DE102007037079A1 - Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen - Google Patents

Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen Download PDF

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Publication number
DE102007037079A1
DE102007037079A1 DE102007037079A DE102007037079A DE102007037079A1 DE 102007037079 A1 DE102007037079 A1 DE 102007037079A1 DE 102007037079 A DE102007037079 A DE 102007037079A DE 102007037079 A DE102007037079 A DE 102007037079A DE 102007037079 A1 DE102007037079 A1 DE 102007037079A1
Authority
DE
Germany
Prior art keywords
weight
silver
parts
formulation according
formulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007037079A
Other languages
German (de)
English (en)
Inventor
Matthias Dr. Boll
Stefanie Dr. Eiden
Johan Dr. Kijlstra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Deutschland AG
Original Assignee
Bayer MaterialScience AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38925689&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102007037079(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bayer MaterialScience AG filed Critical Bayer MaterialScience AG
Priority to DE102007037079A priority Critical patent/DE102007037079A1/de
Priority to ES07818947.9T priority patent/ES2660666T3/es
Priority to KR1020097008459A priority patent/KR101405656B1/ko
Priority to RU2009119426/07A priority patent/RU2009119426A/ru
Priority to JP2009533690A priority patent/JP5954922B2/ja
Priority to CA2667219A priority patent/CA2667219C/en
Priority to EP07818947.9A priority patent/EP2087490B1/de
Priority to SG2011078482A priority patent/SG176423A1/en
Priority to BRPI0718186-8A2A priority patent/BRPI0718186A2/pt
Priority to MX2009004133A priority patent/MX2009004133A/es
Priority to PCT/EP2007/008876 priority patent/WO2008049519A1/de
Priority to CN2007800394923A priority patent/CN101529531B/zh
Priority to MYPI20091643A priority patent/MY146242A/en
Priority to TW096139777A priority patent/TWI426111B/zh
Priority to US11/923,887 priority patent/US7824580B2/en
Publication of DE102007037079A1 publication Critical patent/DE102007037079A1/de
Priority to IL198335A priority patent/IL198335A/en
Priority to US12/814,050 priority patent/US7976736B2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/067—Metallic effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/298—Physical dimension

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE102007037079A 2006-10-25 2007-08-06 Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen Withdrawn DE102007037079A1 (de)

Priority Applications (17)

Application Number Priority Date Filing Date Title
DE102007037079A DE102007037079A1 (de) 2006-10-25 2007-08-06 Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
MYPI20091643A MY146242A (en) 2006-10-25 2007-10-12 Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
BRPI0718186-8A2A BRPI0718186A2 (pt) 2006-10-25 2007-10-12 Formulação aquosa contendo prata e seu uso para produzir revestimentos eletricamente condutivos ou refletivos
PCT/EP2007/008876 WO2008049519A1 (de) 2006-10-25 2007-10-12 Silberhaltige wässrige formulierung und ihre verwendung zur herstellung von elektrisch leitenden oder spiegelnden beschichtungen
RU2009119426/07A RU2009119426A (ru) 2006-10-25 2007-10-12 Водные составы, содержащие серебро, и их применение для изготовления электрически проводящих или отражающих покрытий
JP2009533690A JP5954922B2 (ja) 2006-10-25 2007-10-12 銀含有水性処方物および導電性または反射性コーティングを製造するためのその使用
CA2667219A CA2667219C (en) 2006-10-25 2007-10-12 Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
EP07818947.9A EP2087490B1 (de) 2006-10-25 2007-10-12 Silberhaltige wässrige formulierung und ihre verwendung zur herstellung von elektrisch leitenden oder spiegelnden beschichtungen
SG2011078482A SG176423A1 (en) 2006-10-25 2007-10-12 Aqueous formulation containing silver, and its use for production of electrically conductive or reflective coatings
ES07818947.9T ES2660666T3 (es) 2006-10-25 2007-10-12 Formulación acuosa que contiene plata y su utilización para la preparación de recubrimientos eléctricamente conductores o reflectantes
MX2009004133A MX2009004133A (es) 2006-10-25 2007-10-12 Formulacion acuosa que contiene plata y su uso para producir recubrimientos electricamente conductores o reflectivos.
KR1020097008459A KR101405656B1 (ko) 2006-10-25 2007-10-12 은을 함유한 수성 조성물 및 전기 전도성 또는 반사 코팅의 제조를 위한 그의 용도
CN2007800394923A CN101529531B (zh) 2006-10-25 2007-10-12 含银含水配方及其用于生产导电或反射涂层的用途
TW096139777A TWI426111B (zh) 2006-10-25 2007-10-24 含銀水性調配物及其用於製造電導性或反射性塗層之用途
US11/923,887 US7824580B2 (en) 2006-10-25 2007-10-25 Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
IL198335A IL198335A (en) 2006-10-25 2009-04-23 Aqueous compositions containing silver and their use to create conductive coatings or reflectors / goggles
US12/814,050 US7976736B2 (en) 2006-10-25 2010-06-11 Process for preparing silver-containing aqueous formulation useful for electrically conductive or reflective coatings

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006050380.5 2006-10-25
DE102006050380 2006-10-25
DE102007037079A DE102007037079A1 (de) 2006-10-25 2007-08-06 Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen

Publications (1)

Publication Number Publication Date
DE102007037079A1 true DE102007037079A1 (de) 2008-04-30

Family

ID=38925689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007037079A Withdrawn DE102007037079A1 (de) 2006-10-25 2007-08-06 Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen

Country Status (16)

Country Link
US (2) US7824580B2 (https=)
EP (1) EP2087490B1 (https=)
JP (1) JP5954922B2 (https=)
KR (1) KR101405656B1 (https=)
CN (1) CN101529531B (https=)
BR (1) BRPI0718186A2 (https=)
CA (1) CA2667219C (https=)
DE (1) DE102007037079A1 (https=)
ES (1) ES2660666T3 (https=)
IL (1) IL198335A (https=)
MX (1) MX2009004133A (https=)
MY (1) MY146242A (https=)
RU (1) RU2009119426A (https=)
SG (1) SG176423A1 (https=)
TW (1) TWI426111B (https=)
WO (1) WO2008049519A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101580659A (zh) * 2008-05-16 2009-11-18 拜尔材料科学股份公司 含有银纳米颗粒的可印刷组合物、用其生产导电性涂料的方法和所制备的涂料
WO2011037836A1 (en) * 2009-09-24 2011-03-31 E. I. Du Pont De Nemours And Company Polymer thick film silver electrode composition for use as a plating link
DE102009050199A1 (de) * 2009-10-21 2011-04-28 Giesecke & Devrient Gmbh Herstellung von Leiterstrukturen auf Kunststoff-Folien mittels Nanotinten
DE102013213629A1 (de) * 2013-07-11 2015-01-15 Technische Universität Chemnitz Verfahren zur Herstellung spritzgegossener Schaltungsträger
EP2318151B1 (de) * 2008-08-27 2017-11-22 Linden GmbH Chromglänzendes teil
EP3336135A1 (de) * 2016-12-15 2018-06-20 Leibniz-Institut für Polymerforschung Dresden e.V. Verfahren zur modifizierung von kunststoffoberflächen

Families Citing this family (75)

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KR101082146B1 (ko) * 2006-09-29 2011-11-09 주식회사 엘지화학 잉크젯 프린트용 잉크 및 상기 잉크에 사용되는 금속나노입자의 제조방법
US7952261B2 (en) 2007-06-29 2011-05-31 Bayer Materialscience Ag Electroactive polymer transducers for sensory feedback applications
WO2010011841A2 (en) * 2008-07-25 2010-01-28 Methode Electronics, Inc. Metal nanoparticle ink compositions
KR20100063536A (ko) * 2008-12-03 2010-06-11 삼성에스디아이 주식회사 발광 장치 및 이 발광 장치를 광원으로 사용하는 표시 장치
TWI406704B (zh) * 2008-12-31 2013-09-01 Ind Tech Res Inst 奈米銀分散液與其噴印墨水
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
JP5190420B2 (ja) * 2009-07-16 2013-04-24 株式会社ノリタケカンパニーリミテド 銀微粒子およびその製造方法
DE102009036162A1 (de) * 2009-07-28 2011-02-03 E.G.O. Elektro-Gerätebau GmbH Sensorelementeinrichtung
US9137902B2 (en) * 2009-08-14 2015-09-15 Xerox Corporation Process to form highly conductive feature from silver nanoparticles with reduced processing temperature
CN102034877A (zh) * 2009-09-30 2011-04-27 比亚迪股份有限公司 一种太阳能电池用导电浆料及其制备方法
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JP5918236B2 (ja) 2010-08-20 2016-05-18 ロディア オペレーションズＲｈｏｄｉａ Ｏｐｅｒａｔｉｏｎｓ ポリマー組成物、ポリマーフィルム、ポリマーゲル、ポリマーフォーム、並びに当該フィルム、ゲル及びフォームを含有する電子デバイス
CN102163471B (zh) * 2010-11-29 2012-09-05 马洋 一种太阳能电池用复合电极浆料及其制备方法
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US9384868B2 (en) * 2011-03-08 2016-07-05 Dic Corporation Water-based conductive ink for inkjet recording
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CN101529531B (zh) 2013-11-13
RU2009119426A (ru) 2010-11-27
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