CN217116493U - Flexible circuit board, display module and electronic equipment - Google Patents

Abstract

The utility model provides a flexible circuit board, display module assembly and electronic equipment, include: a first circuit layer, a second circuit layer and a third circuit layer; a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer; a first circuit board, a second insulating layer, a third circuit board and a third insulating layer are sequentially stacked between the first insulating layer and the fourth insulating layer, and a ground plane is arranged in the no-wiring area on the surfaces of the first circuit layer and the third circuit layer. The utility model discloses a three-layer FPC design can shield and absorb the noise signal that probably looses outward in the FPC circuit to reduce the noise signal interference that the complete machine antenna received.

Description

Flexible circuit board, display module and electronic equipment

Technical Field

The utility model relates to a flexible circuit board technical field especially relates to a flexible circuit board, display module assembly and electronic equipment.

Background

The power supply circuit in the FPC wiring circuit of the display screen module is easy to externally disperse noise waves, so that the antenna signals of the whole machine are influenced, and the radio frequency effect of the whole machine is poor.

SUMMERY OF THE UTILITY MODEL

For solving the problem that exists among the prior art, the utility model provides a flexible circuit board reaches the noise signal that the shielding power cord scatters outward through designing three-layer FPC routing layer, optimizes complete machine radio frequency effect.

The utility model provides a following technical scheme:

a flexible circuit board comprising:

a first circuit layer, a second circuit layer and a third circuit layer;

a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer;

a first circuit board, a second insulating layer, a third circuit board and a third insulating layer are sequentially stacked between the first insulating layer and the fourth insulating layer, and a ground plane is arranged in the non-wiring area on the surfaces of the first circuit layer and the third circuit layer.

As a preferred technical scheme, the first circuit layer, the second circuit layer and the third circuit layer are all provided with metal wires.

Preferably, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer are PI insulating layers.

Preferably, the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer, the third insulating layer, the third circuit layer and the fourth insulating layer are sequentially stacked, and the optical cement is disposed between the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer, the third insulating layer, the third circuit layer and the fourth insulating layer.

Preferably, the first circuit layer, the second circuit layer and the third circuit layer are selectively conducted through the via holes.

The wireless power supply device comprises a power supply module, wherein the power supply module and the wireless module are electrically connected with the second circuit layer.

As a preferred technical solution, when the second circuit layer is crossed, the first circuit layer and the second circuit layer are electrically connected.

Preferably, the ground plane is a Gen routing plane.

The application also provides a display module, including as above arbitrary flexible circuit board.

The utility model discloses a beneficial effect that technical scheme can reach is three-layer FPC, mainly walks the line design in the intermediate level, outside, uses two-layer GND routing layer, can shield the noise signal that probably looses outward in the absorption FPC circuit, reduces the noise signal interference that the complete machine antenna received.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof of the present invention explain the present invention and do not form an improper limitation to the present invention. In the drawings:

fig. 1 is a schematic diagram of a flexible circuit board structure disclosed in embodiment 1 of the present invention;

description of reference numerals:

a first circuit layer 10; a second circuit layer 20; a third circuit layer 30; a first insulating layer 40; a second insulating layer 50; a third insulating layer 60; a fourth insulating layer 70.

Detailed Description

To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. In the description of the present invention, it is noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the insulated scope of the present invention.

Example 1

The present embodiment provides a flexible circuit board, according to fig. 1, comprising:

a first circuit layer 10, a second circuit layer 20, and a third circuit layer 30;

a first insulating layer 40, a second insulating layer 50, a third insulating layer 60, and a fourth insulating layer 70;

the first circuit board, the second insulating layer 50, the third circuit board and the third insulating layer 60 are sequentially stacked between the first insulating layer 40 and the fourth insulating layer 70, and a ground plane is arranged in the no-wiring area on the surfaces of the first circuit layer 10 and the third circuit layer 30.

FPC, english full-hybrid Printed Circuit, which herein means Flexible Printed wiring board, referred to as a Flexible board for short. The surface of flexible base material is made into conductor circuit pattern by means of optical imaging pattern transfer and etching process, the surface layer and internal layer of double-face and multi-layer circuit board are electrically communicated with internal layer and external layer by means of metallized hole, and the surface of circuit pattern is protected and insulated by means of PI and adhesive layer.

The insulating film forms the base layer of the circuit, and the adhesive bonds the copper foil to the insulating layer. In a multi-layer design, it is then bonded to the inner layer. They are also used as protective coverings to insulate the circuit from dust and moisture and to reduce stress during flexing, the copper foil forming the circuit layer.

The copper foil is suitable for use in flexible circuits and may be electrodeposited or plated. The electrodeposited copper foil has a glossy surface on one side and a dull matte surface on the other side. It is a flexible material that can be made in a wide variety of thicknesses and widths, and the matte side of the ED copper foil is often specially treated to improve its adhesion. The wrought copper foil has the characteristics of hardness and smoothness in addition to flexibility.

In addition to the adhesive used to bond the insulating film to the conductive material, it can also be used as a cover coat, as a protective coating, and as a covering coating. The main difference between the two is the application used, and the cover layer is adhered to the cover insulating film to form a circuit with a laminated structure. The adhesive is applied by screen printing.

Preferably, the first circuit layer 10, the second circuit layer 20 and the third circuit layer 30 are all provided with metal traces.

Preferably, the first insulating layer 40, the second insulating layer 50, the third insulating layer 60, and the fourth insulating layer 70 are PI insulating layers.

Preferably, the first insulating layer 40, the first circuit layer 10, the second insulating layer 50, the second circuit layer 20, the third insulating layer 60, the third circuit layer 30, and the fourth insulating layer 70 are laminated in this order with an adhesive interposed therebetween.

Preferably, the first circuit layer 10, the second circuit layer 20 and the third circuit layer 30 are selectively connected through vias.

Preferably, a power supply module is included, and both the power supply module and the wireless module are electrically connected to the second circuit layer 20.

Preferably, when the second circuit layer 20 is crossed, the first circuit layer 10 and the second circuit layer 20 are electrically connected.

Preferably, the ground plane is a Gen routing plane.

The FPC of the display screen module adopts a three-layer wiring layer design. Insulation PI protection is arranged between the FPC wiring layers and on the surface of the FPC. The communication and power between the display screen module and the whole machine are connected through an FPC (flexible printed circuit) circuit, and the communication and power circuit adopts an FPC middle metal wiring layer to carry out wiring design. The first circuit layer 10 and the second circuit layer 20, when the second circuit layer 20 can not complete the wiring by the wiring intersection, the two layers are connected by punching. The two metal routing layers are only used for assisting in routing design, and the Gen routing layers are fully paved in large-area non-routing areas due to the two outer metal routing layers.

Example 2

The embodiment provides a display module, which comprises the flexible circuit board described in embodiment 1.

The present embodiment provides an electronic device including the flexible circuit board described in embodiment 1.

The scheme of the three-layer FPC in the embodiment 1 is adopted by the flexible circuit board in the display module and the electronic equipment, noise signals which are possibly scattered outside in an FPC circuit can be better shielded and absorbed, and noise signal interference on the antenna of the whole machine is reduced.

The flexible circuit board, the display module and the electronic device according to the embodiment of the present application are described in detail, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A flexible circuit board, comprising:

a first circuit layer, a second circuit layer and a third circuit layer;

a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer;

a first circuit board, a second insulating layer, a third circuit board and a third insulating layer are sequentially stacked between the first insulating layer and the fourth insulating layer, and a ground plane is arranged in the no-wiring area on the surfaces of the first circuit layer and the third circuit layer.

2. The flexible circuit board of claim 1, wherein the first circuit layer, the second circuit layer and the third circuit layer are provided with metal traces.

3. The flexible circuit board of claim 1, wherein the first, second, third, and fourth insulating layers are PI insulating layers.

4. The flexible circuit board of claim 1, wherein the first insulating layer, the first circuit layer, the second insulating layer, the second circuit layer, the third insulating layer, the third circuit layer and the fourth insulating layer are sequentially stacked with an optical adhesive disposed therebetween.

5. The flexible circuit board of claim 1, wherein the first circuit layer, the second circuit layer and the third circuit layer are selectively connected by vias.

6. The flexible circuit board of claim 1, comprising a power module, wherein the power module and the wireless module are both electrically connected to the second circuit layer.

7. The flexible circuit board of claim 1, wherein the first circuit layer and the second circuit layer are electrically connected when the second circuit layer traces cross.

8. The flexible circuit board of claim 1, wherein the ground plane is a Gen routing plane.

9. A display module comprising the flexible circuit board of any one of claims 1-8.

10. An electronic device characterized by comprising the flexible circuit board according to any one of claims 1 to 8.

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