramik-elektronikvorrichtung und herstellungsverfahren dafür

Country Status (3)

Country Link
US (2) US11605506B2 (https=)
JP (1) JP7481064B2 (https=)
DE (1) DE102020006903A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7557934B2 (ja) * 2019-12-13 2024-09-30 太陽誘電株式会社 セラミック電子部品およびその製造方法
JP2022191166A (ja) * 2021-06-15 2022-12-27 太陽誘電株式会社 セラミック電子部品、実装基板配置、およびセラミック電子部品の製造方法
JP2023056764A (ja) * 2021-10-08 2023-04-20 太陽誘電株式会社 積層セラミック電子部品及び回路基板
KR102946063B1 (ko) * 2021-12-29 2026-04-01 삼성전기주식회사 적층형 전자 부품

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543462Y2 (https=) * 1986-10-28 1993-11-02
JPH1154301A (ja) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd チップ型サーミスタ
JP2001267177A (ja) * 2000-03-17 2001-09-28 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JP2002033237A (ja) 2000-07-14 2002-01-31 Matsushita Electric Ind Co Ltd セラミック電子部品およびその製造方法
JP5304800B2 (ja) 2008-12-26 2013-10-02 株式会社村田製作所 セラミック電子部品の製造方法およびセラミック電子部品
JP5768471B2 (ja) 2010-05-19 2015-08-26 株式会社村田製作所 セラミック電子部品の製造方法
JP2013026392A (ja) * 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
CN202275713U (zh) * 2011-09-09 2012-06-13 国碁电子(中山)有限公司 多层陶瓷电子元件
KR20140090466A (ko) * 2013-01-09 2014-07-17 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
JP2015115392A (ja) 2013-12-10 2015-06-22 株式会社村田製作所 積層型セラミック電子部品およびその製造方法
US9859056B2 (en) * 2014-09-30 2018-01-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP6156345B2 (ja) * 2014-12-10 2017-07-05 株式会社村田製作所 電子部品及びその製造方法
CN107210129B (zh) * 2015-01-30 2020-03-10 株式会社村田制作所 电子部件的制造方法以及电子部件
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
JP2018049882A (ja) * 2016-09-20 2018-03-29 株式会社村田製作所 積層セラミック電子部品
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
JP7358692B2 (ja) * 2018-06-15 2023-10-11 サムソン エレクトロ－メカニックス カンパニーリミテッド． キャパシタ部品及びキャパシタ部品の製造方法
KR102068805B1 (ko) * 2018-09-06 2020-01-22 삼성전기주식회사 세라믹 전자 부품
KR102293305B1 (ko) * 2019-09-18 2021-08-25 삼성전기주식회사 적층형 전자 부품

Also Published As

Publication number Publication date
US11605506B2 (en) 2023-03-14
US20210151256A1 (en) 2021-05-20
JP2021082704A (ja) 2021-05-27
US11784008B2 (en) 2023-10-10
JP7481064B2 (ja) 2024-05-10
US20230085334A1 (en) 2023-03-16

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