CN219322633U - Thermoelectric separation structure of metal substrate - Google Patents
Thermoelectric separation structure of metal substrate Download PDFInfo
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- CN219322633U CN219322633U CN202222559672.9U CN202222559672U CN219322633U CN 219322633 U CN219322633 U CN 219322633U CN 202222559672 U CN202222559672 U CN 202222559672U CN 219322633 U CN219322633 U CN 219322633U
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Abstract
The utility model relates to a metal substrate thermoelectric separation structure in the technical field of PCB heat dissipation, which comprises a metal plate for heat dissipation and a metal foil layer for electric conduction, wherein a metal boss for heat dissipation of an electronic element on the metal substrate is convexly arranged at the upper end of the metal plate, the metal foil layer is bonded on the metal plate through corresponding prepregs in a pressing way, the metal boss is detachably arranged on the metal plate, a heat conduction column body embedded in the metal plate is arranged at the lower end of the metal boss, a heating part of the electronic element is attached to the metal boss, so that heat on the electronic element can be transferred to the metal plate through the metal boss, and the heat conduction column body is embedded in the metal plate, so that the contact area between the metal boss and the metal plate is increased, the heat transfer efficiency is further increased, the heat dissipation efficiency is further increased, and the metal bosses with different heights can be conveniently replaced through the detachable arrangement of the metal boss so as to adapt to different electronic elements.
Description
Technical Field
The utility model relates to the technical field of PCB heat dissipation, in particular to a thermoelectric separation structure of a metal substrate.
Background
In order to improve the heat dissipation effect of PCB products, the current market generally adopts high heat conduction insulating material or adopts the better metal substrate of heat dispersion as heat dissipation medium, and conventional PCBA is conducted away through the pad at the during operation, and the pad of heat conduction is then kept apart by the insulating layer, and electrically conductive then passes through the electrode and realizes, but the radiating efficiency of insulating layer is generally relatively poor for the heat on the pad can't be passed through fast the transmission of metal substrate and spread, leads to behind carrying high-power consumption electronic component, needs to be equipped with corresponding heat abstractor, and the energy consumption further promotes.
Disclosure of Invention
The present utility model is directed to solving the above-mentioned drawbacks and providing a thermoelectric separation structure for a metal substrate, which solves the above-mentioned problems in the prior art.
The object of the utility model is achieved by:
the utility model provides a thermoelectric separation structure of metal base plate, includes the metal sheet that is used for radiating and is used for electrically conductive metal foil layer, and the upper end protrusion of metal sheet is provided with the metal boss that is used for radiating the electronic component on the metal base plate, and metal foil layer passes through the prepreg pressfitting and bonds on the metal sheet, and metal boss detachably sets up on the metal sheet, and the lower extreme of metal boss is equipped with the heat conduction cylinder of embedding in the metal sheet.
In the above description, further, the outer side of the heat conducting cylinder is provided with an arc protrusion matched with the metal plate, and the outer edge of the arc protrusion is in interference fit with the positioning hole on the metal plate, so that the metal boss is fixed on the metal plate.
In the above description, a heat-conducting silicone grease layer is disposed between the heat-conducting column and the metal plate, and the heat-conducting silicone grease layer is used for ensuring heat-conducting efficiency.
Further in the above description, the height difference between the upper surface of the metal foil layer and the upper surface of the metal boss is within 8 micrometers.
In the above description, the metal boss and the metal plate were each made of red copper, and the metal foil layer was made of a 10Z copper foil layer.
In the above description, a gap for facilitating heat dissipation is provided between each metal foil layer and each metal boss.
In the above description, the heat conducting cylinder is in interference fit with the metal plate, and when the heat conducting cylinder is in use, the heat conducting cylinder is tightly matched with the positioning hole on the metal plate, so that heat can be uniformly transferred to the metal plate, and the heat conducting cylinder and the metal boss are prevented from being separated from the metal plate through the tight fit.
The utility model has the beneficial effects that: when using, laminate the heating element and the metal boss of electronic component, make the heat on the electronic component accessible metal boss transfer to metal sheet department, and through the setting of heat conduction cylinder embedding in the metal sheet to increase the area of contact of metal boss and metal sheet, further increase heat transfer efficiency, further increase radiating efficiency, and the detachable setting of metal boss can be convenient for change the metal boss of not co-altitude, with the different electronic component of adaptation.
Drawings
FIG. 1 is a schematic cross-sectional view of a thermoelectric separation structure of a metal substrate according to a first embodiment;
FIG. 2 is a schematic cross-sectional view of a thermoelectric separation structure of a metal substrate according to a second embodiment;
the reference numerals in the drawings are respectively: the heat-conducting metal plate comprises a 1-metal plate, a 101-positioning hole, a 2-metal foil layer, a 3-metal boss, 301-heat-conducting columns, 302-arc protrusions, 4-prepregs, 5-gaps and 6-heat-conducting silicone grease layers.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the detailed description.
Embodiment one:
referring to fig. 1, a thermoelectric separation structure of a metal substrate in the embodiment includes a metal plate 1 for heat dissipation and a metal foil layer 2 for electrical conduction, wherein a metal boss 3 for heat dissipation of an electronic component on the metal substrate is protruding from an upper end of the metal plate 1, the metal foil layer 2 is bonded on the metal plate 1 by lamination of a prepreg 4, the metal boss 3 is detachably disposed on the metal plate 1, a heat conducting column 301 embedded in the metal plate 1 is disposed at a lower end of the metal boss 3, a positioning hole 101 on the metal plate 1 is made by a chemical liquid corrosion method, and when in use, a heating component of the electronic component is attached to the metal boss 3, so that heat on the electronic component can be transferred to the metal plate 1 through the metal boss 3, and the heat conducting column 301 is embedded in the metal plate 1, so as to increase a contact area between the metal boss 3 and the metal plate 1, further increase heat transfer efficiency, further increase heat dissipation efficiency, and the metal boss 3 with different heights can be conveniently replaced by the detachable arrangement of the metal boss 3, so as to adapt to different electronic components.
The height fall between the upper surface of the metal foil layer 2 and the upper surface of the metal boss 3 is 8 micrometers, the metal boss 3 and the metal plate 1 are both composed of red copper, the metal foil layer 2 is composed of a copper foil layer with the thickness of 10Z, in the PCB industry, the thickness of 10Z is achieved by uniformly spreading copper with the weight of 10Z on an area of one square foot, the 10Z is mainly selected for avoiding the problem of lamination wrinkling, and a gap 5 which is beneficial to heat dissipation is arranged between each metal foil layer 2 and each metal boss 3.
The heat conduction cylinder 301 is in interference fit with the metal plate 1, and when the heat conduction cylinder 301 is in use, the heat conduction cylinder 301 is in close fit with the positioning holes 101 in the metal plate 1, so that heat can be uniformly transferred to the metal plate 1, and the heat conduction cylinder 301 and the metal boss 3 are prevented from being separated from the metal plate 1 through close fit.
Embodiment two:
the difference between this embodiment and the first embodiment lies in the heat-conducting column 301, referring specifically to fig. 2, an arc protrusion 302 for being matched with the metal plate 1 is provided on the outer side of the heat-conducting column 301, and the outer edge of the arc protrusion 302 is in interference fit with the positioning hole 101 on the metal plate 1, so that the metal boss 3 is fixed on the metal plate 1, a heat-conducting silicone grease layer 6 is provided between the heat-conducting column 301 and the metal plate 1, and the heat-conducting silicone grease layer 6 is used for ensuring heat-conducting efficiency.
The present utility model is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present utility model.
Claims (7)
1. The utility model provides a thermoelectric separation structure of metal base plate, is including the metal sheet that is used for radiating and the metal foil layer that is used for electrically conductive, and the upper end protrusion of metal sheet is provided with the metal boss that is used for radiating the electronic component on the metal base plate, and the metal foil layer passes through prepreg pressfitting bonding on the metal sheet, its characterized in that: the metal boss is detachably arranged on the metal plate, and a heat conduction column body embedded in the metal plate is arranged at the lower end of the metal boss.
2. The metal substrate thermoelectric separation structure of claim 1, wherein: the outside of heat conduction cylinder is equipped with the circular arc arch that is used for with the metal sheet complex.
3. A metal substrate thermoelectric separation structure according to claim 1 or 2, characterized in that: and a heat-conducting silicone grease layer is arranged between the heat-conducting column body and the metal plate.
4. The metal substrate thermoelectric separation structure of claim 1, wherein: the height difference between the upper surface of the metal foil layer and the upper surface of the metal boss is within 8 microns.
5. The metal substrate thermoelectric separation structure of claim 1, wherein: the metal boss and the metal plate are both composed of red copper, and the metal foil layer is composed of a 10Z copper foil layer.
6. The metal substrate thermoelectric separation structure of claim 1, wherein: gaps which are favorable for heat dissipation are arranged between each metal foil layer and each metal boss.
7. A metal substrate thermoelectric separation structure according to claim 1 or 4 or 5 or 6, characterized in that: the heat conduction cylinder is in interference fit with the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222559672.9U CN219322633U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric separation structure of metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222559672.9U CN219322633U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric separation structure of metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219322633U true CN219322633U (en) | 2023-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222559672.9U Active CN219322633U (en) | 2022-09-27 | 2022-09-27 | Thermoelectric separation structure of metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219322633U (en) |
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2022
- 2022-09-27 CN CN202222559672.9U patent/CN219322633U/en active Active
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