CN204206459U - 一种mems麦克风 - Google Patents
一种mems麦克风 Download PDFInfo
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- CN204206459U CN204206459U CN201420378389.9U CN201420378389U CN204206459U CN 204206459 U CN204206459 U CN 204206459U CN 201420378389 U CN201420378389 U CN 201420378389U CN 204206459 U CN204206459 U CN 204206459U
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- mems microphone
- top board
- acoustic aperture
- mems
- high temperature
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- 230000001681 protective effect Effects 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 13
- 239000000428 dust Substances 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 230000035699 permeability Effects 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Abstract
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Claims (7)
Priority Applications (1)
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CN201420378389.9U CN204206459U (zh) | 2014-07-09 | 2014-07-09 | 一种mems麦克风 |
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CN201420378389.9U CN204206459U (zh) | 2014-07-09 | 2014-07-09 | 一种mems麦克风 |
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CN204206459U true CN204206459U (zh) | 2015-03-11 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111510835A (zh) * | 2020-06-01 | 2020-08-07 | 无锡韦尔半导体有限公司 | 固传导mems麦克风的封装结构、制造方法及移动终端 |
CN112020865A (zh) * | 2018-04-26 | 2020-12-01 | 美商楼氏电子有限公司 | 具有透声隔膜的声学组件 |
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2014
- 2014-07-09 CN CN201420378389.9U patent/CN204206459U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112020865A (zh) * | 2018-04-26 | 2020-12-01 | 美商楼氏电子有限公司 | 具有透声隔膜的声学组件 |
CN112020865B (zh) * | 2018-04-26 | 2022-06-17 | 美商楼氏电子有限公司 | 具有透声隔膜的声学组件 |
CN111510835A (zh) * | 2020-06-01 | 2020-08-07 | 无锡韦尔半导体有限公司 | 固传导mems麦克风的封装结构、制造方法及移动终端 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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TR01 | Transfer of patent right |
Effective date of registration: 20200618 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
TR01 | Transfer of patent right |