JP7353024B2 - Ｕｍベース構成 - Google Patents

Ｕｍベース構成 Download PDF

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Publication number
JP7353024B2
JP7353024B2 JP2018136555A JP2018136555A JP7353024B2 JP 7353024 B2 JP7353024 B2 JP 7353024B2 JP 2018136555 A JP2018136555 A JP 2018136555A JP 2018136555 A JP2018136555 A JP 2018136555A JP 7353024 B2 JP7353024 B2 JP 7353024B2
Authority
JP
Japan
Prior art keywords
bonding layer
bonding
temperature control
dielectric
control base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018136555A
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English (en)
Japanese (ja)
Other versions
JP2019068044A (ja
JP2019068044A5 (enExample
Inventor
ディー パルキー ビジャイ
アラン リンドレイ ロジャー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2019068044A publication Critical patent/JP2019068044A/ja
Publication of JP2019068044A5 publication Critical patent/JP2019068044A5/ja
Priority to JP2023150739A priority Critical patent/JP7682966B2/ja
Application granted granted Critical
Publication of JP7353024B2 publication Critical patent/JP7353024B2/ja
Priority to JP2025080901A priority patent/JP2025122029A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y10T428/24339—Keyed

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Flanged Joints, Insulating Joints, And Other Joints (AREA)
  • Ceramic Products (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2018136555A 2017-10-03 2018-07-20 Ｕｍベース構成 Active JP7353024B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023150739A JP7682966B2 (ja) 2017-10-03 2023-09-19 Ｕｍベース構成
JP2025080901A JP2025122029A (ja) 2017-10-03 2025-05-14 Ｕｍベース構成

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/724,045 2017-10-03
US15/724,045 US10688750B2 (en) 2017-10-03 2017-10-03 Bonding structure of E chuck to aluminum base configuration

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023150739A Division JP7682966B2 (ja) 2017-10-03 2023-09-19 Ｕｍベース構成

Publications (3)

Publication Number Publication Date
JP2019068044A JP2019068044A (ja) 2019-04-25
JP2019068044A5 JP2019068044A5 (enExample) 2021-08-12
JP7353024B2 true JP7353024B2 (ja) 2023-09-29

Family

ID=65896401

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018136555A Active JP7353024B2 (ja) 2017-10-03 2018-07-20 Ｕｍベース構成
JP2023150739A Active JP7682966B2 (ja) 2017-10-03 2023-09-19 Ｕｍベース構成
JP2025080901A Pending JP2025122029A (ja) 2017-10-03 2025-05-14 Ｕｍベース構成

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023150739A Active JP7682966B2 (ja) 2017-10-03 2023-09-19 Ｕｍベース構成
JP2025080901A Pending JP2025122029A (ja) 2017-10-03 2025-05-14 Ｕｍベース構成

Country Status (5)

Country Link
US (3) US10688750B2 (enExample)
JP (3) JP7353024B2 (enExample)
KR (2) KR102669140B1 (enExample)
CN (4) CN211700228U (enExample)
TW (2) TWI806799B (enExample)

Families Citing this family (15)

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US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
KR20240115347A (ko) 2019-05-24 2024-07-25 어플라이드 머티어리얼스, 인코포레이티드 접합 층 보호가 개선된 기판 지지 캐리어
JP7291046B2 (ja) * 2019-09-18 2023-06-14 新光電気工業株式会社 基板固定装置
JP7319158B2 (ja) * 2019-09-30 2023-08-01 日本特殊陶業株式会社 保持装置
CN112908919B (zh) * 2019-12-04 2024-07-09 中微半导体设备(上海)股份有限公司 静电吸盘装置及包括该静电吸盘装置的等离子体处理装置
JP7458195B2 (ja) * 2020-02-10 2024-03-29 東京エレクトロン株式会社 載置台、プラズマ処理装置及びクリーニング処理方法
JP7634644B2 (ja) * 2021-02-17 2025-02-21 アプライド マテリアルズ インコーポレイテッド 多孔性プラグ結合
US11794296B2 (en) 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
JP7645838B2 (ja) 2022-03-31 2025-03-14 日本碍子株式会社 ウエハ載置台
US12340980B2 (en) 2022-04-01 2025-06-24 Applied Materials, Inc. Plasma showerhead with improved uniformity
WO2024129283A1 (en) * 2022-12-16 2024-06-20 Lam Research Corporation Electrostatic chuck with halogen modulated silicone dike
US20250037978A1 (en) * 2023-07-24 2025-01-30 Applied Materials, Inc. Gas distribution assemblies for semiconductor devices
WO2025038231A1 (en) * 2023-08-16 2025-02-20 Lam Research Corporation Electrostatic chuck with ceramic coating adhesion

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2011151336A (ja) 2009-12-21 2011-08-04 Sumitomo Osaka Cement Co Ltd 静電チャック、その製造方法及び静電チャック装置
WO2013047555A1 (ja) 2011-09-28 2013-04-04 住友大阪セメント株式会社 静電チャック装置
JP2014139989A (ja) 2013-01-21 2014-07-31 Tokyo Electron Ltd 接着方法、載置台及び基板処理装置
JP2015195346A (ja) 2014-03-27 2015-11-05 Toto株式会社 静電チャック
WO2016153582A1 (en) 2015-03-20 2016-09-29 Applied Materials, Inc. Ceramic electrostatic chuck bonded with high temperature polymer bond to metal base

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US10629466B2 (en) * 2015-03-24 2020-04-21 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device including a heating member
US9608550B2 (en) 2015-05-29 2017-03-28 Lam Research Corporation Lightup prevention using multi-layer ceramic fabrication techniques
US11227749B2 (en) 2016-02-18 2022-01-18 Lam Research Corporation 3D printed plasma arrestor for an electrostatic chuck
US10249526B2 (en) 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
JP6604239B2 (ja) * 2016-03-08 2019-11-13 住友大阪セメント株式会社 静電チャック装置
JP6688715B2 (ja) 2016-09-29 2020-04-28 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
JP6994981B2 (ja) 2018-02-26 2022-01-14 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151336A (ja) 2009-12-21 2011-08-04 Sumitomo Osaka Cement Co Ltd 静電チャック、その製造方法及び静電チャック装置
WO2013047555A1 (ja) 2011-09-28 2013-04-04 住友大阪セメント株式会社 静電チャック装置
JP2014139989A (ja) 2013-01-21 2014-07-31 Tokyo Electron Ltd 接着方法、載置台及び基板処理装置
JP2015195346A (ja) 2014-03-27 2015-11-05 Toto株式会社 静電チャック
WO2016153582A1 (en) 2015-03-20 2016-09-29 Applied Materials, Inc. Ceramic electrostatic chuck bonded with high temperature polymer bond to metal base

Also Published As

Publication number Publication date
CN120727644A (zh) 2025-09-30
US10688750B2 (en) 2020-06-23
US11192323B2 (en) 2021-12-07
JP2019068044A (ja) 2019-04-25
CN211700228U (zh) 2020-10-16
CN109599356B (zh) 2025-07-04
TWI806799B (zh) 2023-06-21
TW201916246A (zh) 2019-04-16
US11794441B2 (en) 2023-10-24
KR20190039389A (ko) 2019-04-11
CN209461436U (zh) 2019-10-01
KR102669140B1 (ko) 2024-05-29
CN109599356A (zh) 2019-04-09
JP2025122029A (ja) 2025-08-20
TW202312345A (zh) 2023-03-16
KR20240074739A (ko) 2024-05-28
JP7682966B2 (ja) 2025-05-26
TWI786194B (zh) 2022-12-11
US20200276785A1 (en) 2020-09-03
US20220063236A1 (en) 2022-03-03
US20190099977A1 (en) 2019-04-04
JP2023171803A (ja) 2023-12-05

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