DE102013215771B4 - Kontakthöckerverbindung sowie Kontakthöcker und Verfahren zur Herstellung einer Kontakthöckerverbindung und Anwendung des Verfahrens zur Herstellung eines einen Chip und eine Antenne umfassenden Transponders - Google Patents

Kontakthöckerverbindung sowie Kontakthöcker und Verfahren zur Herstellung einer Kontakthöckerverbindung und Anwendung des Verfahrens zur Herstellung eines einen Chip und eine Antenne umfassenden Transponders Download PDF

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DE102013215771B4
DE102013215771B4 DE102013215771.1A DE102013215771A DE102013215771B4 DE 102013215771 B4 DE102013215771 B4 DE 102013215771B4 DE 102013215771 A DE102013215771 A DE 102013215771A DE 102013215771 B4 DE102013215771 B4 DE 102013215771B4
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displacement
contact
bump
connection
edge
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DE102013215771A1 (de
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Carsten Nieland
Frank Kriebel
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Smartrac Technology GmbH
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Smartrac Technology GmbH
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
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    • G06—COMPUTING OR CALCULATING; COUNTING
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
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    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
DE102013215771.1A 2012-08-10 2013-08-09 Kontakthöckerverbindung sowie Kontakthöcker und Verfahren zur Herstellung einer Kontakthöckerverbindung und Anwendung des Verfahrens zur Herstellung eines einen Chip und eine Antenne umfassenden Transponders Active DE102013215771B4 (de)

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JP2015532780A (ja) 2015-11-12
JP6347781B2 (ja) 2018-06-27
US20150208508A1 (en) 2015-07-23
BR112015002759B1 (pt) 2021-11-03
US20140084460A1 (en) 2014-03-27
WO2014023287A2 (de) 2014-02-13
MY172360A (en) 2019-11-21
US9215809B2 (en) 2015-12-15
MX2015001754A (es) 2015-09-16
IN2015MN00491A (cg-RX-API-DMAC7.html) 2015-09-04
MX349946B (es) 2017-08-22
US10292270B2 (en) 2019-05-14
CN104737286B (zh) 2018-09-25
KR20150053902A (ko) 2015-05-19
CA2880408A1 (en) 2014-02-13
WO2014023287A3 (de) 2014-04-03
DE102013215771A1 (de) 2014-02-13
EP2883245A2 (de) 2015-06-17
EP2883245B1 (de) 2020-09-30
CN104737286A (zh) 2015-06-24
BR112015002759A2 (pt) 2017-07-04

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