DE102008030067A1 - Werkstückträger - Google Patents

Werkstückträger Download PDF

Info

Publication number
DE102008030067A1
DE102008030067A1 DE102008030067A DE102008030067A DE102008030067A1 DE 102008030067 A1 DE102008030067 A1 DE 102008030067A1 DE 102008030067 A DE102008030067 A DE 102008030067A DE 102008030067 A DE102008030067 A DE 102008030067A DE 102008030067 A1 DE102008030067 A1 DE 102008030067A1
Authority
DE
Germany
Prior art keywords
sections
workpiece
insert
engagement groove
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008030067A
Other languages
German (de)
English (en)
Inventor
Shinzou Ayase-shi Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of DE102008030067A1 publication Critical patent/DE102008030067A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/28Work carriers for double side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE102008030067A 2007-07-02 2008-06-27 Werkstückträger Withdrawn DE102008030067A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-173987 2007-07-02
JP2007173987A JP5114113B2 (ja) 2007-07-02 2007-07-02 ワークキャリア

Publications (1)

Publication Number Publication Date
DE102008030067A1 true DE102008030067A1 (de) 2009-01-08

Family

ID=40092746

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008030067A Withdrawn DE102008030067A1 (de) 2007-07-02 2008-06-27 Werkstückträger

Country Status (4)

Country Link
JP (1) JP5114113B2 (https=)
KR (1) KR20090004521A (https=)
DE (1) DE102008030067A1 (https=)
TW (1) TW200914199A (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010179375A (ja) * 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
JP5233888B2 (ja) * 2009-07-21 2013-07-10 信越半導体株式会社 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
JP4605564B1 (ja) * 2009-09-28 2011-01-05 株式会社白崎製作所 脆性薄板研磨装置用ホルダ、およびその製造方法
KR101135744B1 (ko) * 2010-09-20 2012-04-16 주식회사 엘지실트론 웨이퍼 수용장치 및 이를 포함하는 웨이퍼 연마장치
JP2012111001A (ja) * 2010-11-25 2012-06-14 Nikon Corp ワークキャリア及び該ワークキャリアを備えた研磨装置
JP5847789B2 (ja) 2013-02-13 2016-01-27 信越半導体株式会社 両面研磨装置用キャリアの製造方法およびウエーハの両面研磨方法
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6673772B2 (ja) * 2016-07-27 2020-03-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP6800402B2 (ja) * 2016-10-06 2020-12-16 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
KR200484471Y1 (ko) * 2017-01-26 2017-09-08 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
JP6840639B2 (ja) * 2017-03-06 2021-03-10 信越半導体株式会社 両面研磨装置用キャリア
WO2018163721A1 (ja) * 2017-03-06 2018-09-13 信越半導体株式会社 両面研磨装置用キャリア
JP6792106B2 (ja) * 2017-03-30 2020-11-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP2019034357A (ja) * 2017-08-10 2019-03-07 住友電工焼結合金株式会社 ワークキャリア、両頭平面研削盤及びワークの両面研磨加工方法
KR101864155B1 (ko) * 2018-01-19 2018-06-04 (주)엔티에스엘 반도체 웨이퍼의 연마 공정에 사용되는 캐리어
JP2020191376A (ja) 2019-05-22 2020-11-26 信越半導体株式会社 両面研磨装置用キャリアおよびその製造方法
KR102199135B1 (ko) * 2019-06-27 2021-01-06 주식회사 이포스 기판 연마용 캐리어 및 이를 포함하는 기판 연마 장치
JP7276246B2 (ja) * 2020-05-19 2023-05-18 信越半導体株式会社 両面研磨装置用キャリアの製造方法及びウェーハの両面研磨方法
JP7565591B2 (ja) * 2021-01-06 2024-10-11 不二越機械工業株式会社 ウェハ研磨用キャリアおよびウェハ研磨装置
CN113510614A (zh) * 2021-08-03 2021-10-19 菲特晶(南京)电子有限公司 一种双面研磨机用游轮结构
CN115071045A (zh) * 2022-06-20 2022-09-20 王达 一种研抛载具的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000288922A (ja) 1999-03-31 2000-10-17 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP2002018708A (ja) 2000-07-10 2002-01-22 Sumitomo Bakelite Co Ltd 被研磨物保持材及びその製造方法
JP2003305637A (ja) 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
JP2006068895A (ja) 2004-08-02 2006-03-16 Showa Denko Kk 研磨用キャリア及び磁気記録媒体用シリコン基板の製造方法並びに磁気記録媒体用シリコン基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01114264U (https=) * 1988-01-29 1989-08-01

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000288922A (ja) 1999-03-31 2000-10-17 Hoya Corp 研磨用キャリア及び研磨方法並びに情報記録媒体用基板の製造方法
JP2002018708A (ja) 2000-07-10 2002-01-22 Sumitomo Bakelite Co Ltd 被研磨物保持材及びその製造方法
JP2003305637A (ja) 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
JP2006068895A (ja) 2004-08-02 2006-03-16 Showa Denko Kk 研磨用キャリア及び磁気記録媒体用シリコン基板の製造方法並びに磁気記録媒体用シリコン基板

Also Published As

Publication number Publication date
TW200914199A (en) 2009-04-01
JP5114113B2 (ja) 2013-01-09
TWI359719B (https=) 2012-03-11
KR20090004521A (ko) 2009-01-12
JP2009012086A (ja) 2009-01-22

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120103