JP5416481B2 - メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 - Google Patents
メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 Download PDFInfo
- Publication number
- JP5416481B2 JP5416481B2 JP2009122097A JP2009122097A JP5416481B2 JP 5416481 B2 JP5416481 B2 JP 5416481B2 JP 2009122097 A JP2009122097 A JP 2009122097A JP 2009122097 A JP2009122097 A JP 2009122097A JP 5416481 B2 JP5416481 B2 JP 5416481B2
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- JP
- Japan
- Prior art keywords
- metal core
- wiring board
- core wiring
- terminal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the PCB or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connection Or Junction Boxes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本発明品1のメタルコア配線板4は、前述した実施形態のメタルコア配線板4で構成され、導体板12,13が、銅を98.5質量部、ニッケルを1.0質量部、錫を0.05質量部含んだ銅合金で構成されて、硬度が160で、導電率(IACS)が40%である。
本発明品2のメタルコア配線板4は、前述した実施形態のコアメタル配線板4で構成され、導体板12,13が、銅を99.98質量部、ジルコニウムを0.02質量部含んだ銅合金で構成されて、硬度が130で、導電率(IACS)が90%である。なお、硬度とは、ビッカース硬さをいい、導電率(IACS)とは、軟銅の20℃における固有抵抗を100%としたときの固有抵抗をいう。
比較例1のメタルコア配線板は、前述した特許文献に示された構成である。
前述した本発明品1、本発明品2、及び、比較例を、それぞれ、電源及び複数の電子機器に接続して、電源から供給された電圧の複数の電子機器への分配(供給)を行った。
2 ケース
4 メタルコア配線板
5 基板
6 リレー(電気部品)
7 コネクタブロック
10 絶縁シート(絶縁体)
12 導体板(金属コア)
12a 本体部
12b 端子部
13 導体板(金属コア)
13a 本体部
13b 端子部
Claims (2)
- 平板状の複数の金属コアと該複数の金属コアを覆う絶縁体とを有した基板と、前記基板の表面に実装され且つ前記複数の金属コア同士を所定のパターンで接続した複数の電気部品と、を備えたメタルコア配線板において、
前記金属コアは、前記絶縁体により覆われた本体部と、この本体部に連なり且つ前記絶縁体の外縁から突出した端子部とを有しており、
前記複数の金属コアが、銅と、鉄、ニッケル、錫及びジルコニウムのうち少なくとも一つとを含んだ銅合金で構成され、
前記電気部品は、前記複数の金属コアを跨いで前記基板の表面に実装されるとともに、前記基板の表面から前記金属コアに亘って形成されたスルーホールを介して前記金属コアと接続されていることを特徴とするメタルコア配線板。 - ケースと、前記ケース内に収容され且つ複数の電気部品が実装されたメタルコア配線板と、前記メタルコア配線板に取り付けられるコネクタブロックと、を備えた電気接続箱において、
前記メタルコア配線板として、請求項1に記載のメタルコア配線板を備えていることを特徴とする電気接続箱。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009122097A JP5416481B2 (ja) | 2009-05-20 | 2009-05-20 | メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 |
US12/801,037 US8716604B2 (en) | 2009-05-20 | 2010-05-18 | Metal core wiring board and electric junction box having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009122097A JP5416481B2 (ja) | 2009-05-20 | 2009-05-20 | メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010273433A JP2010273433A (ja) | 2010-12-02 |
JP5416481B2 true JP5416481B2 (ja) | 2014-02-12 |
Family
ID=43123823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009122097A Active JP5416481B2 (ja) | 2009-05-20 | 2009-05-20 | メタルコア配線板、及び、該メタルコア配線板を備えた電気接続箱 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8716604B2 (ja) |
JP (1) | JP5416481B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013027146A (ja) * | 2011-07-21 | 2013-02-04 | Yazaki Corp | 配線基板 |
KR101518942B1 (ko) * | 2013-12-20 | 2015-05-11 | 현대자동차 주식회사 | 차량용 정션 박스 |
CN104393160B (zh) * | 2014-10-24 | 2017-01-11 | 重庆市鸣浩电子科技有限公司 | 一种六引脚5050led灯的焊盘 |
CN115157963A (zh) * | 2022-07-28 | 2022-10-11 | 青岛海尔空调器有限总公司 | 接线盒组件以及包含其的驻车空调 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4845313A (en) * | 1985-07-22 | 1989-07-04 | Tokyo Communication Equipment Co., Ltd. | Metallic core wiring substrate |
JPH06104543A (ja) * | 1992-09-22 | 1994-04-15 | Nippon Steel Corp | 放熱性の優れたプリント配線板用銅張積層板およびその製造方法 |
JP2002095134A (ja) * | 2000-09-08 | 2002-03-29 | Sumitomo Wiring Syst Ltd | バスバー回路および該バスバー回路を備えたジャンクションボックス |
JP2005151617A (ja) * | 2003-11-11 | 2005-06-09 | Sumitomo Wiring Syst Ltd | 回路構成体及び回路構成体の製造方法 |
JP4181028B2 (ja) * | 2003-12-22 | 2008-11-12 | 矢崎総業株式会社 | 電気接続箱 |
US7632110B2 (en) * | 2004-11-29 | 2009-12-15 | Autonetworks Technologies, Ltd. | Electric junction box |
JP4686218B2 (ja) | 2005-03-11 | 2011-05-25 | 矢崎総業株式会社 | メタルコア基板及びこれを利用した車載システム |
JP2006333583A (ja) | 2005-05-24 | 2006-12-07 | Yazaki Corp | 電源ホルダー構造 |
KR100653249B1 (ko) * | 2005-12-07 | 2006-12-04 | 삼성전기주식회사 | 메탈코어, 패키지 기판 및 그 제작방법 |
JP4825720B2 (ja) * | 2007-04-19 | 2011-11-30 | 矢崎総業株式会社 | プリント配線板 |
-
2009
- 2009-05-20 JP JP2009122097A patent/JP5416481B2/ja active Active
-
2010
- 2010-05-18 US US12/801,037 patent/US8716604B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20100294561A1 (en) | 2010-11-25 |
JP2010273433A (ja) | 2010-12-02 |
US8716604B2 (en) | 2014-05-06 |
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