CN211045475U

CN211045475U - Improved ceramic L ED package

Info

Publication number: CN211045475U
Application number: CN202020014358.0U
Authority: CN
Inventors: 马玉芳
Original assignee: Guangzhou Tengchuang Energy Saving Technology Co ltd
Current assignee: Guangzhou Tengchuang Energy Saving Technology Co ltd
Priority date: 2020-01-02
Filing date: 2020-01-02
Publication date: 2020-07-17
Anticipated expiration: 2030-01-02

Abstract

The utility model discloses an improved generation pottery L ED encapsulation, including ceramic base member and component, the wire guide, connecting wire passageway and electric conductor are accomodate setting of chamber and are established ties or parallelly connected connecting wire between with L ED chip, connect respectively in the inside of connecting wire and electrode lead's electric conductor setting at ceramic base member, can prevent that the component part of L ED encapsulation from suffering wearing and tearing and damaging easily in the use, L ED encapsulation's life has been prolonged, the radiator adopts graphite heat dissipation material to make, graphite heat dissipation is a brand-new heat conduction heat dissipation material, unique crystalline grain orientation has, evenly heat conduction along two directions, lamellar structure can adapt to any surface well, shielding heat source and subassembly, the conducting strip, the heat-absorbing body, the setting up of radiator and louvre has improved the radiating efficiency of device, it can not in time discharge the external world to have solved the heat that L ED chip gived off, cause L ED chip's temperature rise effect, L ED chip's life-span and the problem that the light rate reduces.

Description

Improved ceramic L ED package

Technical Field

The utility model relates to an L ED technical field specifically is a modified generation pottery L ED encapsulation.

Background

L ED is a new type of light source, because it has the advantages of energy saving, environmental protection, long life, fast start, controlling the light spectrum and prohibiting the band width to make the traditional light source have higher chroma, it has been developed unprecedentedly, along with the increase of L ED current intensity and light quantity, the heat quantity of L ED chip also rises, for high power L ED, 80% of the input energy is consumed in the form of heat, if the heat quantity can not be discharged outside in time, the temperature rise effect of the chip is caused, the life and light emitting rate of L ED are greatly reduced.

The conventional ceramic L ED package has a package structure for fixedly welding L ED chips on a substrate, when a plurality of L ED chips are arranged, connecting wires connected in series or in parallel between the L ED chips, electric conductors connected to the connecting wires and electrode leads respectively and other parts are usually exposed outside, the components of the L ED package with the design are easily worn and damaged in the use process, the use safety and the service life of the L ED package are affected, the heat dissipation effect of the conventional ceramic L ED package is poor, the heat cannot be discharged outside in time, the temperature rise effect of the chips is caused, and the service life of the L ED is shortened.

In order to improve the heat dissipation efficiency of the device and prolong the service life of L ED chips and L ED packages, an improved ceramic L ED package is proposed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an improved generation pottery L ED encapsulation has improved the radiating efficiency of device, has prolonged L ED chip and L ED encapsulation's life, has solved prior art's problem.

In order to achieve the purpose, the utility model provides a following technical scheme, an improved generation pottery L ED encapsulation, including ceramic base member and component, the ceramic base member includes lower ceramic layer, upper ceramic layer, support and installation and accomodates the structure, upper ceramic layer sets up the upper end at lower ceramic layer, the support sets up the bottom at lower ceramic layer, lower ceramic layer includes radiating pad, wearing layer, ceramic layer and radiating layer, radiating pad sets up the lower extreme at the wearing layer, the ceramic layer sets up the inboard at the wearing layer, the radiating layer sets up the inboard at the ceramic layer, the installation is accomodate the structure and is included L ED mounting groove, wire guide, L ED fixed plate, connecting wire passageway and electric conductor and accomodate the chamber, L fixed plate sets up the bottom at L ED mounting groove inner chamber, the wire guide sets up the both sides at L ED fixed plate, the connecting wire passageway sets up the lower extreme at the wire guide with the wire guide, the electric conductor accomodates the chamber and sets up the both ends at the connecting wire passageway, the component includes L ED chip, positive pole connecting wire, negative pole connecting wire, conductor and electrode lead wire, the positive pole of L ED chip pass through connecting wire L with one side of electric conductor and the.

Further, the heat dissipation layer comprises a heat absorption body, a heat conduction sheet, a heat dissipation body and heat dissipation holes, the heat conduction sheet is arranged at the lower end of the heat absorption body, the heat dissipation body is arranged at the lower end of the heat conduction sheet, and the heat dissipation holes are formed in the lower end of the heat dissipation body.

Further, the lower ends of the heat dissipation holes penetrate through the wear-resistant layer and the ceramic layer and are arranged at the top of the heat dissipation pad.

Furthermore, the radiator is made of graphite radiating materials.

Further, the L ED mounting groove is provided with a plurality of uniform cavities arranged on the top of the upper ceramic layer.

Further, the connecting line channel is disposed between the lower ceramic layer and the upper ceramic layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model provides an improved generation pottery L ED encapsulation, the wire guide sets up the both sides at L ED fixed plate, connecting wire passageway and wire guide intercommunication set up the lower extreme at the wire guide, the chamber setting is accomodate to the electric conductor at connecting wire passageway's both ends, L ED mounting groove is equipped with a plurality of even inner chambers that set up at last ceramic layer top, connecting wire passageway sets up under between ceramic layer and the last ceramic layer, with series connection or parallelly connected connecting wire between the L ED chip, connect respectively in the electric conductor setting of connecting wire and electrode lead wire in the inside of ceramic base, can prevent that the component part of L ED encapsulation from suffering wearing and tearing and damaging easily in the use, the life of L ED encapsulation has been prolonged.

2. The utility model provides an improved generation pottery L ED encapsulation, the conducting strip sets up the lower extreme at the heat-absorbing body, the radiator sets up the lower extreme at the conducting strip, the louvre sets up the lower extreme at the radiator, the lower extreme of louvre runs through wearing layer and the top of ceramic layer setting at the radiating pad, the radiator adopts graphite heat dissipation material to make, graphite heat dissipation is a brand-new heat conduction heat dissipation material, unique crystalline grain orientation has, evenly heat conduction along two directions, lamellar structure can adapt to any surface well, shielding heat source and subassembly, the radiating efficiency of device has been improved, the heat that has solved L ED chip and has gived off the external world in time, cause the temperature rise effect of L ED chip, the life-span of L ED chip and the problem that the light-emitting rate reduces.

Drawings

Fig. 1 is a cross-sectional view of the present invention;

FIG. 2 is an enlarged view of the point A of FIG. 1 according to the present invention;

fig. 3 is a view showing the internal structure of the lower ceramic layer according to the present invention.

In the drawing, the ceramic substrate 1, the lower ceramic layer 11, the heat dissipation pad 111, the wear-resistant layer 112, the ceramic layer 113, the ceramic layer 114, the heat dissipation layer 1141, the heat absorber 1142, the heat conducting sheet 1143, the heat radiator 1144, the heat dissipation holes 12, the upper ceramic layer 13, the bracket 14, the mounting and accommodating structure 141, L ED mounting grooves 142, wire holes 143, L ED fixing plates 144, connecting wire channels 145, conductor accommodating cavities 2, elements 21, L ED chips 22, positive connecting wires 23, negative connecting wires 24, conductors 25 and electrode leads are arranged.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, an improved ceramic L ED package includes a ceramic substrate 1 and a component 2, the ceramic substrate 1 includes a lower ceramic layer 11, an upper ceramic layer 12, a support 13 and a mounting receiving structure 14, the upper ceramic layer 12 is disposed at an upper end of the lower ceramic layer 11, the support 13 is disposed at a bottom of the lower ceramic layer 11, the lower ceramic layer 11 includes a heat dissipation pad 111, an abrasion-resistant layer 112, a ceramic layer 113 and a heat dissipation layer 114, the heat dissipation pad 111 is disposed at a lower end of the abrasion-resistant layer 112, the ceramic layer 113 is disposed at an inner side of the abrasion-resistant layer 112, the heat dissipation layer 114 is disposed at an inner side of the ceramic layer 113, the heat dissipation layer 114 includes a heat absorber 1141, a heat conduction sheet 1142, a heat sink 633 and heat dissipation holes 1144, the heat conduction sheet 1142 is disposed at a lower end of the heat absorber 1141, the heat dissipation body 1143 is disposed at a lower end of the heat dissipation pad 1141, the heat dissipation pad 1142 is disposed at a lower end of the heat dissipation channel 1141, the heat dissipation pad 1142, the heat dissipation channel 1142 is disposed at a top of the heat dissipation channel 1141, the heat dissipation pad 23, the heat dissipation channel 1142, the heat dissipation pad is disposed at a bottom of the mounting receiving structure, the heat dissipation channel 1141, the heat dissipation channel 1142, the heat dissipation device further includes a mounting channel 1141, the heat dissipation channel 1142 is disposed at a mounting channel 1142, the heat dissipation channel 1141, the heat dissipation channel 1142, the heat dissipation channel 1141 is disposed at a mounting channel 1142, the heat dissipation channel 1141, the heat dissipation channel 1142, the heat dissipation channel 1141, the heat dissipation channel 1142 is disposed at a mounting channel 1142, the heat dissipation device further includes a mounting channel 1142, the heat dissipation device 20, the heat dissipation device includes a mounting channel 1141, the heat dissipation device includes a mounting channel 1142, the heat dissipation device includes a mounting channel 14, the heat dissipation device includes a mounting channel 20, the heat dissipation device 20, the heat dissipation channel 20, the heat.

In summary, the utility model provides an improved generation pottery L ED encapsulation, including ceramic base 1 and component 2, wire guide 142 sets up in L ED fixed plate 143's both sides, connecting wire channel 144 and wire guide 142 intercommunication set up the lower extreme at wire guide 142, electric conductor storage chamber 145 sets up the both ends at connecting wire channel 144, L ED mounting groove 141 is equipped with a plurality of even inner chambers that set up at upper ceramic layer 12 top, connecting wire channel 144 sets up between lower ceramic layer 11 and upper ceramic layer 12, with the series connection or the parallelly connected connecting wire between L ED chip 21, connect respectively conductor 24 in connecting wire and electrode lead 25 and set up the inside at ceramic base 1, can prevent L encapsulated component parts from suffering wearing and tearing and damaging in the use easily, L ED encapsulated life has been prolonged, conducting strip 1142 sets up the lower extreme at radiator 1141, radiator 1143 sets up the lower extreme at ceramic base 1142, radiating fin 1144 sets up the lower extreme at radiator 1143, the lower extreme of radiator 1144 runs through wearing layer 112 and ceramic layer 111 sets up at the heat sink, radiator 1143's top of radiator dish, the heat dissipation device adopts graphite heat dissipation to reduce the heat dissipation efficiency and heat dissipation chip homogeneous heat dissipation chip 6721 and heat dissipation efficiency is suitable for the heat dissipation, heat sink chip 6721, heat dissipation, heat sink is good heat dissipation, heat source is good.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An improved ceramic L ED package comprises a ceramic substrate (1) and an element (2), and is characterized in that the ceramic substrate (1) comprises a lower ceramic layer (11), an upper ceramic layer (12), a support (13) and a mounting and receiving structure (14), the upper ceramic layer (12) is arranged at the upper end of the lower ceramic layer (11), the support (13) is arranged at the bottom of the lower ceramic layer (11), the lower ceramic layer (11) comprises a heat dissipation pad (111), a wear-resistant layer (112), a ceramic layer (113) and a heat dissipation layer (114), the heat dissipation pad (111) is arranged at the lower end of the wear-resistant layer (112), the ceramic layer (113) is arranged at the inner side of the wear-resistant layer (112), the heat dissipation layer (114) is arranged at the inner side of the ceramic layer (113), the mounting and receiving structure (14) comprises a L ED mounting groove (141), wire holes (142), a lead wire fixing plate (143), a connecting wire channel (144) and a receiving cavity (145), the fixing plate (143) is arranged at the bottom of a L ED mounting groove (141), the connecting wire hole (142), the connecting wire (142), the lead wire connecting channel (142), the connecting with a negative electrode lead wire (23) is arranged at one side of a positive electrode (23) and a negative electrode (23), the chip (23) and a negative electrode (24) connected with the chip (23) of the chip (24), the chip (23) and a negative electrode (24) and a negative electrode (23) connected with the chip (24) through the chip (24), the chip.

2. The improved ceramic L ED package of claim 1, wherein the heat dissipation layer (114) comprises a heat sink (1141), a heat conductive sheet (1142), a heat sink (1143), and heat dissipation holes (1144), the heat conductive sheet (1142) is disposed at a lower end of the heat sink (1141), the heat sink (1143) is disposed at a lower end of the heat conductive sheet (1142), and the heat dissipation holes (1144) are disposed at a lower end of the heat sink (1143).

3. The improved ceramic L ED package of claim 2, wherein the lower ends of the thermal vias (1144) are disposed on top of the thermal pads (111) through the wear layer (112) and the ceramic layer (113).

4. The improved ceramic L ED package of claim 2, wherein the heat sink (1143) is made of graphite heat sink material.

5. The improved ceramic L ED package of claim 1, wherein the L ED mounting groove (141) has a plurality of uniform cavities formed on top of the top ceramic layer (12).

6. The improved ceramic L ED package of claim 1, wherein the bond wire vias (144) are disposed between the lower ceramic layer (11) and the upper ceramic layer (12).