CN201867561U - 阵列基板和液晶显示器 - Google Patents

阵列基板和液晶显示器 Download PDF

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CN201867561U
CN201867561U CN2010206017380U CN201020601738U CN201867561U CN 201867561 U CN201867561 U CN 201867561U CN 2010206017380 U CN2010206017380 U CN 2010206017380U CN 201020601738 U CN201020601738 U CN 201020601738U CN 201867561 U CN201867561 U CN 201867561U
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array base
insulating layer
base palte
layer
electrode
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谢振宇
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BOE Technology Group Co Ltd
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Beijing BOE Optoelectronics Technology Co Ltd
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    • HELECTRICITY
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    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
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    • G02OPTICS
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • H01L29/772Field effect transistors
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    • H01L29/78609Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Abstract

本实用新型公开了一种阵列基板和液晶显示器,其中该阵列基板,包括衬底基板,所述衬底基板上形成有横纵交叉围设形成多个像素单元的数据线和栅线,每个像素单元中包括像素电极和薄膜晶体管开关元件,所述薄膜晶体管开关元件包括栅电极、源电极、漏电极和有源层,其中:所述栅电极与有源层之间设置有栅绝缘层,所述栅绝缘层包括不透明绝缘层。本实用新型阵列基板的栅绝缘层包括不透明绝缘层,可以阻止背光照射到有源层上,减小光照漏电流,提高薄膜晶体管开关元件的性能,可以防止背光区域产生漏光,减少彩膜基板上的黑矩阵面积,提高TFT-LCD开口率。

Description

阵列基板和液晶显示器
技术领域
本实用新型涉及液晶显示技术,尤其涉及一种阵列基板和液晶显示器。
背景技术
液晶显示器是目前常用的平板显示器,其中薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display,简称TFT-LCD)是液晶显示器中的主流产品。
图1A为现有典型阵列基板的局部俯视结构示意图,图1B为图1A中沿A-A线的侧视剖切结构示意图,如图1A和图1B所示,采用现有四次光刻技术,形成的阵列基板包括衬底基板1;衬底基板1上形成有横纵交叉的数据线5和栅线2;数据线5和栅线2围设形成矩阵形式排列的像素单元;每个像素单元包括薄膜晶体管开关元件TFT和像素电极11;薄膜晶体管开关元件TFT包括栅电极3、源电极7、漏电极8和有源层6;栅电极3连接栅线2,源电极7连接数据线5,漏电极8通过钝化层过孔10连接像素电极11,有源层6形成在源电极7和漏电极8与栅电极3之间,栅电极3和有源层6之间为栅绝缘层4,像素电极11与漏电极8之间为钝化层9,像素电极11通过钝化层过孔10与漏电极8连通。其中,栅线2、数据线5、栅电极3、源电极7、漏电极8和像素电极11等图案统称为导电图案,栅绝缘层4和钝化层9统称为绝缘层。
现有的TFT-LCD多为投射式,背光照射到有源层之后,容易出现漏电流(Ioff)现象,降低显示质量,需要在彩膜基板上采用黑矩阵遮光,开口率低。
实用新型内容
本实用新型提供一种阵列基板和液晶显示器,以减小光照漏电流,提高开口率。
本实用新型提供一种阵列基板,包括衬底基板,所述衬底基板上形成有横纵交叉围设形成多个像素单元的数据线和栅线,每个像素单元中包括像素电极和薄膜晶体管开关元件,所述薄膜晶体管开关元件包括栅电极、源电极、漏电极和有源层,其中:
所述栅电极与有源层之间设置有栅绝缘层,所述栅绝缘层包括不透明绝缘层。
进一步地,所述栅绝缘层还包括透明绝缘层,所述透明绝缘层形成在所述不透明绝缘层之下。
其中,所述不透明绝缘层对应所述数据线、源电极、漏电极设置。
优选地,所述不透明绝缘层的面积大于其上层的数据线或有源层的面积。
所述不透明绝缘层为黑色树脂绝缘层。
再进一步地,所述不透明绝缘层的厚度优选为
Figure BSA00000342142600021
所述透明绝缘层的厚度优选为
本实用新型还提供一种液晶显示器,包括液晶面板,所述液晶面板包括对盒设置的彩膜基板和本实用新型提供的任一所述的阵列基板,所述彩膜基板和阵列基板中夹设有液晶层。
本实用新型提供的阵列基板和液晶显示器,阵列基板的栅绝缘层包括不透明绝缘层,可以阻止背光照射到有源层上,减小光照漏电流,提高薄膜晶体管开关元件的性能,可以防止背光区域产生漏光,减少彩膜基板上的黑矩阵面积,提高TFT-LCD开口率。
附图说明
图1A为现有典型阵列基板的局部俯视结构示意图;
图1B为图1A中沿A-A线的侧视剖切结构示意图;
图2为本实用新型实施例一提供的阵列基板的局部侧视结构示意图;
图3为本实用新型实施例二提供的阵列基板的局部侧视结构示意图;
图4A为本实用新型实施例二提供的阵列基板中形成栅线和栅电极的局部侧视结构示意图;
图4B为本实用新型实施例二提供的阵列基板中沉积透明绝缘层的局部侧视结构示意图;
图4C为本实用新型实施例二提供的阵列基板中沉积不透明绝缘层的局部侧视结构示意图;
图4D为本实用新型实施例二提供的阵列基板中沉积有源层薄膜的局部侧视结构示意图;
图5A为本实用新型实施例二提供的阵列基板中对涂覆在数据线金属薄膜上的光刻胶曝光显影的结构示意图;
图5B为本实用新型实施例二提供的阵列基板中刻蚀数据线金属薄膜的结构示意图;
图5C为本实用新型实施例二提供的阵列基板中刻蚀有源层薄膜的结构示意图;
图5D为本实用新型实施例二提供的阵列基板中刻蚀不透明绝缘层的结构示意图;
图5E为本实用新型实施例二提供的阵列基板中灰化后的结构示意图;
图5F为本实用新型实施例二提供的阵列基板中刻蚀多余有源层薄膜的结构示意图;
图5G为本实用新型实施例二提供的阵列基板中刻蚀源电极和漏电极的结构示意图;
图5H为本实用新型实施例二提供的阵列基板中刻蚀TFT沟道的结构示意图;
图5I为本实用新型实施例二提供的阵列基板中剥离光刻胶的结构示意图。
主要附图标记:
1-衬底基板;        2-栅线;         3-栅电极;
4-栅绝缘层;        5-数据线;       6-有源层;
7-源电极;          8-漏电极;       9-钝化层;
10-钝化层过孔;     11-像素电极;    17-光刻胶;
19-TFT沟道;        41-不透明绝缘层;42-透明绝缘层;
50-数据线金属薄膜   60-有源层薄膜。
具体实施方式
为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。
实施例一
图2为本实用新型实施例一提供的阵列基板的局部侧视结构示意图,如图2所示,该阵列基板包括衬底基板1,衬底基板1上形成有横纵交叉围设形成多个像素单元的数据线5和栅线(图中未示),每个像素单元中包括像素电极11和薄膜晶体管开关元件,薄膜晶体管开关元件包括栅电极3、源电极7、漏电极8和有源层6,其中:栅电极3与有源层6之间设置有栅绝缘层,栅绝缘层包括不透明绝缘层41。
本实施例阵列基板的栅绝缘层包括不透明绝缘层,可以阻止背光照射到有源层上,减小光照漏电流,提高薄膜晶体管开关元件的性能,可以防止背光区域产生漏光,减少彩膜基板上的黑矩阵面积,提高TFT-LCD开口率。
实施例二
图3为本实用新型实施例二提供的阵列基板的局部侧视结构示意图,如图3所示,该阵列基板包括衬底基板1,衬底基板1上形成有横纵交叉围设形成多个像素单元的数据线5和栅线(图中未示),每个像素单元中包括像素电极11、栅电极3、源电极7、漏电极8和有源层6,其中:栅电极3与有源层6之间设置有栅绝缘层,栅绝缘层包括不透明绝缘层41。
进一步地,栅绝缘层还可以包括透明绝缘层42,透明绝缘层42形成在不透明绝缘层41之下。
其中,栅线与栅电极3连接,数据线5与源电极7连接,不透明绝缘层41对应数据线5、源电极7、漏电极8设置,这样数据线5之下可以包括不透明绝缘层41和透明绝缘层42。
优选地,不透明绝缘层的面积可以大于其上层的数据线或有源层的面积。不透明绝缘层41可以为黑色树脂绝缘层。例如:采用与彩膜基板上的黑矩阵相同的黑色树脂材料。其中,该黑色树脂绝缘层的厚度优选为
其中,透明绝缘层42的厚度优选为
Figure BSA00000342142600053
上述阵列基板的制造方法可以包括以下步骤:
步骤101、在衬底基板1上可以采用磁控溅射等方法沉积一层栅金属薄膜,光刻后形成栅线(图中未示)和栅电极3,具体可以参见图4A,图4A为本实用新型实施例二提供的阵列基板中形成栅线和栅电极的局部侧视结构示意图;
步骤102、在形成上述图案的衬底基板1上,采用等离子增强化学气相沉积(Plasma Enhanced Chemical vapor deposition,简称PECVD)法沉积一层透明绝缘层42,透明绝缘层的材料可以选取为氮化硅等透明绝缘材料,透明绝缘层42属于栅绝缘层的一部分,具体可以参见图4B,图4B为本实用新型实施例二提供的阵列基板中沉积透明绝缘层的局部侧视结构示意图。
步骤103、在形成上述图案的衬底基板1上,涂覆(coating)一层不透明绝缘层41,可以采用光敏或者非光敏性材料,例如:黑色树脂材料,涂覆完不透明绝缘层41以后进行固化,不透明绝缘层41也属于栅绝缘层的一部分,具体可以参见图4C,图4C为本实用新型实施例二提供的阵列基板中沉积不透明绝缘层的局部侧视结构示意图。
步骤104、采用PECVD法沉积有源层薄膜60,有源层薄膜可以包括半导体层(a-si)薄膜和掺杂半导体层(n+a-si)薄膜,半导体层薄膜在掺杂半导体层薄膜之下,最后再采用磁控溅射沉积一层数据线金属薄膜50,具体可以参见图4D,图4D为本实用新型实施例二提供的阵列基板中沉积有源层薄膜和数据线金属薄膜的局部侧视结构示意图。
步骤105、采用双色调掩模板例如:灰度掩模(Gray Tone Mask,简称GTM)板或半色调掩膜(Half Tone Mask,简称HTM)板对光刻胶进行曝光显影,再采用湿刻和干刻工艺相结合,刻蚀得到有源层、数据线、源电极和漏电极,该过程具体可以包括以下步骤:
步骤201、采用双色调掩模板,对涂覆在数据线金属薄膜50上的光刻胶17进行曝光显影,在需要形成源电极、漏电极和数据线的位置形成光刻胶完全保留区域,在需要形成TFT沟道和对应栅线的位置形成光刻胶部分保留区域,其他区域为光刻胶完全去除区域,具体可以参见图5A,图5A为本实用新型实施例二提供的阵列基板中对涂覆在数据线金属薄膜上的光刻胶曝光显影的结构示意图。
步骤202、采用湿刻工艺,将光刻胶完全去除区域对应的数据线金属薄膜50刻蚀掉,具体可以参见图5B,图5B为本实用新型实施例二提供的阵列基板中刻蚀数据线金属薄膜的结构示意图,将光刻胶完全去除区域对应的数据线金属薄膜50刻蚀掉后,图中光刻胶下的数据线有部分过刻,形成数据线及其薄膜晶体管开关元件的源电极和漏电极所在的区域。
步骤203、采用干刻工艺,依次刻蚀掉光刻胶完全去除区域对应的有源层薄膜,具体可以参见图5C,图5C为本实用新型实施例二提供的阵列基板中刻蚀有源层薄膜的结构示意图,其中,剩余的有源层薄膜60之下包括不透明绝缘层41和透明绝缘层42。
步骤204、将光刻胶完全去除区域对应的不透明绝缘层41刻蚀掉,具体可以参见图5D,图5D为本实用新型实施例二提供的阵列基板中刻蚀不透明绝缘层的结构示意图。
步骤205、灰化去除光刻胶部分保留区域的光刻胶,仅保留光刻胶完全保留区域的光刻胶,具体可以参见图5E,图5E为本实用新型实施例二提供的阵列基板中灰化后的结构示意图,将TFT沟道位置对应的光刻胶部分保留区域的光刻胶17灰化掉,保留数据线和源漏电极位置对应的光刻胶完全保留区域的光刻胶17;
步骤206、将灰化后由于光刻胶横向刻蚀后,数据线金属薄膜50边缘露出的多余有源层薄膜刻蚀掉,具体可以参见图5F,图5F为本实用新型实施例二提供的阵列基板中刻蚀多余有源层薄膜的结构示意图,刻蚀多余有源层薄膜60后,可以形成有源层6的图案,其中,有源层6之下包括不透明绝缘层41,且不透明绝缘层41的面积大于有源层的面积,可以阻止背光源照射到有源层的半导体层之上。
步骤207、采用金属干刻工艺,例如数据线金属薄膜由Mo形成,干刻将TFT沟道位置对应的数据线金属薄膜刻蚀掉,形成数据线5、源电极7和漏电极8,具体可以参见图5G所示,图5G为本实用新型实施例二提供的阵列基板中刻蚀源电极和漏电极的结构示意图。其中,数据线5之下依次包括有源层薄膜和栅绝缘层的不透明绝缘层41、透明绝缘层42,其中不透明绝缘层41、透明绝缘层42的位置与数据线、源电极、漏电极对应。
步骤208、对TFT沟道位置对应的有源层进行部分刻蚀,形成TFT沟道19,具体可以参见图5H,图5H为本实用新型实施例二提供的阵列基板中刻蚀TFT沟道的结构示意图,刻蚀掉TFT沟道位置对应的有源层6中的掺杂半导体层,保留半导体层,形成TFT沟道19,从而完成薄膜晶体管开关元件的制造。
步骤209、剥离剩余的光刻胶,具体可以参见图5I,图5I为本实用新型实施例二提供的阵列基板中剥离光刻胶的结构示意图。
经过上述步骤201到步骤209,形成有源层6、TFT沟道19、源电极7、漏电极8和数据线5之后,可以形成像素电极,参见如下的步骤106。
步骤106、沉积钝化层9,刻蚀形成钝化层过孔10后,再沉积像素电极11,参见图3,像素电极11可以通过钝化层过孔10与漏电极8连通。
本实施例采用不透明绝缘层例如:黑色树脂绝缘层作为栅绝缘层的一部分,采用双层树脂结构,第一层采用透明绝缘层例如:无机材料氮化硅,厚度可以为1000A左右,然后在氮化硅上涂覆黑色树脂绝缘层,将像素区域的黑色树脂刻蚀掉后,在半导体层之下存在不透明绝缘层,可以阻止背光照射到半导体层上,有效减小光照漏电流,从而提高了TFT的特性;可以防止背光区域产生漏光,从而减少彩膜基板上的黑矩阵面积,提高TFT-LCD的开口率;并且,将黑色树脂绝缘层的面积设置为大于源漏电极与数据线的面积,甚至可以采用阵列基板上的不透明绝缘层替代彩膜基板中的黑矩阵,进一步提高了TFT-LCD的开口率。
实施例三
本实用新型实施例三提供一种液晶显示器,包括液晶面板,其特征在于:所述液晶面板包括对盒设置的彩膜基板和本实用新型实施例中提供的任意一种结构的阵列基板,所述彩膜基板和阵列基板中夹设有液晶层。
本实施例液晶显示器的阵列基板中,栅绝缘层包括不透明绝缘层,可以阻止背光照射到有源层上,减小光照漏电流,提高薄膜晶体管开关元件的性能,可以防止背光区域产生漏光,减少彩膜基板上的黑矩阵面积,提高TFT-LCD开口率;将栅绝缘层的不透明绝缘层的面积设置为大于数据线与薄膜晶体管开关元件的面积,可以防止背光区域产生漏光,替代彩膜基板中的黑矩阵,进一步提高TFT-LCD的开口率。
最后应说明的是:以上实施例仅用以说明本实用新型的技术方案,而非对其限制;尽管参照前述实施例对本实用新型进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本实用新型各实施例技术方案的精神和范围。

Claims (8)

1.一种阵列基板,包括衬底基板,所述衬底基板上形成有横纵交叉围设形成多个像素单元的数据线和栅线,每个像素单元中包括像素电极和薄膜晶体管开关元件,所述薄膜晶体管开关元件包括栅电极、源电极、漏电极和有源层,其特征在于:
所述栅电极与有源层之间设置有栅绝缘层,所述栅绝缘层包括不透明绝缘层。
2.根据权利要求1所述的阵列基板,其特征在于:所述栅绝缘层还包括透明绝缘层,所述透明绝缘层形成在所述不透明绝缘层之下。
3.根据权利要求2所述的阵列基板,其特征在于:所述不透明绝缘层对应所述数据线、源电极、漏电极设置。
4.根据权利要求2或3所述的阵列基板,其特征在于:所述不透明绝缘层的面积大于其上层的数据线或有源层的面积。
5.根据权利要求1-3任一所述的阵列基板,其特征在于:所述不透明绝缘层为黑色树脂绝缘层。
6.根据权利要求1-3任一所述的阵列基板,其特征在于:所述不透明绝缘层的厚度为
Figure FSA00000342142500011
7.根据权利要求2或3所述的阵列基板,其特征在于:所述透明绝缘层的厚度为
Figure FSA00000342142500012
8.一种液晶显示器,包括液晶面板,其特征在于:所述液晶面板包括对盒设置的彩膜基板和权利要求1-7任一所述的阵列基板,所述彩膜基板和阵列基板中夹设有液晶层。
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