CN211700228U - 结合层结构 - Google Patents

结合层结构 Download PDF

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Publication number
CN211700228U
CN211700228U CN201921479845.8U CN201921479845U CN211700228U CN 211700228 U CN211700228 U CN 211700228U CN 201921479845 U CN201921479845 U CN 201921479845U CN 211700228 U CN211700228 U CN 211700228U
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CN
China
Prior art keywords
bonding layer
diameter
layer structure
opening
bonding
Prior art date
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Active
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CN201921479845.8U
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English (en)
Chinese (zh)
Inventor
V·D·帕克荷
R·A·林德利
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y10T428/24339—Keyed

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Flanged Joints, Insulating Joints, And Other Joints (AREA)
  • Ceramic Products (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN201921479845.8U 2017-10-03 2018-09-28 结合层结构 Active CN211700228U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/724,045 2017-10-03
US15/724,045 US10688750B2 (en) 2017-10-03 2017-10-03 Bonding structure of E chuck to aluminum base configuration
CN201821592086.1U CN209461436U (zh) 2017-10-03 2018-09-28 结合层结构

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201821592086.1U Division CN209461436U (zh) 2017-10-03 2018-09-28 结合层结构

Publications (1)

Publication Number Publication Date
CN211700228U true CN211700228U (zh) 2020-10-16

Family

ID=65896401

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201921479845.8U Active CN211700228U (zh) 2017-10-03 2018-09-28 结合层结构
CN201821592086.1U Active CN209461436U (zh) 2017-10-03 2018-09-28 结合层结构
CN202510891131.1A Pending CN120727644A (zh) 2017-10-03 2018-09-28 E吸盘与铝基构造的结合结构
CN201811139451.8A Active CN109599356B (zh) 2017-10-03 2018-09-28 E吸盘与铝基构造的结合结构

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201821592086.1U Active CN209461436U (zh) 2017-10-03 2018-09-28 结合层结构
CN202510891131.1A Pending CN120727644A (zh) 2017-10-03 2018-09-28 E吸盘与铝基构造的结合结构
CN201811139451.8A Active CN109599356B (zh) 2017-10-03 2018-09-28 E吸盘与铝基构造的结合结构

Country Status (5)

Country Link
US (3) US10688750B2 (enExample)
JP (3) JP7353024B2 (enExample)
KR (2) KR102669140B1 (enExample)
CN (4) CN211700228U (enExample)
TW (2) TWI806799B (enExample)

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US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
KR20240115347A (ko) 2019-05-24 2024-07-25 어플라이드 머티어리얼스, 인코포레이티드 접합 층 보호가 개선된 기판 지지 캐리어
JP7291046B2 (ja) * 2019-09-18 2023-06-14 新光電気工業株式会社 基板固定装置
JP7319158B2 (ja) * 2019-09-30 2023-08-01 日本特殊陶業株式会社 保持装置
CN112908919B (zh) * 2019-12-04 2024-07-09 中微半导体设备(上海)股份有限公司 静电吸盘装置及包括该静电吸盘装置的等离子体处理装置
JP7458195B2 (ja) * 2020-02-10 2024-03-29 東京エレクトロン株式会社 載置台、プラズマ処理装置及びクリーニング処理方法
JP7634644B2 (ja) * 2021-02-17 2025-02-21 アプライド マテリアルズ インコーポレイテッド 多孔性プラグ結合
US11794296B2 (en) 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
JP7645838B2 (ja) 2022-03-31 2025-03-14 日本碍子株式会社 ウエハ載置台
US12340980B2 (en) 2022-04-01 2025-06-24 Applied Materials, Inc. Plasma showerhead with improved uniformity
WO2024129283A1 (en) * 2022-12-16 2024-06-20 Lam Research Corporation Electrostatic chuck with halogen modulated silicone dike
US20250037978A1 (en) * 2023-07-24 2025-01-30 Applied Materials, Inc. Gas distribution assemblies for semiconductor devices
WO2025038231A1 (en) * 2023-08-16 2025-02-20 Lam Research Corporation Electrostatic chuck with ceramic coating adhesion

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US7411331B2 (en) * 2002-05-10 2008-08-12 Massachusetts Institute Of Technology Dielectric elastomer actuated systems and methods
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
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CN103843128B (zh) * 2011-09-30 2017-11-21 应用材料公司 静电夹具
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CN204102876U (zh) * 2014-10-16 2015-01-14 中芯国际集成电路制造(北京)有限公司 一种晶片承载装置
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JP6604239B2 (ja) * 2016-03-08 2019-11-13 住友大阪セメント株式会社 静電チャック装置
JP6688715B2 (ja) 2016-09-29 2020-04-28 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
JP6994981B2 (ja) 2018-02-26 2022-01-14 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法

Also Published As

Publication number Publication date
CN120727644A (zh) 2025-09-30
US10688750B2 (en) 2020-06-23
US11192323B2 (en) 2021-12-07
JP2019068044A (ja) 2019-04-25
CN109599356B (zh) 2025-07-04
TWI806799B (zh) 2023-06-21
TW201916246A (zh) 2019-04-16
US11794441B2 (en) 2023-10-24
KR20190039389A (ko) 2019-04-11
CN209461436U (zh) 2019-10-01
KR102669140B1 (ko) 2024-05-29
JP7353024B2 (ja) 2023-09-29
CN109599356A (zh) 2019-04-09
JP2025122029A (ja) 2025-08-20
TW202312345A (zh) 2023-03-16
KR20240074739A (ko) 2024-05-28
JP7682966B2 (ja) 2025-05-26
TWI786194B (zh) 2022-12-11
US20200276785A1 (en) 2020-09-03
US20220063236A1 (en) 2022-03-03
US20190099977A1 (en) 2019-04-04
JP2023171803A (ja) 2023-12-05

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