CN207918940U - 蒸镀掩模 - Google Patents
蒸镀掩模 Download PDFInfo
- Publication number
- CN207918940U CN207918940U CN201820059332.0U CN201820059332U CN207918940U CN 207918940 U CN207918940 U CN 207918940U CN 201820059332 U CN201820059332 U CN 201820059332U CN 207918940 U CN207918940 U CN 207918940U
- Authority
- CN
- China
- Prior art keywords
- deposition mask
- face
- long side
- hole
- metallic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008021 deposition Effects 0.000 title claims abstract description 293
- 238000000034 method Methods 0.000 description 63
- 239000000758 substrate Substances 0.000 description 58
- 239000000463 material Substances 0.000 description 56
- 230000008020 evaporation Effects 0.000 description 49
- 238000001704 evaporation Methods 0.000 description 49
- 230000008569 process Effects 0.000 description 48
- 238000000576 coating method Methods 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 20
- 238000007740 vapor deposition Methods 0.000 description 17
- 238000005530 etching Methods 0.000 description 16
- 238000012790 confirmation Methods 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 230000000007 visual effect Effects 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 13
- 239000002585 base Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 229910001021 Ferroalloy Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000010025 steaming Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000003196 chaotropic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 210000002027 skeletal muscle Anatomy 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017005999 | 2017-01-17 | ||
JP2017-005999 | 2017-01-17 | ||
JP2017-238989 | 2017-12-13 | ||
JP2017238989A JP6428903B2 (ja) | 2017-01-17 | 2017-12-13 | 蒸着マスク及び蒸着マスクの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207918940U true CN207918940U (zh) | 2018-09-28 |
Family
ID=62983958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820059332.0U Active CN207918940U (zh) | 2017-01-17 | 2018-01-15 | 蒸镀掩模 |
Country Status (6)
Country | Link |
---|---|
US (2) | US11136664B2 (ja) |
EP (1) | EP3572553B1 (ja) |
JP (3) | JP6428903B2 (ja) |
KR (1) | KR102466681B1 (ja) |
CN (1) | CN207918940U (ja) |
TW (2) | TWI689606B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108330435A (zh) * | 2017-01-17 | 2018-07-27 | 大日本印刷株式会社 | 蒸镀掩模和蒸镀掩模的制造方法 |
CN110699637A (zh) * | 2019-10-17 | 2020-01-17 | 昆山国显光电有限公司 | 掩膜版的制作方法、掩膜版和显示面板的制作方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200096877A (ko) | 2019-02-06 | 2020-08-14 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크 장치, 마스크 지지 기구 및 증착 마스크 장치의 제조 방법 |
JP7449485B2 (ja) | 2019-03-28 | 2024-03-14 | 大日本印刷株式会社 | 蒸着マスク及び蒸着マスクの製造方法 |
JP2021033018A (ja) * | 2019-08-22 | 2021-03-01 | 大日本印刷株式会社 | 露光方法及び露光方法を備える蒸着マスク製造方法並びに露光装置 |
TWI819236B (zh) * | 2019-09-06 | 2023-10-21 | 日商凸版印刷股份有限公司 | 蒸鍍遮罩中間體、蒸鍍遮罩及蒸鍍遮罩的製造方法 |
US20220372615A1 (en) * | 2019-11-12 | 2022-11-24 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Mask |
US11805678B2 (en) | 2019-11-21 | 2023-10-31 | Samsung Display Co., Ltd. | Display device, mask assembly, method of manufacturing the mask assembly, apparatus for manufacturing the display device, and method of manufacturing the display device |
JP2021175824A (ja) * | 2020-03-13 | 2021-11-04 | 大日本印刷株式会社 | 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63255380A (ja) * | 1987-04-09 | 1988-10-21 | Dainippon Printing Co Ltd | シヤドウマスクの製造方法 |
US6955726B2 (en) * | 2002-06-03 | 2005-10-18 | Samsung Sdi Co., Ltd. | Mask and mask frame assembly for evaporation |
JP4832160B2 (ja) * | 2006-05-19 | 2011-12-07 | トッキ株式会社 | 有機el素子形成用マスク,アライメント方法並びに有機el素子形成装置 |
WO2010047101A1 (ja) * | 2008-10-21 | 2010-04-29 | 株式会社アルバック | マスク及びマスクを用いた成膜方法 |
KR101182440B1 (ko) * | 2010-01-11 | 2012-09-12 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 프레임 조립체 |
KR101274718B1 (ko) * | 2010-01-28 | 2013-06-12 | 엘지디스플레이 주식회사 | 증착마스크 및 그를 포함하는 마스크 어셈블리 |
JP2013110072A (ja) * | 2011-11-24 | 2013-06-06 | Canon Inc | 有機el発光装置の製造方法及び製造装置 |
TWI601838B (zh) * | 2012-01-12 | 2017-10-11 | 大日本印刷股份有限公司 | A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor element |
JP6050642B2 (ja) | 2012-09-19 | 2016-12-21 | 矢崎総業株式会社 | コネクタの製造方法 |
KR102002494B1 (ko) * | 2012-11-30 | 2019-07-23 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 프레임 어셈블리 |
JP5382259B1 (ja) * | 2013-01-10 | 2014-01-08 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
CN103149790B (zh) | 2013-02-22 | 2014-10-08 | 京东方科技集团股份有限公司 | 掩模板 |
KR102160695B1 (ko) * | 2013-05-10 | 2020-09-29 | 삼성디스플레이 주식회사 | 마스크 |
JP6127834B2 (ja) * | 2013-08-27 | 2017-05-17 | トヨタ自動車株式会社 | アライメント方法及びパターニング用マスク |
JP5516816B1 (ja) * | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
JP6515520B2 (ja) | 2014-12-15 | 2019-05-22 | 大日本印刷株式会社 | 蒸着マスクの製造方法、蒸着マスクを作製するために用いられる金属板および蒸着マスク |
KR20170030685A (ko) * | 2015-09-09 | 2017-03-20 | 삼성디스플레이 주식회사 | 증착용 마스크 및 그 제조 방법 |
-
2017
- 2017-12-13 JP JP2017238989A patent/JP6428903B2/ja active Active
- 2017-12-26 EP EP17893316.4A patent/EP3572553B1/en active Active
- 2017-12-26 KR KR1020197023455A patent/KR102466681B1/ko active IP Right Grant
- 2017-12-27 TW TW106145915A patent/TWI689606B/zh active
- 2017-12-27 TW TW109108200A patent/TWI723803B/zh active
-
2018
- 2018-01-15 CN CN201820059332.0U patent/CN207918940U/zh active Active
- 2018-09-27 JP JP2018182841A patent/JP7256979B2/ja active Active
-
2019
- 2019-07-16 US US16/512,697 patent/US11136664B2/en active Active
-
2021
- 2021-07-14 US US17/305,731 patent/US11649540B2/en active Active
-
2023
- 2023-03-31 JP JP2023059194A patent/JP2023089042A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108330435A (zh) * | 2017-01-17 | 2018-07-27 | 大日本印刷株式会社 | 蒸镀掩模和蒸镀掩模的制造方法 |
CN111188007A (zh) * | 2017-01-17 | 2020-05-22 | 大日本印刷株式会社 | 蒸镀掩模及其制造方法、蒸镀掩模装置以及蒸镀方法 |
CN108330435B (zh) * | 2017-01-17 | 2021-10-01 | 大日本印刷株式会社 | 蒸镀掩模和蒸镀掩模的制造方法 |
CN110699637A (zh) * | 2019-10-17 | 2020-01-17 | 昆山国显光电有限公司 | 掩膜版的制作方法、掩膜版和显示面板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20190103355A (ko) | 2019-09-04 |
TWI689606B (zh) | 2020-04-01 |
US20190345597A1 (en) | 2019-11-14 |
JP2023089042A (ja) | 2023-06-27 |
JP7256979B2 (ja) | 2023-04-13 |
JP2019023350A (ja) | 2019-02-14 |
EP3572553A1 (en) | 2019-11-27 |
US20210340665A1 (en) | 2021-11-04 |
JP6428903B2 (ja) | 2018-11-28 |
EP3572553A4 (en) | 2020-12-09 |
TWI723803B (zh) | 2021-04-01 |
KR102466681B1 (ko) | 2022-11-14 |
EP3572553B1 (en) | 2023-02-08 |
TW202024366A (zh) | 2020-07-01 |
JP2018115390A (ja) | 2018-07-26 |
US11136664B2 (en) | 2021-10-05 |
US11649540B2 (en) | 2023-05-16 |
TW201832642A (zh) | 2018-09-01 |
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