TW200740331A - Hybrid multilayer circuit board and method of manufacturing the same - Google Patents
Hybrid multilayer circuit board and method of manufacturing the sameInfo
- Publication number
- TW200740331A TW200740331A TW095134345A TW95134345A TW200740331A TW 200740331 A TW200740331 A TW 200740331A TW 095134345 A TW095134345 A TW 095134345A TW 95134345 A TW95134345 A TW 95134345A TW 200740331 A TW200740331 A TW 200740331A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- circuit board
- cable
- multilayer circuit
- hybrid multilayer
- Prior art date
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005320936A JP4808468B2 (ja) | 2005-11-04 | 2005-11-04 | 混成多層回路基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200740331A true TW200740331A (en) | 2007-10-16 |
TWI377890B TWI377890B (zh) | 2012-11-21 |
Family
ID=38072028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134345A TW200740331A (en) | 2005-11-04 | 2006-09-15 | Hybrid multilayer circuit board and method of manufacturing the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4808468B2 (zh) |
CN (1) | CN1960597B (zh) |
TW (1) | TW200740331A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8569630B2 (en) | 2010-01-22 | 2013-10-29 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
TWI422291B (zh) * | 2011-04-20 | 2014-01-01 | Adv Flexible Circuits Co Ltd | Multi-layer stacked circuit cable with local separation section |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4898564B2 (ja) * | 2007-06-06 | 2012-03-14 | ソニーケミカル&インフォメーションデバイス株式会社 | プリント配線板の製造方法及びプリント配線板の製造装置 |
KR101385094B1 (ko) * | 2007-09-11 | 2014-04-14 | 삼성디스플레이 주식회사 | 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 |
JP5075568B2 (ja) * | 2007-10-17 | 2012-11-21 | 株式会社フジクラ | シールド付回路配線基板及びその製造方法 |
CN101982026A (zh) * | 2008-03-25 | 2011-02-23 | 住友电木株式会社 | 刚挠性结合电路板的制造方法及刚挠性结合电路板 |
JP2009267081A (ja) * | 2008-04-25 | 2009-11-12 | Sony Chemical & Information Device Corp | フレックスリジッド配線基板とその製造方法 |
JP2012209383A (ja) * | 2011-03-29 | 2012-10-25 | Murata Mfg Co Ltd | 多層基板およびその製造方法 |
CN105682354A (zh) * | 2016-02-25 | 2016-06-15 | 广东欧珀移动通信有限公司 | 软硬结合板及终端 |
TWI660901B (zh) * | 2018-09-04 | 2019-06-01 | Chipbond Technology Corporation | 撓性電路板捲帶 |
CN112449477B (zh) * | 2019-08-27 | 2022-04-15 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板的制造方法及电路板 |
KR20220099353A (ko) * | 2021-01-06 | 2022-07-13 | 삼성전자주식회사 | 회로 기판 및 이를 포함하는 전자 장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0184472U (zh) * | 1987-11-26 | 1989-06-05 | ||
JPH04313300A (ja) * | 1991-04-10 | 1992-11-05 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板 |
JP3176858B2 (ja) * | 1996-12-11 | 2001-06-18 | 日本メクトロン株式会社 | 両面銅張プリント配線板 |
JP2001060746A (ja) * | 1999-08-23 | 2001-03-06 | Fuji Electric Co Ltd | フレキシブルプリント配線板 |
JP2001167642A (ja) * | 1999-12-13 | 2001-06-22 | Daichu Denshi Co Ltd | フレキシブルプリント配線板およびフレキシブルフラットケーブル |
-
2005
- 2005-11-04 JP JP2005320936A patent/JP4808468B2/ja active Active
-
2006
- 2006-09-15 TW TW095134345A patent/TW200740331A/zh unknown
- 2006-11-03 CN CN2006101445686A patent/CN1960597B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8569630B2 (en) | 2010-01-22 | 2013-10-29 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
TWI422291B (zh) * | 2011-04-20 | 2014-01-01 | Adv Flexible Circuits Co Ltd | Multi-layer stacked circuit cable with local separation section |
Also Published As
Publication number | Publication date |
---|---|
TWI377890B (zh) | 2012-11-21 |
JP4808468B2 (ja) | 2011-11-02 |
CN1960597B (zh) | 2010-10-06 |
JP2007129087A (ja) | 2007-05-24 |
CN1960597A (zh) | 2007-05-09 |
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