CN201657501U - 一种线路板金手指 - Google Patents

一种线路板金手指 Download PDF

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Publication number
CN201657501U
CN201657501U CN 201020109297 CN201020109297U CN201657501U CN 201657501 U CN201657501 U CN 201657501U CN 201020109297 CN201020109297 CN 201020109297 CN 201020109297 U CN201020109297 U CN 201020109297U CN 201657501 U CN201657501 U CN 201657501U
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Prior art keywords
golden finger
free end
circuit board
tie point
stress
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Expired - Lifetime
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CN 201020109297
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谢兵斌
庞道成
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BYD Co Ltd
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BYD Co Ltd
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Priority to CN 201020109297 priority Critical patent/CN201657501U/zh
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Priority to PCT/CN2011/070340 priority patent/WO2011091730A1/en
Priority to EP11736612.0A priority patent/EP2529605B1/en
Priority to US13/575,921 priority patent/US9055684B2/en
Priority to JP2012550310A priority patent/JP5512828B2/ja
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Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/04Pins or blades for co-operation with sockets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/10Sockets for co-operation with pins or blades
    • H01R13/11Resilient sockets
    • H01R13/113Resilient sockets co-operating with pins or blades having a rectangular transverse section
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09409Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes

Abstract

本实用新型提供了一种线路板金手指,包括与线路板本体相连接的本体部及远离线路板本体方向的自由端部,所述本体部的左侧与自由端部的左侧通过第一连接点连接,所述本体部的右侧与自由端部的右侧通过第二连接点连接;所述第一连接点与第二连接点的连线与水平线有一夹角。本实用新型的金手指能够很好的将金手指左右边应力集中的位置错开,从而金手指自由端部和本体部的连接部位(最脆弱部位)的应力各变为原来的一半,明显提高金手指抗击应力破坏的能力,能够很好的保护金手指。另外,此非对称结构设计的金手指仍能还对应连接器很好的电导通。

Description

一种线路板金手指
技术领域
本发明涉及一种线路板金手指。
背景技术
众所周知,两线路板之间通常以板对板连接器、线对板连接器、柔性印刷线路板/柔性印刷线路板(FPC/FPC)连接器等连接,在此当中,FPC/FPC连接器以其低成本的特点获得广泛使用。同时,与FPC/FPC连接器搭配的拔插金手指也就大量的用在柔性印刷线路板上。
传统的柔性印刷线路板的拔插金手指都采用对称式的设计(如附图1所示)。金手指呈规整的左右对称。然而,如此设计存在一个明显缺陷,金手指上有两处脆弱的地方,由于金手指经常需要在对应连接器上拔插,金手指拔插的时候应力就集中在该脆弱的地方(如附图1所示),很容易把金手指弄断,存在很大的风险。
发明内容
本实用新型要解决的技术问题是现有的线路板金手指存在应力集中,容易断裂的缺陷,从而提供一种应力分散,不易断裂的线路板金手指。
本实用新型是通过以下技术方案实现的:
一种线路板金手指,包括与线路板本体相连接的本体部及远离线路板本体方向的自由端部,所述本体部的左侧与自由端部的左侧通过第一连接点连接,所述本体部的右侧与自由端部的右侧通过第二连接点连接;
所述第一连接点与第二连接点的连线与水平线有一夹角。
进一步,所述第一连接点与第二连接点的连线与水平线有一夹角为45°-65°。
进一步,所述第一连接点到第二连接点所在水平线的距离为0.10mm-0.2mm。如果距离小于0.10mm,就不能很好的分散应力;如果距离大于0.20mm,就会影响金手指的接触点。
进一步,所述本体部与自由端部之间是通过平滑的弧线连接。平滑的弧线连接使本体部和自由端部的连接没有明显的界限,应力更分散,使本体部和自由端部很好的连接在一起。
进一步,所述平滑的弧线为半径为0.10-0.15mm的圆弧。圆弧能够更好、更均匀地分散应力,理论上来讲弧线直径越大对应力的分散程度越好,本实用新型优选为半径为0.10-0.15mm的圆弧。
在拔插金手指时,应力会集中在金手指自由端部和本体部的连接部位,所以本实用新型的金手指能够很好的将金手指左右边应力集中的位置错开,从而金手指自由端部和本体部的连接部位(最脆弱部位)的应力各变为原来的一半,明显提高金手指抗击应力破坏的能力,能够很好的保护金手指。另外,此非对称结构设计的金手指仍能还对应连接器很好的电导通。
附图说明
图1为传统的插拔金手指示意图;
图2为本实用新型金手指示意图;
图3为图2的局部放大图。
具体实施方式
为了使本实用新型所解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。
如图2和图3所示的金手指,是本实用新型的一个实施例,包括与线路板本体相连接的本体部1及远离线路板本体方向的自由端部2,所述本体部1的左侧与自由端部2的左侧通过第一连接点3连接,所述本体部1的右侧与自由端部2的右侧通过第二连接点4连接;所述第一连接点3与第二连接点4的连线与水平线有一夹角α。
第一连接点与第二连接点的连线与水平线有一夹角为58°。所述第一连接到第二连接点所在水平线的距离为0.16mm。所述本体部与自由端部之间是通过平滑的弧线连接。进一步,所述平滑的弧线为半径为0.15mm的圆弧。
金手指柔性线路板制作流程为:铜箔裁断→层压干膜→曝光→显影→蚀刻→剥膜→贴盖膜→热压盖膜→贴补强→热压补强→镀金→外形加工。该流程为本领域技术人员所公知的技术,在此不再赘述。
插拔金手指的弯折性能测试方法为将拔插金手指插入对应连接器并拔出,检查拔插金手指线路状况,如此往复,直至插拔金手指上出现裂纹。计算插拔次数。
实施例1
采用上述的金手指,并根据上述流程制作柔性线路板,测试金手指弯折性能。测试结果见表1。
比较例1
采用传统的对称结构的金手指,并根据上述流程制作柔性线路板,测试金手指弯折性能。测试结果见表1。
                表1
  拔插金手指设计方法   插拔性能/次
  实施例1   348
  对比例1   78
从表1中可以看出,本实用新型得到的金手指可以插拨348次,而对比例得到的金手指只可以插拨78次,所以本实用新型得到的金手指能够很好的分散应力,使金手指不易断裂。

Claims (5)

1.一种线路板金手指,包括与线路板本体相连接的本体部及远离线路板本体方向的自由端部,所述本体部的左侧与自由端部的左侧通过第一连接点连接,所述本体部的右侧与自由端部的右侧通过第二连接点连接;
其特征在于:所述第一连接点与第二连接点的连线与水平线有一夹角。
2.如权利要求1所述的线路板金手指,其特征在于:所述第一连接点与第二连接点的连线与水平线有一夹角为45°-65°。
3.如权利要求1或2所述的线路板金手指,其特征在于:所述第一连接点到第二连接点所在水平线的距离为0.10mm-0.2mm。
4.如权利要求3所述的金手指,其特征在于:所述本体部与自由端部之间是通过平滑的弧线连接。
5.如权利要求4所述的金手指,其特征在于:所述平滑的弧线为半径为0.10-0.15mm的圆弧。
CN 201020109297 2010-01-29 2010-01-29 一种线路板金手指 Expired - Lifetime CN201657501U (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN 201020109297 CN201657501U (zh) 2010-01-29 2010-01-29 一种线路板金手指
PCT/CN2011/070340 WO2011091730A1 (en) 2010-01-29 2011-01-17 Contact piece of golden finger, golden finger and connector comprising the golden finger
EP11736612.0A EP2529605B1 (en) 2010-01-29 2011-01-17 Contact piece of golden finger, golden finger and connector comprising the golden finger
US13/575,921 US9055684B2 (en) 2010-01-29 2011-01-17 Contact piece of gold finger, gold finger and connector comprising the gold finger
JP2012550310A JP5512828B2 (ja) 2010-01-29 2011-01-17 ゴールデンフィンガーの接点片、ゴールデンフィンガー、及び、ゴールデンフィンガーを備えるコネクタ

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CN 201020109297 CN201657501U (zh) 2010-01-29 2010-01-29 一种线路板金手指

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EP (1) EP2529605B1 (zh)
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CN (1) CN201657501U (zh)
WO (1) WO2011091730A1 (zh)

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WO2011091730A1 (en) * 2010-01-29 2011-08-04 Byd Company Limited Contact piece of golden finger, golden finger and connector comprising the golden finger
CN106652786A (zh) * 2015-11-04 2017-05-10 三星显示有限公司 印刷电路板和包括该印刷电路板的显示设备
CN106652786B (zh) * 2015-11-04 2024-03-26 三星显示有限公司 印刷电路板和包括该印刷电路板的显示设备

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EP2529605A4 (en) 2013-08-07
EP2529605A1 (en) 2012-12-05
US20120302111A1 (en) 2012-11-29
JP2013518417A (ja) 2013-05-20
WO2011091730A1 (en) 2011-08-04
EP2529605B1 (en) 2017-09-13
JP5512828B2 (ja) 2014-06-04
US9055684B2 (en) 2015-06-09

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