DE10085092T1 - Aufbereitungsvorrichtung für eine Polierscheibe und Verfahren zum Herstellen derselben - Google Patents

Aufbereitungsvorrichtung für eine Polierscheibe und Verfahren zum Herstellen derselben

Info

Publication number
DE10085092T1
DE10085092T1 DE10085092T DE10085092T DE10085092T1 DE 10085092 T1 DE10085092 T1 DE 10085092T1 DE 10085092 T DE10085092 T DE 10085092T DE 10085092 T DE10085092 T DE 10085092T DE 10085092 T1 DE10085092 T1 DE 10085092T1
Authority
DE
Germany
Prior art keywords
producing
same
treatment device
polishing wheel
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10085092T
Other languages
English (en)
Other versions
DE10085092B4 (de
Inventor
Bum Young Myoung
Su Nam Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ehwa Diamond Industrial Co Ltd
Original Assignee
Hunatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR2019990021946U external-priority patent/KR200175263Y1/ko
Priority claimed from KR10-2000-0007082A external-priority patent/KR100387954B1/ko
Application filed by Hunatech Co Ltd filed Critical Hunatech Co Ltd
Publication of DE10085092T1 publication Critical patent/DE10085092T1/de
Application granted granted Critical
Publication of DE10085092B4 publication Critical patent/DE10085092B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE10085092T 1999-10-12 2000-10-10 Aufbereitungsvorrichtung für eine Polierscheibe und Verfahren zum Herstellen derselben Expired - Lifetime DE10085092B4 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1999/21946U 1999-10-12
KR2019990021946U KR200175263Y1 (ko) 1999-10-12 1999-10-12 화학적.기계적연마 장치의 폴리싱 패드용 콘디셔너의 구조
KR10-2000-0007082A KR100387954B1 (ko) 1999-10-12 2000-02-15 연마패드용 컨디셔너와 이의 제조방법
KR2000/7082 2000-02-15
US09/521,035 US6439986B1 (en) 1999-10-12 2000-03-08 Conditioner for polishing pad and method for manufacturing the same
PCT/KR2000/001129 WO2001026862A1 (en) 1999-10-12 2000-10-10 Conditioner for polishing pad and method for manufacturing the same

Publications (2)

Publication Number Publication Date
DE10085092T1 true DE10085092T1 (de) 2002-11-07
DE10085092B4 DE10085092B4 (de) 2007-08-16

Family

ID=27349990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085092T Expired - Lifetime DE10085092B4 (de) 1999-10-12 2000-10-10 Aufbereitungsvorrichtung für eine Polierscheibe und Verfahren zum Herstellen derselben

Country Status (5)

Country Link
US (3) US6439986B1 (de)
AU (1) AU7691900A (de)
DE (1) DE10085092B4 (de)
TW (1) TW467802B (de)
WO (1) WO2001026862A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10166653B2 (en) 2011-07-18 2019-01-01 Ehwa Diamond Industrial Co., Ltd. CMP pad conditioner
DE112012000724B4 (de) 2011-03-07 2022-03-31 Ehwa Diamond Industrial Co., Ltd. Konditionierer für ein weiches Poliertuch und Herstellungsverfahren hierfür

Families Citing this family (128)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
FR2786118B1 (fr) * 1998-11-19 2000-12-22 Lam Plan Sa Dispositif de rodage ou polissage
JP3555844B2 (ja) 1999-04-09 2004-08-18 三宅 正二郎 摺動部材およびその製造方法
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
JP2002226290A (ja) * 2000-11-29 2002-08-14 Japan Fine Ceramics Center ダイヤモンド加工体の製造方法、及び、ダイヤモンド加工体
CN100361786C (zh) * 2000-12-21 2008-01-16 新日本制铁株式会社 Cmp调节器、用于cmp调节器的硬质磨粒的排列方法以及cmp调节器的制造方法
JP2003039322A (ja) * 2001-07-31 2003-02-13 Allied Material Corp ポリシングパッドの修正用工具
US6887131B2 (en) * 2002-08-27 2005-05-03 Intel Corporation Polishing pad design
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
JP2003117833A (ja) * 2001-10-15 2003-04-23 Shin Etsu Chem Co Ltd 研磨加工板
KR100447255B1 (ko) * 2001-12-31 2004-09-07 주식회사 하이닉스반도체 입자 함침층 조성물 및 이를 이용한 연마 패드
DE10206098A1 (de) * 2002-02-13 2003-08-28 Fraunhofer Ges Forschung Konditionierwerkzeug
US6872127B2 (en) * 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US6969198B2 (en) * 2002-11-06 2005-11-29 Nissan Motor Co., Ltd. Low-friction sliding mechanism
TWI238753B (en) * 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
CN1720119A (zh) * 2003-01-15 2006-01-11 三菱麻铁里亚尔株式会社 软质材料加工用切削工具
WO2004080654A1 (en) * 2003-03-14 2004-09-23 Ebara Corporation Polishing tool and polishing apparatus
US6802761B1 (en) 2003-03-20 2004-10-12 Hitachi Global Storage Technologies Netherlands B.V. Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
JP3891433B2 (ja) * 2003-04-15 2007-03-14 日産自動車株式会社 燃料噴射弁
US8025808B2 (en) * 2003-04-25 2011-09-27 Saint-Gobain Ceramics & Plastics, Inc. Methods for machine ceramics
US7306748B2 (en) * 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
EP1479946B1 (de) * 2003-05-23 2012-12-19 Nissan Motor Co., Ltd. Kolben für eine Brennkraftmaschine
EP1631987A2 (de) * 2003-05-26 2006-03-08 Koninklijke Philips Electronics N.V. Halbleiteranordnung, verfahren und system zur authentifikation
EP1482190B1 (de) * 2003-05-27 2012-12-05 Nissan Motor Company Limited Wälzkörper
JP2005008851A (ja) * 2003-05-29 2005-01-13 Nissan Motor Co Ltd 硬質炭素薄膜付き機械加工工具用切削油及び硬質炭素薄膜付き機械加工工具
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US20050025973A1 (en) * 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
JP4863152B2 (ja) 2003-07-31 2012-01-25 日産自動車株式会社 歯車
EP1666573B1 (de) 2003-08-06 2019-05-15 Nissan Motor Company Limited Reibungsarmer gleitmechanismus und reibungsverringerungsverfahren
JP4973971B2 (ja) 2003-08-08 2012-07-11 日産自動車株式会社 摺動部材
JP2005054617A (ja) * 2003-08-08 2005-03-03 Nissan Motor Co Ltd 動弁機構
JP4117553B2 (ja) * 2003-08-13 2008-07-16 日産自動車株式会社 チェーン駆動装置
US7771821B2 (en) 2003-08-21 2010-08-10 Nissan Motor Co., Ltd. Low-friction sliding member and low-friction sliding mechanism using same
EP1508611B1 (de) 2003-08-22 2019-04-17 Nissan Motor Co., Ltd. Getriebe enthaltend eine getriebeölzusammensetzung
US20050076577A1 (en) 2003-10-10 2005-04-14 Hall Richard W.J. Abrasive tools made with a self-avoiding abrasive grain array
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US7384436B2 (en) * 2004-08-24 2008-06-10 Chien-Min Sung Polycrystalline grits and associated methods
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
CN101247923B (zh) * 2005-08-25 2010-12-08 石塚博 研磨工具及其制造方法和重制方法
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
US7410410B2 (en) * 2005-10-13 2008-08-12 Sae Magnetics (H.K.) Ltd. Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7494404B2 (en) * 2006-02-17 2009-02-24 Chien-Min Sung Tools for polishing and associated methods
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
CA2672146C (en) * 2006-12-20 2012-08-21 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining inorganic, non-metallic workpieces
JP2008229820A (ja) * 2007-03-23 2008-10-02 Elpida Memory Inc Ｃｍｐ加工用のドレッサ及びｃｍｐ加工装置並びにｃｍｐ加工用の研磨パッドのドレッシング処理方法
US7828634B2 (en) * 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
JP2010536183A (ja) 2007-08-23 2010-11-25 サンーゴバン アブレイシブズ，インコーポレイティド 次世代酸化物／金属ｃｍｐ用の最適化されたｃｍｐコンディショナー設計
CN101903131B (zh) * 2007-11-13 2013-01-02 宋健民 Cmp垫修整器
WO2009064345A2 (en) 2007-11-14 2009-05-22 Saint-Gobain Abrasives, Inc. A chemical mechanical planarization pad conditioner and methods of forming thereof
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
EP2259900A1 (de) * 2008-03-10 2010-12-15 Morgan Advanced Ceramics, Inc. Unebener cvd-diamantbeschichteter cmp-kissen-konditionierer und herstellungsverfahren
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
KR101293517B1 (ko) 2009-03-24 2013-08-07 생-고벵 아브라시프 화학적 기계적 평탄화 패드 컨디셔너로 사용되는 연마 공구
CN102484054A (zh) 2009-06-02 2012-05-30 圣戈班磨料磨具有限公司 耐腐蚀性cmp修整工件及其制造和使用方法
US20110097977A1 (en) * 2009-08-07 2011-04-28 Abrasive Technology, Inc. Multiple-sided cmp pad conditioning disk
CH701596B1 (de) * 2009-08-11 2013-08-15 Meister Abrasives Ag Abrichtwerkzeug.
US8701211B2 (en) * 2009-08-26 2014-04-15 Advanced Diamond Technologies, Inc. Method to reduce wedge effects in molded trigonal tips
CN102612734A (zh) * 2009-09-01 2012-07-25 圣戈班磨料磨具有限公司 化学机械抛光修整器
WO2011087653A1 (en) * 2009-12-22 2011-07-21 3M Innovative Properties Company Flexible abrasive article and methods of making
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
KR101161015B1 (ko) * 2010-09-10 2012-07-02 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
KR101674058B1 (ko) * 2010-10-05 2016-11-09 삼성전자 주식회사 패드 컨디셔닝 디스크, 및 프리 컨디셔너 유닛을 포함하는 ｃｍｐ 장치
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
KR101916492B1 (ko) 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
KR101144981B1 (ko) * 2011-05-17 2012-05-11 삼성전자주식회사 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법
CA2773197A1 (en) * 2012-03-27 2013-09-27 Yundong Li Electroplated super abrasive tools with the abrasive particles chemically bonded and deliberately placed, and methods for making the same
US9254548B2 (en) 2012-04-25 2016-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming diamond conditioners for CMP process
SG11201407232YA (en) * 2012-05-04 2014-12-30 Entegris Inc Cmp conditioner pads with superabrasive grit enhancement
JP6188286B2 (ja) 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
CN104736299A (zh) * 2012-08-02 2015-06-24 3M创新有限公司 具有精确成形特征部的研磨制品及其制造方法
EP2879837B1 (de) 2012-08-02 2018-09-19 3M Innovative Properties Company Schleifelementvorläufer mit formgenauen komponenten und herstellungsverfahren dafür
SG11201500713PA (en) * 2012-08-02 2015-02-27 3M Innovative Properties Co Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof
KR101392401B1 (ko) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
KR102008782B1 (ko) * 2013-01-30 2019-08-08 새솔다이아몬드공업 주식회사 패드 컨디셔너 및 그의 제조방법
US9457450B2 (en) 2013-03-08 2016-10-04 Tera Xtal Technology Corporation Pad conditioning tool
US10160092B2 (en) 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
TWI583496B (zh) * 2013-05-09 2017-05-21 中國砂輪企業股份有限公司 化學機械研磨修整器之尖點檢測方法及裝置
KR102338550B1 (ko) 2013-06-06 2021-12-14 엔테그리스, 아이엔씨. 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법
US20150044783A1 (en) * 2013-08-12 2015-02-12 Micron Technology, Inc. Methods of alleviating adverse stress effects on a wafer, and methods of forming a semiconductor device
KR102304574B1 (ko) 2014-03-21 2021-09-27 엔테그리스, 아이엔씨. 세장형 절삭 에지를 갖는 화학 기계 평탄화 패드 컨디셔너
TW201600242A (zh) * 2014-06-18 2016-01-01 Kinik Co 拋光墊修整器
CN104070467B (zh) * 2014-06-20 2016-08-17 广东工业大学 微刃磨削制品及其制备方法和应用
US10173300B1 (en) * 2014-10-06 2019-01-08 Us Synthetic Corporation Polycrystalline diamond compact, drill bit incorporating same, and methods of manufacture
JP2017537480A (ja) 2014-11-23 2017-12-14 エム キューブド テクノロジーズＭ Ｃｕｂｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ ウェハピンチャックの製造及び補修
TWI616278B (zh) * 2015-02-16 2018-03-01 China Grinding Wheel Corp 化學機械研磨修整器
JP6453666B2 (ja) 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10790181B2 (en) 2015-08-14 2020-09-29 M Cubed Technologies, Inc. Wafer chuck featuring reduced friction support surface
EP3334564B1 (de) 2015-08-14 2023-11-15 M Cubed Technologies Inc. Verfahren zur deterministischen bearbeitung einer futteroberfläche
WO2017030874A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
JP6942117B2 (ja) 2015-08-14 2021-09-29 エム キューブド テクノロジーズ， インコーポレイテッド チャック面から汚染を除去するための方法
TWI623382B (zh) * 2015-10-27 2018-05-11 中國砂輪企業股份有限公司 Hybrid chemical mechanical polishing dresser
CN107405755B (zh) * 2015-12-10 2019-03-22 联合材料公司 超硬磨料砂轮
US9849562B2 (en) * 2015-12-28 2017-12-26 Shine-File Llc And manufacture of an abrasive polishing tool
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
KR102581481B1 (ko) 2016-10-18 2023-09-21 삼성전자주식회사 화학적 기계적 연마 방법, 반도체 소자의 제조 방법, 및 반도체 제조 장치
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
TWI654049B (zh) * 2017-05-16 2019-03-21 中國砂輪企業股份有限公司 研磨工具及其製造方法
US20200164484A1 (en) * 2017-08-04 2020-05-28 3M Innovative Properties Company Microreplicated polishing surface with enhanced co-planarity
US10654150B2 (en) 2017-12-26 2020-05-19 Industrial Technology Research Institute Grinding disk and method of manufacturing the same
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3261687B2 (ja) 1994-06-09 2002-03-04 日本電信電話株式会社 パッドコンディショナー及びその製造方法
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
JPH106218A (ja) * 1996-06-27 1998-01-13 Minnesota Mining & Mfg Co <3M> ドレッシング用研磨材製品
JP2896657B2 (ja) * 1996-06-28 1999-05-31 旭ダイヤモンド工業株式会社 ドレッサ及びその製造方法
JPH1110530A (ja) 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
JPH1133911A (ja) * 1997-07-16 1999-02-09 Asahi Diamond Ind Co Ltd コンディショナ及びその製造方法
JPH11133911A (ja) 1997-10-24 1999-05-21 Canon Inc 画像形成方法及び装置
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US5997597A (en) * 1998-02-24 1999-12-07 Norton Company Abrasive tool with knurled surface
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6299508B1 (en) * 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112012000724B4 (de) 2011-03-07 2022-03-31 Ehwa Diamond Industrial Co., Ltd. Konditionierer für ein weiches Poliertuch und Herstellungsverfahren hierfür
US10166653B2 (en) 2011-07-18 2019-01-01 Ehwa Diamond Industrial Co., Ltd. CMP pad conditioner
DE112012003037B4 (de) 2011-07-18 2021-10-14 Ehwa Diamond Industrial Co., Ltd. Konditionierer für CMP-Pads

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US6439986B1 (en) 2002-08-27
US20030036341A1 (en) 2003-02-20
TW467802B (en) 2001-12-11
WO2001026862A8 (en) 2002-06-06
WO2001026862A1 (en) 2001-04-19
DE10085092B4 (de) 2007-08-16
AU7691900A (en) 2001-04-23
US20030114094A1 (en) 2003-06-19
US6699106B2 (en) 2004-03-02
US6818029B2 (en) 2004-11-16

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