CN1960597B - 混合多层电路板及其制造方法 - Google Patents

混合多层电路板及其制造方法 Download PDF

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Publication number
CN1960597B
CN1960597B CN2006101445686A CN200610144568A CN1960597B CN 1960597 B CN1960597 B CN 1960597B CN 2006101445686 A CN2006101445686 A CN 2006101445686A CN 200610144568 A CN200610144568 A CN 200610144568A CN 1960597 B CN1960597 B CN 1960597B
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CN
China
Prior art keywords
layer
circuit board
cable portion
screen
hybrid multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101445686A
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English (en)
Chinese (zh)
Other versions
CN1960597A (zh
Inventor
猪濑裕昭
五十岚努
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
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Publication date
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Publication of CN1960597A publication Critical patent/CN1960597A/zh
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Publication of CN1960597B publication Critical patent/CN1960597B/zh
Expired - Fee Related legal-status Critical Current
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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006101445686A 2005-11-04 2006-11-03 混合多层电路板及其制造方法 Expired - Fee Related CN1960597B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005320936A JP4808468B2 (ja) 2005-11-04 2005-11-04 混成多層回路基板およびその製造方法
JP2005320936 2005-11-04
JP2005-320936 2005-11-04

Publications (2)

Publication Number Publication Date
CN1960597A CN1960597A (zh) 2007-05-09
CN1960597B true CN1960597B (zh) 2010-10-06

Family

ID=38072028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101445686A Expired - Fee Related CN1960597B (zh) 2005-11-04 2006-11-03 混合多层电路板及其制造方法

Country Status (3)

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JP (1) JP4808468B2 (ja)
CN (1) CN1960597B (ja)
TW (1) TW200740331A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4898564B2 (ja) * 2007-06-06 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線板の製造方法及びプリント配線板の製造装置
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
JP5075568B2 (ja) * 2007-10-17 2012-11-21 株式会社フジクラ シールド付回路配線基板及びその製造方法
CN101982026A (zh) * 2008-03-25 2011-02-23 住友电木株式会社 刚挠性结合电路板的制造方法及刚挠性结合电路板
JP2009267081A (ja) * 2008-04-25 2009-11-12 Sony Chemical & Information Device Corp フレックスリジッド配線基板とその製造方法
TW201127246A (en) 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
JP2012209383A (ja) * 2011-03-29 2012-10-25 Murata Mfg Co Ltd 多層基板およびその製造方法
TWI422291B (zh) * 2011-04-20 2014-01-01 Adv Flexible Circuits Co Ltd Multi-layer stacked circuit cable with local separation section
CN105682354A (zh) * 2016-02-25 2016-06-15 广东欧珀移动通信有限公司 软硬结合板及终端
TWI660901B (zh) * 2018-09-04 2019-06-01 Chipbond Technology Corporation 撓性電路板捲帶
CN112449477B (zh) * 2019-08-27 2022-04-15 宏启胜精密电子(秦皇岛)有限公司 电路板的制造方法及电路板
KR20220099353A (ko) * 2021-01-06 2022-07-13 삼성전자주식회사 회로 기판 및 이를 포함하는 전자 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0184472U (ja) * 1987-11-26 1989-06-05
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP3176858B2 (ja) * 1996-12-11 2001-06-18 日本メクトロン株式会社 両面銅張プリント配線板
JP2001060746A (ja) * 1999-08-23 2001-03-06 Fuji Electric Co Ltd フレキシブルプリント配線板
JP2001167642A (ja) * 1999-12-13 2001-06-22 Daichu Denshi Co Ltd フレキシブルプリント配線板およびフレキシブルフラットケーブル

Also Published As

Publication number Publication date
TW200740331A (en) 2007-10-16
TWI377890B (ja) 2012-11-21
JP4808468B2 (ja) 2011-11-02
JP2007129087A (ja) 2007-05-24
CN1960597A (zh) 2007-05-09

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101006

Termination date: 20191103

CF01 Termination of patent right due to non-payment of annual fee