DE68913053T2 - Persönliche Datenkarte und Verfahren zu ihrer Konstruktion. - Google Patents
Persönliche Datenkarte und Verfahren zu ihrer Konstruktion.Info
- Publication number
- DE68913053T2 DE68913053T2 DE68913053T DE68913053T DE68913053T2 DE 68913053 T2 DE68913053 T2 DE 68913053T2 DE 68913053 T DE68913053 T DE 68913053T DE 68913053 T DE68913053 T DE 68913053T DE 68913053 T2 DE68913053 T2 DE 68913053T2
- Authority
- DE
- Germany
- Prior art keywords
- card
- encapsulant
- personal data
- construction
- data card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K21/00—Information retrieval from punched cards designed for manual use or handling by machine; Apparatus for handling such cards, e.g. marking or correcting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/161,515 US4921160A (en) | 1988-02-29 | 1988-02-29 | Personal data card and method of constructing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68913053D1 DE68913053D1 (de) | 1994-03-24 |
DE68913053T2 true DE68913053T2 (de) | 1994-06-01 |
Family
ID=22581485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68913053T Expired - Lifetime DE68913053T2 (de) | 1988-02-29 | 1989-02-17 | Persönliche Datenkarte und Verfahren zu ihrer Konstruktion. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4921160A (de) |
EP (1) | EP0331316B1 (de) |
JP (1) | JP2859282B2 (de) |
KR (1) | KR930011096B1 (de) |
AT (1) | ATE101735T1 (de) |
CA (1) | CA1324398C (de) |
DE (1) | DE68913053T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2665281B1 (fr) * | 1990-07-30 | 1993-11-19 | Gemplus Card International | Procede de fabrication d'une carte a microcircuit et carte obtenue par ce procede. |
DE9100665U1 (de) * | 1991-01-21 | 1992-07-16 | Telbus Gesellschaft Fuer Elektronische Kommunikations-Systeme Mbh, 8057 Eching, De | |
US5272596A (en) * | 1991-06-24 | 1993-12-21 | At&T Bell Laboratories | Personal data card fabricated from a polymer thick-film circuit |
FR2745929B1 (fr) * | 1996-03-11 | 1998-04-10 | Solaic Sa | Carte a circuit integre comportant une zone desolidarisee et procede de desolidarisation d'une zone d'une carte a circuit integre |
FR2749687B1 (fr) * | 1996-06-07 | 1998-07-17 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
US5936310A (en) * | 1996-11-12 | 1999-08-10 | Micron Technology, Inc. | De-wetting material for glob top applications |
JP4108779B2 (ja) | 1996-12-27 | 2008-06-25 | ローム株式会社 | 回路チップ搭載カードおよび回路チップモジュール |
US6607135B1 (en) * | 1997-06-23 | 2003-08-19 | Rohm Co., Ltd. | Module for IC card, IC card, and method for manufacturing module for IC card |
JPH1111056A (ja) * | 1997-06-23 | 1999-01-19 | Nec Yamagata Ltd | Icカード |
FR2774197B1 (fr) * | 1998-01-26 | 2001-11-23 | Rue Cartes Et Systemes De | Procede de fabrication d'une carte a microcircuit et carte obtenue par la mise en oeuvre de ce procede |
TW484101B (en) * | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
US6248199B1 (en) | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
FR2793330B1 (fr) | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue |
US8535989B2 (en) | 2010-04-02 | 2013-09-17 | Intel Corporation | Embedded semiconductive chips in reconstituted wafers, and systems containing same |
US8937382B2 (en) | 2011-06-27 | 2015-01-20 | Intel Corporation | Secondary device integration into coreless microelectronic device packages |
US8848380B2 (en) | 2011-06-30 | 2014-09-30 | Intel Corporation | Bumpless build-up layer package warpage reduction |
US9257368B2 (en) | 2012-05-14 | 2016-02-09 | Intel Corporation | Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias |
DE112012006469B4 (de) * | 2012-06-08 | 2022-05-05 | Intel Corporation | Mikroelektronisches Gehäuse mit nicht komplanaren gekapselten mikroelektronischen Bauelementen und einer Aufbauschicht ohne Kontaktierhügel |
KR101660422B1 (ko) | 2015-12-08 | 2016-09-27 | 주식회사 이케이 | 블록형 날개를 구비한 에어레이터 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3637994A (en) * | 1970-10-19 | 1972-01-25 | Trw Inc | Active electrical card device |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
DE2920012B1 (de) * | 1979-05-17 | 1980-11-20 | Gao Ges Automation Org | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE3151408C1 (de) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit einem IC-Baustein |
JPS58210646A (ja) * | 1982-06-02 | 1983-12-07 | Kyodo Printing Co Ltd | Icチツプモ−ルド成形品 |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
US4692604A (en) * | 1984-10-25 | 1987-09-08 | American Telephone And Telegraph Company, At&T Bell Laboratories | Flexible inductor |
JPS61145696A (ja) * | 1984-12-19 | 1986-07-03 | Matsushita Electric Ind Co Ltd | Icカ−ド |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS6253895A (ja) * | 1985-08-31 | 1987-03-09 | 凸版印刷株式会社 | Icカ−ドの製造方法 |
JPS62138057U (de) * | 1986-02-26 | 1987-08-31 | ||
JPS62201295A (ja) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Icカ−ドおよびその製造方法 |
JPS62214999A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
JPH0696356B2 (ja) * | 1986-03-17 | 1994-11-30 | 三菱電機株式会社 | 薄型半導体カード |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
JPS62236793A (ja) * | 1986-04-07 | 1987-10-16 | 松下電子工業株式会社 | Icカ−ド |
JPS62249796A (ja) * | 1986-04-23 | 1987-10-30 | 共同印刷株式会社 | Icカ−ド |
JPS6337998A (ja) * | 1986-08-01 | 1988-02-18 | シ−アイ化成株式会社 | Icカ−ド及びその製造法 |
-
1988
- 1988-02-29 US US07/161,515 patent/US4921160A/en not_active Expired - Lifetime
-
1989
- 1989-01-12 CA CA000588075A patent/CA1324398C/en not_active Expired - Fee Related
- 1989-02-17 EP EP89301557A patent/EP0331316B1/de not_active Revoked
- 1989-02-17 AT AT89301557T patent/ATE101735T1/de not_active IP Right Cessation
- 1989-02-17 DE DE68913053T patent/DE68913053T2/de not_active Expired - Lifetime
- 1989-02-27 KR KR1019890002281A patent/KR930011096B1/ko not_active IP Right Cessation
- 1989-02-28 JP JP1045542A patent/JP2859282B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0331316A1 (de) | 1989-09-06 |
JP2859282B2 (ja) | 1999-02-17 |
DE68913053D1 (de) | 1994-03-24 |
CA1324398C (en) | 1993-11-16 |
EP0331316B1 (de) | 1994-02-16 |
KR930011096B1 (ko) | 1993-11-24 |
US4921160A (en) | 1990-05-01 |
KR890013588A (ko) | 1989-09-25 |
ATE101735T1 (de) | 1994-03-15 |
JPH026192A (ja) | 1990-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8328 | Change in the person/name/address of the agent |
Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN |
|
8331 | Complete revocation |