CN1960597B - Hybrid multilayer circuit board and manufacture method thereof - Google Patents
Hybrid multilayer circuit board and manufacture method thereof Download PDFInfo
- Publication number
- CN1960597B CN1960597B CN2006101445686A CN200610144568A CN1960597B CN 1960597 B CN1960597 B CN 1960597B CN 2006101445686 A CN2006101445686 A CN 2006101445686A CN 200610144568 A CN200610144568 A CN 200610144568A CN 1960597 B CN1960597 B CN 1960597B
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- layer
- circuit board
- cable portion
- screen
- hybrid multilayer
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Abstract
The present inveniton provides a hybrid multilayer circuit board and a manufacture method thereof to further enhance a bending property of a cable when a conductive layer is formed in an outside of a hybrid multilayer circuit board which extends at least one cable from a multilayer mounting part obtained by laminating an outer layer material on a circuit board serving as an inner layer and a shield layer is formed for electromagnetic wave disturbance. In the hybrid multilayer circuit board, at least one cable (b) extends from a layer except an outermost layer in a multilayer mounting part (a). The hybrid multilayer circuit board contains a shield layer for electromagnetic interference in an outside, and the shield layer (4) is arranged to have an opening gap between the shield layer and the cable at a location corresponding to the cable in the outermost layer. The hybrid multilayer circuit board has: 1) a base film (11) shared with a circuit layer of the outermost layer in the part mounting part; 2) a conductive layer 12 formed on the base film; and (3) a cover layer 13 for insulating and protecting the conductive layer.
Description
Technical field
Circuit board that the present invention relates to use in the electronic equipment and manufacture method thereof, particularly such hybrid multilayer circuit board and manufacture method thereof, wherein: becoming the stacked cladding material that constitutes by metal foil laminated body of film substrate or insulating properties film on the circuit board of internal layer, the outside left that extends the hybrid multilayer circuit board of at least 1 cable portion at the element installation portion from multilayer forms conductive layer, forms electromagnetic interference (Electromagnetic Interference; Hereinafter referred to as EMI) screen.
Background technology
As the EMI countermeasure in the circuit board, known method is to form conductive layer (patent documentation 1) on substrate surface.
On the other hand, as circuit board, have traditionally at notebook computer, fold type portable telephone etc. and have the hybrid multilayer circuit board (patent documentation 2) that adopts in the position that opens and closes repeatedly continually of hinge arrangement.This forms with the stacked cladding material of adhesives at the flexible electric circuit board that becomes internal layer, therefore, have from the extended flexible electric circuit board of interior layer segment as cable portion and the interconnective structure of element installation portion, or have the structure that the terminal for connecting of the front end by being positioned at cable portion is connected with other electronic units.
In the conventional art, on such hybrid multilayer circuit board, the skin of element installation portion is pre-formed the screen that has grounding pattern concurrently, and the flexible electric circuit board that becomes cable portion adopts the two sides to have the flexible electric circuit board of circuit Copper Foil, forms shielding pattern on the one surface.
Adopt the occasion of this flexible electric circuit board, in recent years, many in hinge, coil and take in (patent documentation 3) carrying out helical form on the flexible electric circuit board of cable portion.And, also show and the complicated corresponding hinge structure (patent documentation 4) of action.Thereby people are seeking to have the flexible electric circuit board as cable portion of better submissive performance always.
Usually know all that as the flexible electric circuit board of cable portion, single face has the circuit board of circuit Copper Foil that the compliance good (patent documentation 5) of the circuit board of circuit Copper Foil is arranged than the two sides.Thereby, replacing the flexible electric circuit board that there is the circuit Copper Foil on the two sides, patent documentation 6 grades disclose and have adopted 2 to be the cable portion structure that single face has the flexible electric circuit board of circuit Copper Foil.It is effectively that this method is improved for compliance, still, owing to only at single face the circuit Copper Foil is arranged, can not form shielding pattern in cable portion.
In this case, in order to form screen, the method that for example has patent documentation 7 to be put down in writing: the conductive shield film is connected across cable portion and element installation portion.But the compliance for the action that realizes dealing with patent documentation 3 described complexity needs soft more material.
Form screen if replace the conductive shield film, can improve compliance in general with printing conductive coating.Silk screen printing is adopted in the printing of conductive coating paint more, and this printing process does not have complicated step and has versatility, therefore of great use.
But problem can take place during with method for printing screen printing conductive coating in the position of cross-over connection between the step part of the extended cable portion of layer segment at the element installation portion and in from it.
For example, as shown in Figure 6, in the multilayer circuit board via adhesives 2 stacked outer circuit plates 3 on inner layer circuit board 1, owing to the structure of extending 2 layers of cable portion b from element installation portion a and interior layer segment thereof forms step A, this part is skimmed in the printing of conductive coating paint 4, makes the attenuation of coating thickness.This is because screen printing plate can not be followed step A action, reaches 100 μ m at step A and takes place when above.
Skimmed in the printing way if form the conductive coating paint 4 of screen, the poor flow with grounding pattern will be taken place, thereby lost the effect of electromagnetic shielding.In addition, if coating thickness attenuation, at the position that opens and closes repeatedly continually with aforesaid hinge arrangement, the element installation portion a of coating thickness attenuation can take place during use and in it step A between extended cable portion b of layer segment produce stress, be full of cracks takes place and causes poor flow in conductive material 4, still can lose the function of electromagnetic shielding.
Pass sharp document 1] the real public clear 55-29276 communique of Japan
[patent documentation 2] Japanese kokai publication sho 64-7697 communique
[patent documentation 3] Japanese kokai publication hei 6-311216 communique
[patent documentation 4] TOHKEMY 2003-133764 communique
[patent documentation 5] Japan opens flat 1-93770 communique in fact
[patent documentation 6] Japanese kokai publication hei 7-312469 communique
[patent documentation 7] TOHKEMY 2000-269632 communique
[patent documentation 8] Japanese kokai publication hei 5-145205 communique
Summary of the invention
Countermeasure as the stress of the boundary part that relaxes element installation portion and cable portion, the scheme that patent documentation 8 proposes is: at the screen of stacked metal forming in the outside of flexible electric circuit board and resin bed formation, not bonding with flexible electric circuit board structure is arranged at the position of bending, in this example, connect by through hole plating between screen and the circuit.But because screen is overlapping and thickness increases by metal forming and plating layer, its compliance is restricted.
Thereby, the compliance good mixing multilayer circuit board of cable portion in the time of need being implemented in the outside left that extends the hybrid multilayer circuit board of at least 1 cable portion from the element installation portion of multilayer and having formed conductive layer promptly to the screen of electromagnetic interference.
The present invention conceives after having considered the problems referred to above and forms, its purpose is the hybrid multilayer circuit board and the manufacture method thereof that provide such, wherein, becoming on the circuit board of internal layer behind the stacked cladding material, when the outside left from the hybrid multilayer circuit board of extended at least 1 cable portion of element installation portion of multilayer forms conductive layer promptly to the screen of Electromagnetic Interference, can improve the compliance of cable portion more.
In order to reach above-mentioned purpose, the invention provides hybrid multilayer circuit board and manufacture method thereof, it is characterized in that,
Layer beyond the outermost layer from the element installation portion of multilayer extends at least 1 cable portion and above-mentioned cable portion and is provided with in the hybrid multilayer circuit board to the screen of electromagnetic interference, above-mentioned screen is located at the position corresponding to the above-mentioned cable portion in the above-mentioned outermost layer, and comprises: the 1) basilar memebrane that has with outermost circuit layer in the said elements installation portion; 2) conductive layer that on above-mentioned basilar memebrane, forms; And 3), and there is the space between the above-mentioned cable portion with the cover layer of above-mentioned conductive layer insulation protection.
According to the present invention, along the extended cable portion of element installation portion screen is set from multilayer, because this screen has formed compliance favorable conductive layer on basilar memebrane, can provide the compliance that makes cable portion the further hybrid multilayer circuit board that improves.
Description of drawings
Fig. 1 is the longitudinal section of the expression embodiment of the invention 1.
Fig. 2 A to Fig. 2 C is the key diagram of the manufacturing process of the embodiment of the invention 1.
Fig. 3 is the longitudinal section of the expression embodiment of the invention 2.
Fig. 4 A to Fig. 4 C is the key diagram of the manufacturing process of the embodiment of the invention 2.
Fig. 5 A, Fig. 5 B are the key diagrams of the manufacturing process of the embodiment of the invention 3.
Fig. 6 is the key diagram of the problem that exists in the conventional method of expression.
Description of reference numerals
A element installation portion; The b cable portion; 1 internal layer flexible electric circuit board; 11 dielectric base; 12 internal layer circuits; 13 cover layers; 2 adhesivess; 3 outer circuit plates; 31 dielectric base; 32 outer circuits; 33 solder masks; 34 thin metal layers; 5 resistance coating; 4 screens.
Embodiment
Below, describe with regard to embodiments of the present invention with reference to accompanying drawing.
Fig. 1 represents the vertical section structure of the embodiment of the invention 1.Among this embodiment 1, the single face flexible electric circuit board 1 that constitutes internal layer and cable portion is 2 layers, and the outer circuit plate 3 that the metal foil laminated body of film substrate constitutes forms in the outside, has 4 laminar substrates, the structure that element installation portion a is connected by cable portion b each other.This structure forms by operation shown in Figure 2 described later.
As shown in Figure 1, extend the dielectric base 31 of the cladding material that does not have metal forming and, then produce step hardly from element installation portion a if be arranged to the structure that element installation portion a connects each other.Thereby, the paint film of screen can be formed with more impartial thickness during with silk screen print method printing conductive coating, thereby the problem of the step A in the conventional art shown in Figure 6 can be solved.
Here, in fact, form outer coating with megohmite insulant, but omit at Fig. 1, Fig. 3 and its diagram of Fig. 6 in the more lateral of conductive coating paint 4.
Fig. 2 A to Fig. 2 C is the key diagram of the manufacture method of expression embodiment shown in Figure 1.
[1] at first, shown in Fig. 2 A, after being pre-formed circuit, use on the single face at least of cover layer 13 with the flexible electric circuit board 1 of circuit 12 coverings, via adhesives 2 stacked cladding materials 3.
[2] then, shown in Fig. 2 B, carry out the formation of through hole and the formation of outer circuit 32.When forming this circuit, metal forming via the cable portion b of the stacked metal foil laminated body 3 of film substrate of adhesives 2 is also removed in the lump, make not this metal forming and only have the cladding material of dielectric base 31 to extend thereby form, the structure that element installation portion a is connected each other.
[3] for another example shown in Fig. 2 C, at the surface of element installation portion a formation solder mask 33.Fig. 2 C represents this state.Afterwards, on the outer circuit 32a that is connected with conductive layer, do not form solder mask and the surface is firstly appeared out from advance.
[4] below, above-mentioned do not have circuit and only have the cladding material of dielectric base 31 to extend, on the structure that element installation portion a is connected each other,, obtain the structure of Fig. 1 making with silk screen print method printing conductive coating.
In the structure shown in Figure 1, do not have the dielectric base 31 of the cladding material of metal forming independently to exist across the space, therefore can not become the reason that hinders compliance with the single face flexible electric circuit board 1 that constitutes cable portion from element installation portion a is extended.But, preferably have and the single face flexible electric circuit board 1 equal above flexural property that constitutes cable portion.
At this moment, in case metal forming is removed and form conductive layers from the metal foil laminated body of film substrate with conductive coating paint 4, residual with the metal forming of the metal foil laminated body of film substrate and compare as the situation of conductive layer, compliance is improved.
In addition, also be the structure that does not produce step during with silk screen print method printing conductive coating, therefore, can be with the paint film of more impartial thickness formation as screen.Thereby, can prevent aforesaid unfavorable condition, promptly skim over or chap poor flow takes place because of paint film, lose the effect of electromagnetic shielding.
In addition, in the structure of Fig. 1, with screen be that the part 32a that is connected of conductive coating paint 4 go up to realize, but also can adopt as shown in Figure 3, after forming non-through hole 32b, realize the structure that is connected with lower floor.
In the structure of Fig. 1, solder mask 33 is set in addition on the element installation portion, still,, on the whole surface of this outer coating, does insulation and cover if not special the obstruction then can be omitted solder mask 33.
Fig. 4 A to Fig. 4 C represents the manufacturing process of the embodiment of the invention 2.Among this embodiment 2, adopt the semi-additive process manufacturing.At first,, use then and hinder coating formation mask pattern, after electroplating the formation circuit, carry out not want the operation that conduction handling part is partly removed in the substrate surface conduction processing of insulating properties.
In this conductionization handling part, will be residual across the part of the self-existent cladding material in space directly over cable portion, thus formation conductive layer as thin as a wafer.Conductive layer by thin can make compliance improve.
As can be used in conduction processing of the present invention, unwanted that part of conduction handling part can be removed, and not need tolerance electroplating bath.Best, adopt the material identical with circuit, in general, can adopt the metallic copper that uses in the circuit to constitute.Can recommend to adopt for example sputter copper or non-cathode copper plating etc.
Carry out the formation of circuit with semi-additive process, adopt following operation.With reference to Fig. 4 A to Fig. 4 C this operation is described.
[1] at first, shown in Fig. 4 A, on the single face at least of the flexible electric circuit board 1 that is pre-formed circuit and circuit 12 is covered, the cladding material 31 that one deck insulating properties film constitutes is set with adhesives 2 with cover layer 13.
[2] then, shown in Fig. 4 B, form the thin metal layer 34 of 0.1～1.0 μ m degree on the whole surface of substrate that in [1], forms with sputter or electroless plating, form mask pattern with resist 35 with plating.
[3] then, shown in Fig. 4 C, form circuit pattern 32, resist 35 is peeled off, removed with galvanoplastic.
By fast-etching the not part of metal level 34 removed [4] thereafter.At this moment, only also remove simultaneously by the metal level 34 at the position cladding material 13 that constitutes with adhesives 2 bonding insulating barriers, that element installation portion a is connected each other, the cladding material 31 that does not have circuit is extended, form the structure that element installation portion a is connected each other.
At this moment, the roughly the same structure of mechanism shown in Fig. 2 B of formation and embodiment 1.Then, identical with embodiment 1, form solder mask 33, extend the cladding material 31 of no metal level, be arranged to the mutual structure that connects with element installation portion a, on this structure,, obtain structure same as shown in Figure 1 with silk screen print method printing conductive coating 4.Particularly unobstructive words can be omitted solder mask 33, at the whole surface coverage insulating barrier of this outer coating, as embodiment 1.
Fig. 5 A, Fig. 5 B are the expression embodiment of the invention 3, and this example is the variation of embodiment 2.In this example, the metal level 34 at the position that the element installation portion a with cladding material 13 among the embodiment 2 connects each other is not etched, forms the screen of the thin metal layer formation of 0.1～1.0 μ m degree.
In other words, behind the state that forms Fig. 4 C, the part B of Fig. 5 A is carried out fast-etching after with coverings such as cover layers in the operation of embodiment 2.The screen here can form to such an extent that be thinned to for example incomparable degree of screen shown in the patent documentation 8, thus the screen that can obtain having good submissive performance.
Then, be identically formed solder mask 33, form outer coating 33a, obtain the structure shown in Fig. 5 B at the part B of Fig. 5 A with embodiment 1.Particularly, do not hinder and solder mask 33 can be omitted if having, also can be identical with embodiment 1, use outer coating 33a with the whole covering in surface.
As can be used for conductive coating paint of the present invention, be not particularly limited, the good material of every compliance gets final product, and for example can use the coating of silver paste, copper cream, paste soldering material etc.
In addition, also can replace conductive coating paint and use and wherein scattered magnetic screen and form magnetic masking layer with the magnetic screen coating of metal dust.Certainly, these two kinds of coating all can form electromagnetism or magnetic screen by printing.
Claims (6)
1. at least 1 layer of hybrid multilayer circuit board that extends at least 1 cable portion except that outermost layer from the element installation portion of multilayer, wherein, described outermost layer is to be made of at the basilar memebrane of the layer of the outermost of the element installation portion of multilayer and the circuit layer that is formed on the described basilar memebrane lamination, it is characterized in that:
Described hybrid multilayer circuit board is provided with screen to electromagnetic interference at the outside left of described cable portion,
Described screen has conductive layer,
Wherein, described conductive layer is formed on the basilar memebrane that has with described outermost circuit layer in the described element installation portion and by the cover layer that carries out insulation protection and is covered,
On the position corresponding to described cable portion of the described basilar memebrane that is formed with described screen, and described screen is set between the described cable portion with having the space.
2. the described hybrid multilayer circuit board of claim 1 is characterized in that:
Described conductive layer forms with conductive coating paint.
3. the described hybrid multilayer circuit board of claim 1 is characterized in that:
Described conductive layer forms with film metal.
4. the manufacture method of a hybrid multilayer circuit board, wherein: the layer except that outermost layer from the element installation portion of the multilayer of this hybrid multilayer circuit board extends at least 1 cable portion, the outside left of described hybrid multilayer circuit board is provided with the screen to electromagnetic interference, in described outermost layer,, it is characterized in that comprising following operation 0 corresponding to being free unoccupied place that described screen is set between the position of described cable portion and the described cable portion) to 5):
0) on the single face at least of the inner layer circuit board that is pre-formed the covering of circuit and described circuit lining cap rock, the adhesives of having removed with described cable portion joining part is set;
1) by described adhesives, the bonding cladding material that constitutes by the metal foil laminated body of film substrate;
2) at described element installation portion at least one side in through hole and the non-through hole is set,, described inner layer circuit board and described cladding material is electrically connected by plating precipitating metal in described hole;
3) on the metal forming of described cladding material, form circuit with the method for removing, and will only be the structure of film thereby form removing with metal forming from the described cladding material of the corresponding position of the extended described cable portion of described element installation portion;
4), form the conductive coating paint of described screen with the silk screen print method printing in position corresponding to the described film of described cable portion; And
5) form the insulation tunicle that described conductive coating paint is covered.
5. the manufacture method of a hybrid multilayer circuit board, wherein: the layer from the element installation portion of the multilayer of this hybrid multilayer circuit board except that outermost layer extends at least 1 cable portion, the outside left of described hybrid multilayer circuit board is provided with the screen to electromagnetic interference, in described outermost layer,, it is characterized in that comprising following operation 0 corresponding to being free unoccupied place that described screen is set between the position of described cable portion and the described cable portion) to 8):
0) on the single face at least of the inner layer circuit board that is pre-formed the covering of circuit and described circuit lining cap rock, the adhesives of having removed with described cable portion joining part is set;
1) by described adhesives adhering film;
2) at least one side in through hole and the non-through hole is set on described element installation portion;
3) be formed for forming the thin film metal layer of described screen on the surface of described film with the film forming method;
4) on described thin film metal layer, form the resistance coating develop to desired circuit pattern, and on corresponding to the position of described cable portion residual in advance resistance coating;
5) utilize described resistance coating to electroplate and form circuit;
6) on the position corresponding, form corrosion preventing layer with the described cable portion of described thin film metal layer;
7) utilize described corrosion preventing layer that described thin film metal layer is carried out etch processes, will not want part and remove and form outer field circuit pattern; And
8) on the position corresponding, form the insulation tunicle with the described cable portion of described thin film metal layer.
6. the manufacture method of a hybrid multilayer circuit board, wherein: the layer from the element installation portion of the multilayer of this hybrid multilayer circuit board except that outermost layer extends at least 1 cable portion, the outside left of described hybrid multilayer circuit board is provided with the screen to electromagnetic interference, in described outermost layer,, it is characterized in that comprising following operation 0 corresponding to being free unoccupied place that described screen is set between the position of described cable portion and the described cable portion) to 9):
0) on the single face at least of the inner layer circuit board that is pre-formed the covering of circuit and described circuit lining cap rock, is provided with and removed the adhesives of the part of joining with cable portion;
1) by described adhesives adhering film;
2) at described element installation portion at least one side in through hole and the non-through hole is set;
3) form thin film metal layer with the film forming method on the surface of described film;
4) on described thin film metal layer, form the resistance coating develop to desired circuit pattern, and on position corresponding to described cable portion residual resistance coating;
5) utilize described resistance coating to electroplate and form circuit;
6) on the position corresponding, form corrosion preventing layer with the described cable portion of described thin film metal layer;
7) utilize described corrosion preventing layer that described thin film metal layer is carried out etch processes and form outer field circuit pattern;
8) on the position corresponding, form the conductive coating paint of described screen with the silk screen print method printing with the described cable portion of described thin film metal layer; And
9) form the insulation tunicle that described conductive coating paint is covered.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-320936 | 2005-11-04 | ||
| JP2005320936A JP4808468B2 (en) | 2005-11-04 | 2005-11-04 | Hybrid multilayer circuit board and manufacturing method thereof |
| JP2005320936 | 2005-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1960597A CN1960597A (en) | 2007-05-09 |
| CN1960597B true CN1960597B (en) | 2010-10-06 |
Family
ID=38072028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101445686A Expired - Fee Related CN1960597B (en) | 2005-11-04 | 2006-11-03 | Hybrid multilayer circuit board and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4808468B2 (en) |
| CN (1) | CN1960597B (en) |
| TW (1) | TW200740331A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4898564B2 (en) * | 2007-06-06 | 2012-03-14 | ソニーケミカル＆インフォメーションデバイス株式会社 | Printed wiring board manufacturing method and printed wiring board manufacturing apparatus |
| KR101385094B1 (en) * | 2007-09-11 | 2014-04-14 | 삼성디스플레이 주식회사 | Printed circuit board, display apparatus having the same and method of manufacturing the printed circuit board |
| JP5075568B2 (en) * | 2007-10-17 | 2012-11-21 | 株式会社フジクラ | Shielded circuit wiring board and method for manufacturing the same |
| WO2009119027A1 (en) * | 2008-03-25 | 2009-10-01 | 住友ベークライト株式会社 | Method for producing rigid-flex circuit board, and rigid-flex circuit board |
| JP2009267081A (en) * | 2008-04-25 | 2009-11-12 | Sony Chemical & Information Device Corp | Flex-rigid wiring board and method of manufacturing the same |
| TW201127246A (en) | 2010-01-22 | 2011-08-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
| JP2012209383A (en) * | 2011-03-29 | 2012-10-25 | Murata Mfg Co Ltd | Multilayer substrate and method of manufacturing the same |
| TWI422291B (en) * | 2011-04-20 | 2014-01-01 | Adv Flexible Circuits Co Ltd | Multi-layer stacked circuit cable with local separation section |
| CN105682354A (en) * | 2016-02-25 | 2016-06-15 | 广东欧珀移动通信有限公司 | Flexible-rigid combined board and terminal |
| TWI660901B (en) * | 2018-09-04 | 2019-06-01 | Chipbond Technology Corporation | Flexible circuit tape |
| CN112449477B (en) * | 2019-08-27 | 2022-04-15 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
| KR20220099353A (en) * | 2021-01-06 | 2022-07-13 | 삼성전자주식회사 | Circuit board, and electronic device including the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0184472U (en) * | 1987-11-26 | 1989-06-05 | ||
| JPH04313300A (en) * | 1991-04-10 | 1992-11-05 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
| JP3176858B2 (en) * | 1996-12-11 | 2001-06-18 | 日本メクトロン株式会社 | Double-sided copper-clad printed wiring board |
| JP2001060746A (en) * | 1999-08-23 | 2001-03-06 | Fuji Electric Co Ltd | Flexible printed wiring board |
| JP2001167642A (en) * | 1999-12-13 | 2001-06-22 | Daichu Denshi Co Ltd | Flexible printed wiring board and flexible flat cable |
-
2005
- 2005-11-04 JP JP2005320936A patent/JP4808468B2/en active Active
-
2006
- 2006-09-15 TW TW095134345A patent/TW200740331A/en unknown
- 2006-11-03 CN CN2006101445686A patent/CN1960597B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4808468B2 (en) | 2011-11-02 |
| TW200740331A (en) | 2007-10-16 |
| JP2007129087A (en) | 2007-05-24 |
| CN1960597A (en) | 2007-05-09 |
| TWI377890B (en) | 2012-11-21 |
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