DE102007027443A1 - Konfigurierbare Poliereinrichtung - Google Patents

Konfigurierbare Poliereinrichtung Download PDF

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Publication number
DE102007027443A1
DE102007027443A1 DE102007027443A DE102007027443A DE102007027443A1 DE 102007027443 A1 DE102007027443 A1 DE 102007027443A1 DE 102007027443 A DE102007027443 A DE 102007027443A DE 102007027443 A DE102007027443 A DE 102007027443A DE 102007027443 A1 DE102007027443 A1 DE 102007027443A1
Authority
DE
Germany
Prior art keywords
polishing
additional
arrangement
head
heads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007027443A
Other languages
German (de)
English (en)
Inventor
In Kwon Cupertino Jeong
David E. Los Gatos Berkstersser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komico Technology Inc
Original Assignee
Inopla Inc San Jose
Inopla Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inopla Inc San Jose, Inopla Inc filed Critical Inopla Inc San Jose
Publication of DE102007027443A1 publication Critical patent/DE102007027443A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE102007027443A 2006-06-14 2007-06-14 Konfigurierbare Poliereinrichtung Withdrawn DE102007027443A1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US81349806P 2006-06-14 2006-06-14
US60/813,498 2006-06-14
US83047206P 2006-07-13 2006-07-13
US60/830,472 2006-07-13
US84457806P 2006-09-13 2006-09-13
US60/844,578 2006-09-13

Publications (1)

Publication Number Publication Date
DE102007027443A1 true DE102007027443A1 (de) 2007-12-20

Family

ID=38690466

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007027443A Withdrawn DE102007027443A1 (de) 2006-06-14 2007-06-14 Konfigurierbare Poliereinrichtung

Country Status (3)

Country Link
JP (1) JP2007335876A (ja)
KR (1) KR100899973B1 (ja)
DE (1) DE102007027443A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011526843A (ja) * 2008-07-01 2011-10-20 アプライド マテリアルズ インコーポレイテッド モジュール式ベースプレート半導体研磨機アーキテクチャ
KR101539335B1 (ko) * 2015-03-18 2015-07-28 주식회사 티에스시 씨엠피장치용 패드컨디셔너
JP2017092347A (ja) 2015-11-13 2017-05-25 株式会社Sumco ウェーハ研磨方法
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
KR102570115B1 (ko) * 2016-10-20 2023-08-23 삼성디스플레이 주식회사 기판 연마 시스템
DE102019208704A1 (de) * 2019-06-14 2020-12-17 Siltronic Ag Einrichtung und Verfahren zum Polieren von Halbleiterscheiben

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102973A (ja) * 1985-10-28 1987-05-13 Toshiba Corp 全自動ポリシング装置
JPS63207559A (ja) * 1987-02-19 1988-08-26 Disco Abrasive Syst Ltd ウエ−ハ自動研削装置
JP2836923B2 (ja) * 1990-06-20 1998-12-14 不二越機械工業株式会社 ポリシング仕上げ装置
JPH0663862A (ja) * 1992-08-22 1994-03-08 Fujikoshi Mach Corp 研磨装置
DE19719503C2 (de) * 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung
JPH11226867A (ja) * 1998-02-16 1999-08-24 Speedfam Co Ltd 多連式研磨装置
JPH11274119A (ja) * 1998-03-19 1999-10-08 Speedfam Co Ltd ウェーハポリッシング自動化ライン装置及びウェーハポリッシング加工方法
JP4037511B2 (ja) * 1998-03-26 2008-01-23 不二越機械工業株式会社 ウェーハの研磨装置及びそのシステム
FR2776552B1 (fr) * 1998-03-31 2000-06-16 Procedes & Equipement Pour Les Machine modulaire de polissage et de planarisation de substrats
JP2000084843A (ja) * 1998-09-14 2000-03-28 Speedfam-Ipec Co Ltd 片面ポリッシング装置及び片面ポリッシング方法
US6309279B1 (en) * 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
KR20010010201A (ko) * 1999-07-16 2001-02-05 윤종용 웨이퍼 연마 장치 및 방법
JP3369145B2 (ja) * 2000-03-23 2003-01-20 株式会社東京精密 ユニット分離型研磨装置
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2003332282A (ja) 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd マルチヘッド研磨装置
JP2006524142A (ja) * 2003-04-21 2006-10-26 イノプラ インコーポレーテッド 一つ以上の研磨面を使用して半導体ウェーハを研磨するための装置及び方法
JP2004337987A (ja) * 2003-05-12 2004-12-02 Ebara Corp ポリッシング装置及び基板処理装置
JP2005131772A (ja) 2003-10-31 2005-05-26 Ebara Corp ポリッシング装置
US7238614B2 (en) 2004-11-10 2007-07-03 Inopla Inc. Methods for fabricating one or more metal damascene structures in a semiconductor wafer
JP2007067179A (ja) * 2005-08-31 2007-03-15 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨方法及び鏡面研磨システム

Also Published As

Publication number Publication date
KR100899973B1 (ko) 2009-05-28
JP2007335876A (ja) 2007-12-27
KR20070119538A (ko) 2007-12-20

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: KOMICO TECHNOLOGY INC., AUSTIN, TEX., US

8139 Disposal/non-payment of the annual fee