DE102004026990A1 - Waferebenenhäusen von optoelektronischen Bauelementen - Google Patents
Waferebenenhäusen von optoelektronischen Bauelementen Download PDFInfo
- Publication number
- DE102004026990A1 DE102004026990A1 DE102004026990A DE102004026990A DE102004026990A1 DE 102004026990 A1 DE102004026990 A1 DE 102004026990A1 DE 102004026990 A DE102004026990 A DE 102004026990A DE 102004026990 A DE102004026990 A DE 102004026990A DE 102004026990 A1 DE102004026990 A1 DE 102004026990A1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- wafer level
- optoelectronic components
- housings
- level housings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Abstract
Ein Waferebenengehäuse umfasst einen ersten Wafer, der eine Verbindungsanschlussfläche aufweist, ein optoelektronisches Bauelement auf dem ersten Wafer und einen zweiten Wafer, der eine Dichtung aufweist. Der zweite Wafer ist durch eine Verbindung zwischen der Dichtung und der Verbindungsanschlussfläche an dem ersten Wafer befestigt.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/666,363 US6953990B2 (en) | 2003-09-19 | 2003-09-19 | Wafer-level packaging of optoelectronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004026990A1 true DE102004026990A1 (de) | 2005-04-21 |
Family
ID=34313093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004026990A Withdrawn DE102004026990A1 (de) | 2003-09-19 | 2004-06-03 | Waferebenenhäusen von optoelektronischen Bauelementen |
Country Status (4)
Country | Link |
---|---|
US (2) | US6953990B2 (de) |
JP (1) | JP4889932B2 (de) |
CN (1) | CN1607682A (de) |
DE (1) | DE102004026990A1 (de) |
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-
2003
- 2003-09-19 US US10/666,363 patent/US6953990B2/en not_active Expired - Lifetime
-
2004
- 2004-06-03 DE DE102004026990A patent/DE102004026990A1/de not_active Withdrawn
- 2004-09-17 JP JP2004271043A patent/JP4889932B2/ja not_active Expired - Fee Related
- 2004-09-20 CN CNA2004100780813A patent/CN1607682A/zh active Pending
-
2005
- 2005-03-02 US US11/071,550 patent/US7422929B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050142692A1 (en) | 2005-06-30 |
US7422929B2 (en) | 2008-09-09 |
CN1607682A (zh) | 2005-04-20 |
US6953990B2 (en) | 2005-10-11 |
US20050062122A1 (en) | 2005-03-24 |
JP2005094019A (ja) | 2005-04-07 |
JP4889932B2 (ja) | 2012-03-07 |
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