CN111349918A - 一种泡沫银的制造方法及工艺应用 - Google Patents

一种泡沫银的制造方法及工艺应用 Download PDF

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CN111349918A
CN111349918A CN202010158217.0A CN202010158217A CN111349918A CN 111349918 A CN111349918 A CN 111349918A CN 202010158217 A CN202010158217 A CN 202010158217A CN 111349918 A CN111349918 A CN 111349918A
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邹敏昌
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Abstract

一种泡沫银的制造方法，包括步骤：银盐、粘合性树脂、分散剂或牛油脂肪胺或卵磷脂、去离子水混合溶解，得纳米银溶液；将维生素C与去离子水混合溶解，将粘合性树脂与去离子水混合溶解得到溶液并将溶液混合到维生素C水溶液中搅拌，将聚氨酯泡沫浸泡在此溶液中，浸泡完成后烘干，烘干后聚氨酯泡沫上有粘合性树脂和维生素C；将聚氨酯泡沫浸泡在纳米银溶液，银离子与聚氨酯泡沫上的维生素C反应生成银粒子，银粒子吸附在聚氨酯泡沫中，对聚氨酯泡沫烘干；循环对聚氨酯泡沫浸泡和烘干，使聚氨酯泡沫上具有足够厚银涂层后取出；对聚氨酯泡沫烘干，烘干完成后烧结，剩下纤维状骨架结构泡沫银。用本发明得到的泡沫银孔隙率高、通过性好、厚度可控。

Description

一种泡沫银的制造方法及工艺应用
技术领域
本发明涉及一种泡沫银的制造方法及工艺应用。
背景技术
泡沫银广泛应用于导电泡沫、屏蔽材料、导热材料中，具体地，用于电子电器产品、军工航天产品中。银的导电性能好，在极宽的频率范围内能够提供95dB以上的屏蔽效能。银具有高导电性和高导热性，用泡沫银制造快速散热器件是很多电子元器件的热管理方法。同时，泡沫银还可应用于银催化剂方面，化工、石油、制药等行业中广泛应用，因其表面积大，孔隙率高，通过性好等特点，能够代替传统的银催化剂，更高效实现化学反应的催化作用。
现有技术中，泡沫银是通过电镀或者电化学沉积，然后经过高温烧结制备而成，此种制备方法不环保、可控性差，泡沫银的厚度、通孔率等主要性能参数得不到保证，存在一定的局限性。
因此，需要进一步改进。
发明内容
本发明的目的在于提供一种泡沫银的制造方法及工艺应用，采用该方法制备的泡沫银孔隙率高、通过性好，厚度可控，无需进行电镀或者电化学沉积。
本发明的目的是这样实现的：
一种泡沫银的制造方法，包括如下步骤：
（1）将50-90份的银盐、1-10份的粘合性树脂、0.5-5份的分散剂或牛油脂肪胺或卵磷脂、与20-50份的去离子水均匀混合并溶解，得到纳米银溶液备用；
（2）将10份的维生素C与90份的去离子水混合溶解备用，将3份的粘合性树脂与97份的去离子水混合溶解得到3%固体含量的溶液并将溶液混合到维生素C的10%水溶液中搅拌均匀，将聚氨酯泡沫浸泡在此溶液中，浸泡完成后转移至干燥箱中烘干，烘干温度70-80°C，烘干后聚氨酯泡沫上残留有粘合性树脂和维生素C的混合物；
（3）将聚氨酯泡沫浸泡在步骤（1）的纳米银溶液中，发生银的氧化还原反应，纳米银溶液中的银离子与聚氨酯泡沫上的维生素C反应生成银粒子，银粒子被聚氨酯泡沫上的粘合性树脂吸附在聚氨酯泡沫的纤维中，然后对聚氨酯泡沫进行烘干；
循环步骤（3）中对聚氨酯泡沫的浸泡和烘干，使聚氨酯泡沫上具有20-50微米的银涂层后取出备用；
（4）对聚氨酯泡沫进行整体烘干，烘干温度100°C，烘干时间60min，烘干完成后，待银涂层稳定，转移至烧结炉中进行烧结，烧结温度850°C，树脂混合物、聚氨酯泡沫一同烧至完全分解，剩下纤维状骨架结构的泡沫银。
所述银盐包括硝酸银或者硫酸银或者草酸银。
所述粘合性树脂包括明胶或者聚乙烯吡咯烷酮或者阿拉伯树胶。
本发明的有益效果如下：
本发明是一种工艺简单、效果优良的泡沫银制备方法，与传统的电化学沉积然后高温烧结而形成的泡沫银，本发明的制备方法更为环保、可控性更高，制造出来的泡沫银厚度、孔隙率等主要性能参数都是可控的，工艺流程不复杂，而泡沫银的各项性能超过传统方法制备的泡沫银。
本发明采用聚氨酯泡沫作为初始骨架，浸泡纳米银溶液，经过烘干再次浸泡或浸涂，使纳米银溶液充分附着在聚氨酯泡沫的每一条纤维上，然后高温烧结，将纳米银溶液中的粘合性树脂和聚氨酯泡沫分解完全，留下来一个与聚氨酯泡沫外表一致的泡沫银成品。
具体实施方式
下面结合实施例对本发明作进一步描述。
本泡沫银的制造方法，包括如下步骤：
（1）将50-90份的银盐，优选50份、1-10份的粘合性树脂，优选2份、0.5-5份的分散剂或牛油脂肪胺或卵磷脂，优选3份、与20-50份的去离子水，优选45份均匀混合并溶解，得到纳米银溶液备用；
所述纳米银溶液是透明的或者有黄色的半透明液体，纳米银溶液能够提供后续氧化还原反应中所需要的银离子。
（2）将10份的维生素C与90份的去离子水混合溶解备用，将3份的粘合性树脂与97份的去离子水混合溶解得到3%固体含量的溶液并将溶液混合到维生素C的10%水溶液中搅拌均匀，将聚氨酯泡沫浸泡在此溶液中，浸泡完成后转移至干燥箱中烘干，烘干温度70-80°C，烘干后聚氨酯泡沫上残留有粘合性树脂和维生素C的混合物；
聚氨酯泡沫的型号、孔隙率等根据最终泡沫银产品的要求选取。
（3）将聚氨酯泡沫浸泡在步骤（1）的纳米银溶液中，发生银的氧化还原反应，纳米银溶液中的银离子与聚氨酯泡沫上的维生素C反应生成银粒子，银粒子被聚氨酯泡沫上的粘合性树脂吸附在聚氨酯泡沫的纤维中，然后对聚氨酯泡沫进行烘干；
循环步骤（3）中对聚氨酯泡沫的浸泡和烘干，使聚氨酯泡沫上具有20-50微米的银涂层后取出备用；
纳米银溶液中的银离子与聚氨酯泡沫上的维生素C反应氧化还原反应生成银粒子。
循环步骤（3）中的浸泡和烘干工序，能够使银层（银粒子在聚氨酯泡沫上逐渐吸附形成）沉积得更均匀，银层能够附着在聚氨酯泡沫的每条纤维中，银粒子借助纳米银溶液的粘合性树脂以及聚氨酯泡沫上的粘合性树脂一层叠一层地附着在聚氨酯泡沫的纤维上，形成厚度约为20-50微米的纳米银涂层，为步骤（4）中烧结时可以充分残留下来生成纤维状银块（或银片）作前工序，聚氨酯泡沫浸泡纳米银溶液是保持足够的银层厚度和均匀性的重要步骤。
（4）对聚氨酯泡沫进行整体烘干，烘干温度100°C，烘干时间60min，烘干完成后，待银涂层稳定，转移至烧结炉中进行烧结，烧结温度850°C，树脂混合物、聚氨酯泡沫一同烧至完全分解，剩下纤维状骨架结构的泡沫银，泡沫银的外表形状与原聚氨酯泡沫的外表一致。
首先，通过纳米银溶液，选用纳米银溶液而非纳米银粉粒子状分散体，通过化学还原反应直接生成纳米银附着在聚氨酯泡沫纤维上，纳米银溶液同时是具有一部份粘合性树脂的纳米银溶液。可以反复浸泡沉积烘干，再浸泡沉积再烘干，循环数次，直至聚氨酯泡沫纤维上均匀沉积银层。
进一步地，所述银盐包括硝酸银或者硫酸银或者草酸银。
进一步地，所述粘合性树脂包括明胶或者聚乙烯吡咯烷酮或者阿拉伯树胶。
形成的泡沫银均匀、比表面积大，多孔隙疏松状态使泡沫银具有接近纳米银的作用，性能优越，具有高导电性和高导热性，适用于多种电子元件、半导体及LED灯等发热导热场合，同时也可用于5G陶瓷滤波器组件的散热贴片或散热传导装置中。保持聚氨酯泡沫的孔隙率，使泡沫银的比表面积很大，也可以用于电池电极，实现快速充放电。
本发明制备的泡沫银比电镀或电化学沉积获得的泡沫银更加环保、更加快速且一致性好。同时节约生产过程中的能源消耗，根据泡沫银产品的要求，则选择相应的聚氨酯泡沫，完全利用聚氨酯泡沫的外形结构和孔隙状态、纤维丝状大小的特性，可选择空间大。
上述为本发明的优选方案，显示和描述了本发明的基本原理、主要特征和本发明的优点。本领域的技术人员应该了解本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内，本发明要求保护范围由所附的权利要求书及其等同物界定。

Claims (3)

1.一种泡沫银的制造方法，其特征在于，包括如下步骤：
（1）将50-90份的银盐、1-10份的粘合性树脂、0.5-5份的分散剂或牛油脂肪胺或卵磷脂、与20-50份的去离子水均匀混合并溶解，得到纳米银溶液备用；
（2）将10份的维生素C与90份的去离子水混合溶解备用，将3份的粘合性树脂与97份的去离子水混合溶解得到3%固体含量的溶液并将溶液混合到维生素C的10%水溶液中搅拌均匀，将聚氨酯泡沫浸泡在此溶液中，浸泡完成后转移至干燥箱中烘干，烘干温度70-80°C，烘干后聚氨酯泡沫上残留有粘合性树脂和维生素C的混合物；
（3）将聚氨酯泡沫浸泡在步骤（1）的纳米银溶液中，发生银的氧化还原反应，纳米银溶液中的银离子与聚氨酯泡沫上的维生素C反应生成银粒子，银粒子被聚氨酯泡沫上的粘合性树脂吸附在聚氨酯泡沫的纤维中，然后对聚氨酯泡沫进行烘干；
循环步骤（3）中对聚氨酯泡沫的浸泡和烘干，使聚氨酯泡沫上具有20-50微米的银涂层后取出备用；
（4）对聚氨酯泡沫进行整体烘干，烘干温度100°C，烘干时间60min，烘干完成后，待银涂层稳定，转移至烧结炉中进行烧结，烧结温度850°C，树脂混合物、聚氨酯泡沫一同烧至完全分解，剩下纤维状骨架结构的泡沫银。
2.根据权利要求1所述泡沫银的制备方法，其特征在于，所述银盐包括硝酸银或者硫酸银或者草酸银。
3.根据权利要求1所述泡沫银的制备方法，其特征在于，所述粘合性树脂包括明胶或者聚乙烯吡咯烷酮或者阿拉伯树胶。
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