JP7481064B2 - セラミック電子部品およびその製造方法 - Google Patents

セラミック電子部品およびその製造方法 Download PDF

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Publication number
JP7481064B2
JP7481064B2 JP2019208881A JP2019208881A JP7481064B2 JP 7481064 B2 JP7481064 B2 JP 7481064B2 JP 2019208881 A JP2019208881 A JP 2019208881A JP 2019208881 A JP2019208881 A JP 2019208881A JP 7481064 B2 JP7481064 B2 JP 7481064B2
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JP
Japan
Prior art keywords
water repellent
thickness
external electrode
ceramic electronic
electronic component
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Application number
JP2019208881A
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English (en)
Japanese (ja)
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JP2021082704A (ja
JP2021082704A5 (https=
Inventor
清志郎 谷田川
晴菜 生方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2019208881A priority Critical patent/JP7481064B2/ja
Priority to US17/092,036 priority patent/US11605506B2/en
Priority to DE102020006903.7A priority patent/DE102020006903A1/de
Publication of JP2021082704A publication Critical patent/JP2021082704A/ja
Priority to US17/983,154 priority patent/US11784008B2/en
Publication of JP2021082704A5 publication Critical patent/JP2021082704A5/ja
Application granted granted Critical
Publication of JP7481064B2 publication Critical patent/JP7481064B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2019208881A 2019-11-19 2019-11-19 セラミック電子部品およびその製造方法 Active JP7481064B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019208881A JP7481064B2 (ja) 2019-11-19 2019-11-19 セラミック電子部品およびその製造方法
US17/092,036 US11605506B2 (en) 2019-11-19 2020-11-06 Ceramic electronic device and manufacturing method of the same
DE102020006903.7A DE102020006903A1 (de) 2019-11-19 2020-11-10 Keramik-elektronikvorrichtung und herstellungsverfahren dafür
US17/983,154 US11784008B2 (en) 2019-11-19 2022-11-08 Ceramic electronic device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019208881A JP7481064B2 (ja) 2019-11-19 2019-11-19 セラミック電子部品およびその製造方法

Publications (3)

Publication Number Publication Date
JP2021082704A JP2021082704A (ja) 2021-05-27
JP2021082704A5 JP2021082704A5 (https=) 2022-11-25
JP7481064B2 true JP7481064B2 (ja) 2024-05-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019208881A Active JP7481064B2 (ja) 2019-11-19 2019-11-19 セラミック電子部品およびその製造方法

Country Status (3)

Country Link
US (2) US11605506B2 (https=)
JP (1) JP7481064B2 (https=)
DE (1) DE102020006903A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7557934B2 (ja) * 2019-12-13 2024-09-30 太陽誘電株式会社 セラミック電子部品およびその製造方法
JP2022191166A (ja) * 2021-06-15 2022-12-27 太陽誘電株式会社 セラミック電子部品、実装基板配置、およびセラミック電子部品の製造方法
JP2023056764A (ja) * 2021-10-08 2023-04-20 太陽誘電株式会社 積層セラミック電子部品及び回路基板
KR102946063B1 (ko) * 2021-12-29 2026-04-01 삼성전기주식회사 적층형 전자 부품

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267177A (ja) 2000-03-17 2001-09-28 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JP2013026392A (ja) 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
US20130063864A1 (en) 2011-09-09 2013-03-14 Hon Hai Precision Industry Co., Ltd. Multi-layer ceramic electronic component with solder blocking layer
WO2016093153A1 (ja) 2014-12-10 2016-06-16 東光株式会社 電子部品及びその製造方法
WO2016121575A1 (ja) 2015-01-30 2016-08-04 株式会社村田製作所 電子部品の製造方法および電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543462Y2 (https=) * 1986-10-28 1993-11-02
JPH1154301A (ja) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd チップ型サーミスタ
JP2002033237A (ja) 2000-07-14 2002-01-31 Matsushita Electric Ind Co Ltd セラミック電子部品およびその製造方法
JP5304800B2 (ja) 2008-12-26 2013-10-02 株式会社村田製作所 セラミック電子部品の製造方法およびセラミック電子部品
JP5768471B2 (ja) 2010-05-19 2015-08-26 株式会社村田製作所 セラミック電子部品の製造方法
KR20140090466A (ko) * 2013-01-09 2014-07-17 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
JP2015115392A (ja) 2013-12-10 2015-06-22 株式会社村田製作所 積層型セラミック電子部品およびその製造方法
US9859056B2 (en) * 2014-09-30 2018-01-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
JP2018049882A (ja) * 2016-09-20 2018-03-29 株式会社村田製作所 積層セラミック電子部品
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
JP7358692B2 (ja) * 2018-06-15 2023-10-11 サムソン エレクトロ－メカニックス カンパニーリミテッド． キャパシタ部品及びキャパシタ部品の製造方法
KR102068805B1 (ko) * 2018-09-06 2020-01-22 삼성전기주식회사 세라믹 전자 부품
KR102293305B1 (ko) * 2019-09-18 2021-08-25 삼성전기주식회사 적층형 전자 부품

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267177A (ja) 2000-03-17 2001-09-28 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JP2013026392A (ja) 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
US20130063864A1 (en) 2011-09-09 2013-03-14 Hon Hai Precision Industry Co., Ltd. Multi-layer ceramic electronic component with solder blocking layer
WO2016093153A1 (ja) 2014-12-10 2016-06-16 東光株式会社 電子部品及びその製造方法
WO2016121575A1 (ja) 2015-01-30 2016-08-04 株式会社村田製作所 電子部品の製造方法および電子部品

Also Published As

Publication number Publication date
US11605506B2 (en) 2023-03-14
US20210151256A1 (en) 2021-05-20
JP2021082704A (ja) 2021-05-27
US11784008B2 (en) 2023-10-10
DE102020006903A1 (de) 2021-05-20
US20230085334A1 (en) 2023-03-16

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