CN1980523A - 金属芯子、封装板、及其制造方法 - Google Patents
金属芯子、封装板、及其制造方法 Download PDFInfo
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Abstract
本发明涉及一种金属芯子以及具有该金属芯子的封装板。该封装板包括:金属芯子,其具有沿纵向在其表面上形成的多个突起;绝缘层,层积在金属芯子上;以及内层电路,形成在绝缘层上,用于芯片与外部之间的信号连接。由于这些突起使得该封装板具有较大的表面面积,从而该封装板在热释放以及与绝缘层的粘附方面表现优良,并且对于翘曲具有优良的机械性能。
Description
相关申请交叉参考
本发明要求于2005年12月7日向韩国知识产权局提交的韩国专利申请No.2005-0118610的权益,其公开内容整体结合于此作为参考。
技术领域
本发明涉及一种在电路板中使用的金属芯子、一种具有金属芯子的封装板、以及其制造方法。
背景技术
随着电子产品制造得更小巧和更轻便,表现为更小、更薄、密度更高、封装及便携式产品的趋势,多层印刷电路板也经历了向更精密图案以及更小和封装产品发展的趋势。因此,随着用于在多层印刷电路板上形成精密图案且用于改进可靠性及设计密度的原材料的变化,电路的成层合成(layer composition)向集成方向改变。构成也经历了从DIP(双列直插式封装)类型到SMT(表面安装技术)的转变,从而也增大了安装密度。此外,便携式电子设备的发展,以及对于多功能、国际互联网使用、视频芯片、以及高容量数据传输等需求,形成了对印刷电路板的更复杂设计以及更高级技术的需求。
有了印刷电路板上所安装的芯片数量及密度的这种增长,由于芯片产生的热量,印刷电路板需要优良的热释放性能。同样,对于板上安装的数量日益增加的元件,另一个需求是板中不发生翘曲。
发明内容
本发明目的在于提供一种金属芯子、一种具有该金属芯子的封装板、以及其制造方法,该金属芯子提供了优良的热释放性能以及对于翘曲的优良机械性能。
本发明的另一目的在于提供一种金属芯子、一种具有该金属芯子的封装板、以及其制造方法,该金属芯子可以容易地粘附到绝缘层上。
本发明的一方面提供了一种包括沿纵向形成于其表面上的多个突起的金属芯子。
根据本发明实施例的金属芯子可以包括一个或多个以下的特征。例如,突起可以形成在金属芯子的两侧上。另外,金属芯子可以包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。
本发明的另一方面提供了一种封装板,包括:金属芯子,其具有沿纵向形成于其表面上的多个突起;绝缘层,层积在金属芯子上;以及内层电路,形成于绝缘层上,用于芯片与外部之间的信号连接。
根据本发明实施例的封装板可以包括一个或多个以下的特征。例如,绝缘层可以是涂覆到树脂涂覆铜箔上的树脂。突起可以形成在金属芯子的两侧上,而金属芯子可以形成为包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。
本发明的再一方面提供了一种制造封装板的方法,包括:(a)处理金属板的至少一个表面,以提供具有沿纵向形成的突起的金属芯子;(b)在金属芯子上层积至少一层绝缘层;以及(c)形成内层电路并安装芯片。
根据本发明实施例的制造封装板的方法可以包括一个或多个以下的特征。例如,在处理金属板的至少一个表面以提供具有沿纵向形成的突起的金属芯子的操作(a)中,金属芯子可以通过压制处理(press processing)形成,并且突起可以形成在金属芯子的两侧上。金属板可以包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。另外,绝缘层可以通过在金属芯子上层积至少一层树脂涂覆铜箔而形成。
本发明的其它方面及优点将在以下描述中部分地得到阐明,并且部分地从该描述中显而易见,或者可以通过本发明的实施而理解。
附图说明
图1为根据本发明实施例的金属芯子的透视图;
图2为沿图1的线I-I′的金属芯子的横截面图;
图3为根据本发明实施例的封装板的横截面图;
图4为在根据本发明实施例的制造封装板的方法中树脂涂覆铜箔层积到金属芯子的两侧上之后的横截面图;
图5为通孔形成在图4中示出的层积有树脂涂覆铜箔的金属芯子中之后的横截面图;
图6为在进行喷镀以在图5的层积有树脂涂覆铜箔的金属芯子上形成镀层之后的横截面图;
图7为在形成电路图案并选择性地施加阻焊剂以在图6的层积有树脂涂覆铜箔的金属芯子上形成导线焊垫和球焊垫之后的横截面图;
图8为在将可剥离涂层附着到图7中示出的树脂涂覆铜箔上的安装有芯片的部分之后的横截面图。
具体实施方式
在下文中,将参照附图详细说明本发明的实施例。在参照附图的描述中,相同的参考标号表示相同或相应的元件,而与图号无关,并且将省略多余的描述。
现在将参照图1及图2提供根据本发明实施例的金属芯子30的详细说明。
参照图1,根据本发明实施例的金属芯子30具有沿纵向形成在金属板的两侧上的突起31。如图3所示,金属芯子30,用作封装板50的衬底,以改进板的热释放性能以及对于翘曲的机械性能。金属芯子30可以形成为包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。铝(Al)是良好的电导体,具有的电阻率是铜的1.6倍,并且也是良好的热导体,在安装芯片时可以提供优良的热释放作用。铝也是轻金属,强度质量比高,从而可以减小整个板的质量及厚度。
突起31沿金属芯子30的纵向形成,并且增加了金属芯子30的表面面积,以提高对绝缘层(图3中的53)的粘附。此外,由于突起31而使得表面面积增加,热能够更容易地释放。
参照图2,金属芯子30具有I字梁形式的横截面。通常,对于相同的横截面面积,面积转动惯量越大,弯曲强度越大。因此,I字梁具有比相同横截面面积的方形梁更大的弯曲强度。突起31的高度33和宽度35可以应需要而改变。另外,显然,突起31可以改变为具有多种横截面,例如具有四边形或锥形形状。
尽管在图1及图2中,突起31形成在金属芯子30的两侧上,但突起31也可以只形成在金属芯子30的一侧上。
现在将参照图3提供根据本发明实施例的封装板的详细说明。
参照图3,根据本发明实施例的封装板用作具有多个突起31的金属芯子30的衬底。在金属芯子30的每一侧上,依次层积有绝缘层53及铜层压板55,而且在铜层压板55上形成有镀层56。另外,阻焊剂61被填充到在金属芯子30、绝缘层53、及铜层压板55中形成的通孔59中,同时芯片75通过导线69与导线焊垫63连接。导线焊垫63通过镀层56电连接至焊料球67。
由于根据该实施例的封装板50使用具有多个突起31的金属芯子30,其对于翘曲具有优良的机械性能。另外,由于多个突起31使得表面面积增大时,由芯片75产生的热能够轻易地被释放,并且可以更好地粘附于绝缘层53。
现在将提供根据本发明实施例的封装板的每个元件的详细说明。
绝缘层53通过层积绝缘材料(诸如环氧树脂等等)而形成在金属芯子30的两侧上。绝缘层53填充到金属芯子30的突起31之间的间隙中,以附着至金属芯子30。铜层压板55层积在绝缘层53上,并与镀层56共同构成电路图案。绝缘层53和铜层压板55可以单独地层积到金属芯子30上,或者可以使用树脂涂覆铜(RRC)箔。树脂涂覆铜箔为板,其中镀铜积到用作绝缘层的树脂层的一侧上。
为了电连接到封装板50的上侧和下侧,通孔59穿透金属芯子30、绝缘层53、及铜层压板55而形成。此外,镀层56形成在通孔59的内周界上,以将对应的导线焊垫63与球焊垫65相连接。另外,阻焊剂61填充到通孔59内部。
镀层56为形成于通孔59的内周界上以及铜层压板55上的层。电路图案通过蚀刻处理等形成在镀层56上。另外,就电路图案的形成而言,与导线69连接的导线焊垫63以及球焊垫65形成在镀层56上。导线焊垫63和球焊垫65分别由镀层56连接。镀层56通常通过镀铜或金而形成,它们都是导电金属。
阻焊剂61是填充在通孔59中并形成在铜层压板55的部分上的绝缘材料。由于阻焊剂61,导线焊垫63形成在镀层56的上侧上,与其它部分绝缘,同时用于附着焊料球67的球焊垫65形成在下侧上。
电路图案通过在镀层56或铜层压板55上进行的蚀刻等,分别形成在封装板50的上侧和下侧上。由于电路图案的形成,分别地,导线焊垫63形成在封装板50的上侧上,而球焊垫65形成在下侧上。电路图案通过阻焊剂61绝缘。
由于电路图案的形成,导线焊垫63形成在封装板50上,并通过阻焊剂61与其它部分绝缘。与芯片75连接的导线69电连接到导线焊垫63。球焊垫65形成在位于封装板50的下部上的镀层56上,并且焊料球67附着于球焊垫65。
芯片75安装在封装板50的镀层56上,并且通过导线69与导线焊垫63连接。此外,导线焊垫63通过在通孔59中形成的镀层56与球焊垫65连接,而且焊料球67附着于球焊垫65,以与外部电连接。导线69、导线焊垫63、在通孔59中形成的镀层56、以及球焊垫65构成内层电路,该内层电路将芯片75与外部连接。芯片75和导线69通过模塑料77模塑而成,从而其不会受外部环境的影响。
参照图4到图8,现在提供制造根据本发明实施例的封装板的方法的详细说明。首先将说明制造金属芯子30的方法。
金属芯子30通过压制金属板(未示出)使其具有一定厚度来制造,该过程中,通过在一侧或两侧上应用压模处理,形成突起31。通过压模来形成金属芯子30使得制造更容易,并且在压模期间所作用的力为金属板提供了更紧密的结构。用于金属芯子30的金属板可以包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的一种。突起31的横截面、高度、以及间距等可以应需要而改变。另外,突起31可以通过蚀刻而形成。
参照图4,在金属芯子30的上侧和下侧上层积绝缘层53和铜层压板55。绝缘层53和铜层压板55可以利用树脂涂覆铜(RRC)通过如下布置树脂涂覆铜箔而形成,即使得树脂面向金属芯子30,并随后进行热层积。
参照图5,形成通孔59,用于连接金属芯子30的上侧和下侧。通孔59可以利用激光处理(例如YAG(钇铝石榴石)激光或二氧化碳激光),或者利用机械钻孔来形成。YAG激光能够处理金属芯子30和铜层压板55。
参照图6,在通孔59内部及在铜层压板55上形成镀层56。镀层56通过化学镀铜或电镀铜而形成,其中化学镀铜是指作为用于在铜电镀中形成所需导电膜的预加工步骤而进行的镀层。镀层56因此而电连接到封装板的上侧及下侧。
形成镀层56之后,在镀层56上形成电路图案。形成电路图案的方法包括在镀层56上形成抗蚀图案(未示出),并且为了形成抗蚀图案,印刷在底图膜上的图案被转印到镀层56上。对于这种转印有各种方法,其中最常用的是,通过紫外线将印刷底图膜上的电路图案转印到干膜上的过程中所使用的感光干膜。LPR(液态光阻)也可以替代干膜而使用。
电路图案已经转印于其上的干膜或LPR,用作抗蚀剂,并且当板被浸入到蚀刻液体中时,在未形成抗蚀图案的区域中的镀层被去除,从而形成了特殊的电路图案。在形成电路图案之后,通过例如AOI(自动光学检测)等方法来检测电路的外观,以确保电路已经正确地形成,并且进行表面处理,例如黑色氧化处理。AOI是自动检测电路板外观的方法,其通过利用图像传感器及计算机的图案识别技术,来检测电路板的外观。图像传感器读取目标电路的图案信息,之后与参考数据进行比较,以确定是否存在缺陷。黑色氧化处理是在将形成有布线图案的内层与外层附着之前用于增加粘附和热阻的工艺。
参照图7,将阻焊剂61施加到通孔59内部以及镀层56上。阻焊剂61不仅保护形成在通孔59内周界上的镀层56,而且还形成导线焊垫63及球焊垫65。
参照图8,将可剥离涂层73附着到图3所示的芯片75所在的部分上。就附着的可剥离涂层73而言,在导线焊垫63及球焊垫65上进行镀金。使用可剥离涂层73的理由是,如果在芯片75所在的部分上进行电镀处理,芯片75可能不会牢固地附着到镀层56上。如图3所示,在可剥离涂层73去除之后安装芯片75,芯片75和导线焊垫63都连接到导线69,并随后用模塑料77进行模塑,以便于保护芯片75。然后,在球焊垫65上形成焊料球67,以完成球栅格阵列(以下称为“BGA”)封装。
虽然该实施例以BGA封装作为实例,但本发明并不限于此,并且本发明能够应用到可使用金属芯子的任何类型的电路板。例如,金属芯子也可以在倒装芯片封装中使用。
根据上述说明所陈述的本发明,可以提供一种金属芯子、一种具有该金属芯子的封装板、以及其制造方法,该金属芯子提供了优良的热释放性能以及对于翘曲的优良机械性能。
另外,可以提供一种金属芯子、一种具有该金属芯子的封装板、以及其制造方法,该金属芯子能够容易地粘附到绝缘层上。
尽管已经描述了本发明的一些优选实施例,但是本领域技术人员应该能够理解,在不背离所附权利要求及其等同物所限定的本发明的精神和范围的前提下,可以进行大量的修改和替换。
Claims (12)
1.一种在电路板中使用的金属芯子,所述金属芯子包括:沿纵向在其表面上形成的多个突起。
2.根据权利要求1所述的金属芯子,其中,所述突起形成在所述金属芯子的两侧上。
3.根据权利要求1所述的金属芯子,包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。
4.一种封装板,包括:
金属芯子,其具有沿纵向在其表面上形成的多个突起;
绝缘层,层积在所述金属芯子上;以及
内层电路,形成在所述绝缘层上,用于芯片与外部之间的信号连接。
5.根据权利要求4所述的封装板,其中,所述绝缘层包含涂覆到树脂涂覆铜箔上的树脂。
6.根据权利要求4所述的封装板,其中,所述突起形成在所述金属芯子的两侧上。
7.根据权利要求4所述的封装板,其中,所述金属芯子形成为包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。
8.一种制造封装板的方法,所述方法包括:
(a)处理金属板的至少一个表面,以提供具有沿纵向形成的突起的金属芯子;
(b)在所述金属芯子上层积至少一层绝缘层;以及
(c)形成内层电路并安装芯片。
9.根据权利要求8所述的方法,其中,在处理金属板的至少一个表面以提供具有沿纵向形成的突起的金属芯子的所述操作(a)中,所述金属芯子通过压制处理形成。
10.根据权利要求8所述的方法,其中,处理金属板的至少一个表面以提供具有沿纵向形成的突起的金属芯子的所述操作(a),包括在所述金属板的两侧上形成所述突起。
11.根据权利要求8所述的方法,其中,在处理金属板的至少一个表面以提供具有沿纵向形成的突起的金属芯子的所述操作(a)中,所述金属板包含铜(Cu)、铝(Al)、钛(Ti)、锌(Zn)、以及钽(Ta)中的任一种。
12.根据权利要求8所述的方法,其中,在所述金属芯子上层积至少一层绝缘层的所述操作(b),包括在所述金属芯子上层积树脂涂覆铜箔。
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CN102165582A (zh) * | 2008-09-29 | 2011-08-24 | 凸版印刷株式会社 | 引线框基板及其制造方法以及半导体装置 |
CN103404240A (zh) * | 2011-03-03 | 2013-11-20 | 皇家飞利浦有限公司 | 电路板组装件 |
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EP2145515A2 (en) * | 2007-04-05 | 2010-01-20 | Kia Kuang Tan | High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity |
JP4991637B2 (ja) * | 2008-06-12 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2010238821A (ja) * | 2009-03-30 | 2010-10-21 | Sony Corp | 多層配線基板、スタック構造センサパッケージおよびその製造方法 |
JP5416481B2 (ja) * | 2009-05-20 | 2014-02-12 | 矢崎総業株式会社 | メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 |
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DE102011102484B4 (de) * | 2011-05-24 | 2020-03-05 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
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CN103456645B (zh) * | 2013-08-06 | 2016-06-01 | 江阴芯智联电子科技有限公司 | 先蚀后封三维系统级芯片正装堆叠封装结构及工艺方法 |
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US11282777B2 (en) * | 2019-12-31 | 2022-03-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method of manufacturing the same |
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US20030168249A1 (en) * | 2002-02-14 | 2003-09-11 | Ngk Spark Plug Co., Ltd. | Wiring board and method for producing the same |
JP2004063803A (ja) * | 2002-07-29 | 2004-02-26 | Ngk Spark Plug Co Ltd | プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板 |
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Cited By (4)
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CN102165582A (zh) * | 2008-09-29 | 2011-08-24 | 凸版印刷株式会社 | 引线框基板及其制造方法以及半导体装置 |
CN102165582B (zh) * | 2008-09-29 | 2013-08-07 | 凸版印刷株式会社 | 引线框基板及其制造方法以及半导体装置 |
CN103404240A (zh) * | 2011-03-03 | 2013-11-20 | 皇家飞利浦有限公司 | 电路板组装件 |
CN103404240B (zh) * | 2011-03-03 | 2017-09-08 | 飞利浦照明控股有限公司 | 电路板组装件 |
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