CN204441336U - A kind of white LED light source - Google Patents
A kind of white LED light source Download PDFInfo
- Publication number
- CN204441336U CN204441336U CN201420636219.6U CN201420636219U CN204441336U CN 204441336 U CN204441336 U CN 204441336U CN 201420636219 U CN201420636219 U CN 201420636219U CN 204441336 U CN204441336 U CN 204441336U
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- epoxy resin
- fluorescent material
- glue
- led
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Abstract
The utility model relates to a kind of white LED light source, comprise pedestal, be coated on the gold on described pedestal and tin glue-line, be arranged on the reflector layer on gold and tin glue-line, be arranged on the LED luminescence chip above reflector layer, the gold thread of LED chip electrical connection, article two, end leads, epoxy resin colloid layer, fluorescent material glue-line, article two, end leads is electrically connected with described LED chip respectively, described epoxy resin colloid layer is coated in end face and the sidewall of described LED chip, described fluorescent material glue-line is coated in the surrounding of epoxy resin colloid layer, these two end leads are each passed through described epoxy resin colloid layer, fluorescent material glue-line stretches out outside described LED encapsulation structure.LED encapsulation structure utilizes epoxy resin colloid layer to apply end face and the sidewall of described LED chip, fluorescent material glue-line is utilized to be coated in the surrounding of described first encapsulation glue-line, thus realize effectively being reduced the light loss that described LED produces because of reflection, thus make this LED encapsulation method, encapsulating structure and use the LED of this encapsulating structure to have the higher advantage of light extraction efficiency.
Description
Technical field
The utility model relates to a kind of white LED light source, particularly relates to a kind of fluorescent material glue-line and epoxy resin colloid layer and covers white LED light source above LED luminescence chip layer.
Background technology
Along with the fast development of LED technology, luminous efficiency progressively improves, and the application of the market of LED will be more extensive, and under the background raised once again in global energy shortage crisis especially, LED more gets most of the attention in the prospect of illumination market.In the face of the huge market opportunity, each major company of the world accelerates the paces of innovation one after another.The development of the development of LED industry and semiconductor technology and lighting source technology is closely related.
At present, universally recognized LED light source structure is various LED chip group by being fixed on an impact faces, then makes the light sent become white light by coating phosphor gel.The glue that generally we commonly use is silica gel or epoxy resin.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of white LED light source.
The technical scheme that the utility model solves the problems of the technologies described above is as follows: a kind of white LED light source, comprise pedestal, be coated on the gold on described pedestal and tin glue-line, be arranged on the reflector layer on gold and tin glue-line, be arranged on the LED luminescence chip above reflector layer, the gold thread of LED chip electrical connection, article two, end leads, epoxy resin colloid layer, fluorescent material glue-line, article two, end leads is electrically connected with described LED chip respectively, described epoxy resin colloid layer is coated in end face and the sidewall of described LED chip, described fluorescent material glue-line is coated in the surrounding of epoxy resin colloid layer, these two end leads are each passed through described epoxy resin colloid layer, fluorescent material glue-line stretches out outside described LED encapsulation structure.
The beneficial effects of the utility model are: LED encapsulation method and encapsulating structure utilize epoxy resin colloid layer to apply end face and the sidewall of described LED chip, fluorescent material glue-line is utilized to be coated in the surrounding of described first encapsulation glue-line, thus realize effectively being reduced the light loss that described LED produces because of reflection, thus make this LED encapsulation method, encapsulating structure and use the LED of this encapsulating structure to have the higher advantage of light extraction efficiency.
On the basis of technique scheme, the utility model can also do following improvement.
The utility model white LED light source described above, further, described fluorescent material glue-line is ethylene-tetrafluoroethylene copolymer and fluorescent material mixed layer, and described ethylene-tetrafluoroethylene copolymer and its thickness of fluorescent material mixed layer are 100 microns ~ 200 microns.
The utility model white LED light source described above, further, the thickness of described epoxy resin colloid layer is 20 microns ~ 50 microns.
The utility model white LED light source described above, further, is equipped with insulation spacer under two end leads, and insulation spacer is positioned within this epoxy resin colloid layer.
The utility model white LED light source described above, further, described LED luminescence chip series connection.
The utility model white LED light source described above, further, described pedestal is metal or the pottery of high heat conduction, graphite, diamond.Described pedestal is a cooling base, and by the metal of high heat conduction as copper, aluminium, iron, silver etc., also can be pottery, the various highly heat-conductive materials such as graphite, diamond, heat pipe and structure be made.Shape can be square, circular, rectangle, rhombus and various irregular shape, determines according to different application scenarios.On the inboard portion of pedestal, plate one deck reflector layer, can by silver-plated, the modes such as polishing realize.
The inboard portion of described pedestal is coated with one deck gold and tin glue-line, can be blended in organic silica gel by gold and tin part and be coated with, plate reflector layer described in one deck at gold and tin glue-line, can by silver-plated, the modes such as polishing realize.
The effect of described reflector layer is the light reflection to side and the back side that LED chip can be made to send is front outgoing, thus can improve the utilance of light, improves the light extraction efficiency of LED.Light efficiency improves about 5%, and fluorescent material extends useful life to some extent.
The method for packing of a kind of white LED light source of the utility model, can prepare by the following method: apply one deck gold and tin glue-line at the end face of pedestal, then apply one deck reflector layer on gold and tin glue-line, LED luminescence chip is fixed on reflector layer by binding agent; LED chip welds gold thread; Epoxy resin colloid layer is utilized to be coated on LED chip and gold thread; After the solidification of epoxy resin colloid layer, at the surrounding coating fluorescent powder glue-line of this first encapsulation glue-line.Described two end leads, are electrically connected with described LED chip by gold thread, and one end of two end leads is encapsulated within epoxy resin colloid layer respectively.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model white LED light source;
In accompanying drawing, the list of parts representated by each label is as follows:
11, pedestal, 12, gold and tin glue-line, 13, reflector layer, 14, luminescence chip, 15, epoxy resin colloid layer, 16, fluorescent material glue-line, 17, the gold thread of LED chip electrical connection, 18, two end leads, 19, insulation spacer.
Embodiment
Be described principle of the present utility model and feature below in conjunction with accompanying drawing, example, only for explaining the utility model, is not intended to limit scope of the present utility model.
As shown in Figure 1, a kind of white LED light source 1 of the utility model, comprise pedestal 11, be coated on the gold on described pedestal and tin glue-line 12, be arranged on the reflector layer 13 on gold and tin glue-line, be arranged on the LED luminescence chip 14 above reflector layer, the gold thread 17 of LED chip electrical connection, article two, end leads 18, epoxy resin colloid layer 15, fluorescent material glue-line 16, article two, end leads is electrically connected with described LED chip respectively, described epoxy resin colloid layer is coated in end face and the sidewall of described LED chip, described fluorescent material glue-line is coated in the surrounding of epoxy resin colloid layer, these two end leads are each passed through described epoxy resin colloid layer, fluorescent material glue-line stretches out outside described LED encapsulation structure, article two, be equipped with insulation spacer under end leads, insulation spacer 19 is positioned within this epoxy resin colloid layer.
Described fluorescent material glue-line is ethylene-tetrafluoroethylene copolymer and fluorescent material mixed layer, and described ethylene-tetrafluoroethylene copolymer and its thickness of fluorescent material mixed layer are 100 microns ~ 200 microns.The thickness of described epoxy resin colloid layer is 20 microns ~ 50 microns.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. a white LED light source, it is characterized in that, comprise pedestal, be coated on the gold on described pedestal and tin glue-line, be arranged on the reflector layer on gold and tin glue-line, be arranged on the LED luminescence chip above reflector layer, the gold thread of LED chip electrical connection, article two, end leads, epoxy resin colloid layer, fluorescent material glue-line, article two, end leads is electrically connected with described LED chip respectively, described epoxy resin colloid layer is coated in end face and the sidewall of described LED chip, described fluorescent material glue-line is coated in the surrounding of epoxy resin colloid layer, these two end leads are each passed through described epoxy resin colloid layer, fluorescent material glue-line stretches out outside described LED encapsulation structure.
2. white LED light source according to claim 1, it is characterized in that, described fluorescent material glue-line is ethylene-tetrafluoroethylene copolymer and fluorescent material mixed layer, and described ethylene-tetrafluoroethylene copolymer and its thickness of fluorescent material mixed layer are 100 microns ~ 200 microns.
3. white LED light source according to claim 1, it is characterized in that, the thickness of described epoxy resin colloid layer is 20 microns ~ 50 microns.
4. white LED light source according to claim 1 or 2 or 3, is characterized in that, described LED luminescence chip series connection.
5. described white LED light source according to claim 4, it is characterized in that, described pedestal is metal or the pottery of high heat conduction, graphite, diamond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420636219.6U CN204441336U (en) | 2014-10-26 | 2014-10-26 | A kind of white LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420636219.6U CN204441336U (en) | 2014-10-26 | 2014-10-26 | A kind of white LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204441336U true CN204441336U (en) | 2015-07-01 |
Family
ID=53609167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420636219.6U Expired - Fee Related CN204441336U (en) | 2014-10-26 | 2014-10-26 | A kind of white LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204441336U (en) |
-
2014
- 2014-10-26 CN CN201420636219.6U patent/CN204441336U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150701 Termination date: 20151026 |
|
| EXPY | Termination of patent right or utility model |